The Surface And Through Crack Problems In Layered Orthotropic Plates PDF Download

An analytical method is developed for a relatively accurate calculation of Stress Intensity Factors in a laminated orthotropic plate containing a through or part-through crack. The laminated plate is assumed to be under bending or membrane loading and the mode 1 problem is considered. First three transverse shear deformation plate theories (Mindlin's displacement based first-order theory, Reissner's stress-based first-order theory, and a simple-higher order theory due to Reddy) are reviewed and examined for homogeneous, laminated and heterogeneous orthotropic plates. Based on a general linear laminated plate theory, a method by which the stress intensity factors can be obtained in orthotropic laminated and heterogeneous plates with a through crack is developed. Examples are given for both symmetrically and unsymmetrically laminated plates and the effects of various material properties on the stress intensity factors are studied. In order to implement the line-spring model which is used later to study the surface crack problem, the corresponding plane elasticity problem of a two-bonded orthotropic plated containing a crack perpendicular to the interface is also considered. Three different crack profiles: an internal crack, an edge crack, and a crack terminating at the interface are considered. The effect of the different material combinations, geometries, and material orthotropy on the stress intensity factors and on the power of stress singularity for a crack terminating at the interface is fully examined. The Line Spring model of Rice and Levy is used for the part-through crack problem. The surface crack is assumed to lie in one of the two-layered laminated orthotropic plates due to the limitation of the available plane strain results. All problems considered are of the mixed boundary value type and are reduced to Cauchy type of singular integral equations which are then solved numerically. Erdogan, Fazil and Wu, Binghua Unspecified Center NASA-CR-188188, NAS 1.26: ..