ULSI Process Integration 7
| Author | : C. Claeys |
| Publisher | : The Electrochemical Society |
| Total Pages | : 429 |
| Release | : 2011 |
| Genre | : |
| ISBN | : 1607682613 |
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ULSI Process Integration 7
| Author | : Electrochemical Society (United States). Electronics and Photonics Division |
| Publisher | : ECS Transactions |
| Total Pages | : 417 |
| Release | : 2011-10 |
| Genre | : |
| ISBN | : 9781566779074 |
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The proceedings of the Seventh symposium on ULSI Process Integration discusses all aspects of process integration. Covered areas include device technologies, 3D integration schemes, memory technologies, gate dielectrics, source-drain engineering, rapid thermal annealing, CMP issues, barrier materials and copper interconnects, multilevel integration structures, packaging concepts for TSV based technologies and SIPs, Ge and III-V technologies, novel memory elements, emerging devices, carbon naotubes, spintronics and polymer electronics.
ULSI Process Integration
| Author | : Cor L. Claeys |
| Publisher | : The Electrochemical Society |
| Total Pages | : 408 |
| Release | : 1999 |
| Genre | : Computers |
| ISBN | : 9781566772419 |
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ULSI Process Integration 6
| Author | : C. Claeys |
| Publisher | : The Electrochemical Society |
| Total Pages | : 547 |
| Release | : 2009-09 |
| Genre | : Integrated circuits |
| ISBN | : 1566777445 |
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ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
ULSI Process Integration III
| Author | : Electrochemical Society. Meeting |
| Publisher | : The Electrochemical Society |
| Total Pages | : 620 |
| Release | : 2003 |
| Genre | : Technology & Engineering |
| ISBN | : 9781566773768 |
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ULSI Process Integration 5
| Author | : Cor L. Claeys |
| Publisher | : The Electrochemical Society |
| Total Pages | : 509 |
| Release | : 2007 |
| Genre | : Integrated circuits |
| ISBN | : 1566775728 |
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The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
ULSI Process Integration 9
| Author | : C. Claeys |
| Publisher | : The Electrochemical Society |
| Total Pages | : 335 |
| Release | : 2015 |
| Genre | : |
| ISBN | : 1607686759 |
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ULSI Science and Technology, 1989
| Author | : C. M. Osburn |
| Publisher | : |
| Total Pages | : 804 |
| Release | : 1989 |
| Genre | : Integrated circuits |
| ISBN | : |
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SiGe, Ge, and Related Compounds 6: Materials, Processing, and Devices
| Author | : D. Harame |
| Publisher | : The Electrochemical Society |
| Total Pages | : 1042 |
| Release | : |
| Genre | : |
| ISBN | : 1607685434 |
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SiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices
| Author | : D. Harame |
| Publisher | : The Electrochemical Society |
| Total Pages | : 1066 |
| Release | : 2010-10 |
| Genre | : Science |
| ISBN | : 1566778255 |
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Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds has become a key component in the arsenal in improving semiconductor performance. This symposium discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.
