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| Author | : Y. Zhuang |
| Publisher | : |
| Total Pages | : |
| Release | : 2004 |
| Genre | : Chemical engineering |
| ISBN | : |
| Author | : Veera Raghava R. Kakireddy |
| Publisher | : |
| Total Pages | : |
| Release | : 2007 |
| Genre | : |
| ISBN | : |
ABSTRACT: The effects of different process parameters on tribology and surface defects were studied till date, but there has been a very minimal study to understand the effect of slurry temperature during Copper Chemical Mechanical Polishing (CMP). The surface defects such as dishing, erosion and metal loss amount for more than 50% of the defects that hamper the device yield and mainly the electrical properties during the manufacturing process. In this research, the effect of slurry temperature on tribology, surface defects and electrical properties during copper CMP employing different pad materials and slurries has been explored. Experiments were conducted at different slurry temperatures maintaining all the other process parameters constant. Post polished copper samples were analyzed for their dishing and metal loss characteristics. From the results, it was seen that the coefficient of friction and removal rate increased with increase in slurry temperature during polishing with both types of polishing pads. This increase in removal rate is attributed to a combined effect of change in pad mechanical properties and chemical reaction kinetics. The experimental data indicated that the increase in slurry temperature results in an increase in amounts of metal dishing and copper metal loss for one type of slurry and defects decrease with increase in slurry temperature for other type of slurry. This phenomenon indicates the effect of temperature on chemical reaction kinetics and its influence on defect generation. This can be attributed due to the change in pad asperities due to change in pad mechanical properties and chemical kinetics with change in slurry temperature. The slurry temperature has an effect not only on the surface defects and tribology but also on the change in pad mechanical properties. The copper thin films peeled off at higher polishing temperatures, leading to adhesion failure. With increase in temperature the copper crystallinity, hardness and modulus increased. Further with increase in the defects the electrical properties of the devices also degraded drastically and even failed to operate at higher levels of dishing and metal loss. This research is aimed at understanding the physics governing the defect generation during CMP.
| Author | : Kenneth C Ludema |
| Publisher | : CRC Press |
| Total Pages | : 309 |
| Release | : 2018-09-14 |
| Genre | : Science |
| ISBN | : 0429815905 |
The second edition of a bestseller, this book introduces tribology in a way that builds students’ knowledge and understanding. It includes expanded information on topics such as surface characterization as well as recent advances in the field. The book provides additional descriptions of common testing methods, including diagrams and surface texturing for enhanced lubrication, and more information on rolling element bearings. It also explores surface profile characterization and elastic plastic contact mechanics including wavy surface contact, rough surface contact models, friction and wear plowing models, and thermodynamic analysis of friction.
| Author | : Babu Suryadevara |
| Publisher | : Woodhead Publishing |
| Total Pages | : 650 |
| Release | : 2021-09-10 |
| Genre | : Technology & Engineering |
| ISBN | : 0128218193 |
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP
| Author | : Reza Ghodssi |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 1211 |
| Release | : 2011-03-18 |
| Genre | : Technology & Engineering |
| ISBN | : 0387473181 |
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
| Author | : Eugenio Iannone |
| Publisher | : CRC Press |
| Total Pages | : 1178 |
| Release | : 2018-09-03 |
| Genre | : Medical |
| ISBN | : 1466560738 |
Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.
| Author | : M.R. Oliver |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 444 |
| Release | : 2004-01-26 |
| Genre | : Technology & Engineering |
| ISBN | : 9783540431817 |
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
| Author | : Shijie Wang |
| Publisher | : Springer |
| Total Pages | : 549 |
| Release | : 2017-02-07 |
| Genre | : Technology & Engineering |
| ISBN | : 3319510916 |
This collection offers new research findings, innovations, and industrial technological developments in extractive metallurgy, energy and environment, and materials processing. Technical topics included in the book are thermodynamics and kinetics of metallurgical reactions, electrochemical processing of materials, plasma processing of materials, composite materials, ionic liquids, thermal energy storage, energy efficient and environmental cleaner technologies and process modeling. These topics are of interest not only to traditional base ferrous and non-ferrous metal industrial processes but also to new and upcoming technologies, and they play important roles in industrial growth and economy worldwide.
| Author | : D. Dowson |
| Publisher | : |
| Total Pages | : 712 |
| Release | : 1978 |
| Genre | : Tribology |
| ISBN | : |
| Author | : Joseph M. Steigerwald |
| Publisher | : John Wiley & Sons |
| Total Pages | : 337 |
| Release | : 2008-09-26 |
| Genre | : Science |
| ISBN | : 3527617752 |
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
