Uncooled Infrared Imaging Arrays And Systems PDF Download

The development of high performance monolithic pyroelectric IR detectors requires ferroelectric films of high responsivity and high thermal isolation of self-supporting micromachined structures. In the DARPA-supported IR detector materials program, the ultimate goal is to demonstrate film properties that project to a system-level f/1 NETD of 10 mK for 48.5 micrometers-pixels. This paper will delineate materials and processes engineered towards that objective. Films investigated in this program have been from the PLZT solid solution system. A sub-class of materials within this system, substituted with specific isovalent and donor elements, shows low projected NETDs, the lowest being 13.8 mK for planar wafers. In general, addition of rare earth dopants has the dual effect of lowering the NETD and enhancing dc film resistivity (10 (exp 12)-10(exp 14) Ohms-cm) over 1-10 V. Room temperature film resistivity has been found to increase up to 10(exp 15) Ohms-cm with a film thickness of 960 nm. Processing studies indicate a general correlation among pyrolysis protocols, severity of RTA thermal budget and electrical performance. Furthermore, at film thicknesses of 150-350 nm, properties of films fabricated with a dilute precursor solution project thickness-modified NETDs lower than films with solution of higher molarity. Microstructural examination of rapid thermally annealed films, through transmission electron microscopy, reveal dense grains 36-43 nm in diameter with no evidence of second phase in the matrix or grain boundaries.