Testing Reliability And Application Of Micro And Nano Material Systems Ii PDF Download

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Testing, Reliability, and Application of Micro- and Nano-material Systems II

Testing, Reliability, and Application of Micro- and Nano-material Systems II
Author: Norbert Meyendorf
Publisher: Society of Photo Optical
Total Pages: 272
Release: 2004-01
Genre: Technology & Engineering
ISBN: 9780819453099

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Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.


Testing, Reliability, and Application of Micro- and Nano-material Systems IV

Testing, Reliability, and Application of Micro- and Nano-material Systems IV
Author: Robert E. Geer
Publisher: SPIE-International Society for Optical Engineering
Total Pages: 96
Release: 2006
Genre: Technology & Engineering
ISBN: 9780819462282

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Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.


MEMS Reliability

MEMS Reliability
Author: Allyson L. Hartzell
Publisher: Springer Science & Business Media
Total Pages: 300
Release: 2010-11-02
Genre: Technology & Engineering
ISBN: 144196018X

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The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.


Component Reliability for Electronic Systems

Component Reliability for Electronic Systems
Author: Titu I. Băjenescu
Publisher: Artech House
Total Pages: 706
Release: 2010
Genre: Technology & Engineering
ISBN: 1596934360

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The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.


Microsystems Dynamics

Microsystems Dynamics
Author: Vytautas Ostasevicius
Publisher: Springer Science & Business Media
Total Pages: 222
Release: 2010-11-01
Genre: Technology & Engineering
ISBN: 9048197015

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In recent years microelectromechanical systems (MEMS) have emerged as a new technology with enormous application potential. MEMS manufacturing techniques are essentially the same as those used in the semiconductor industry, therefore they can be produced in large quantities at low cost. The added benefits of lightweight, miniature size and low energy consumption make MEMS commercialization very attractive. Modeling and simulation is an indispensable tool in the process of studying these new dynamic phenomena, development of new microdevices and improvement of the existing designs. MEMS technology is inherently multidisciplinary since operation of microdevices involves interaction of several energy domains of different physical nature, for example, mechanical, fluidic and electric forces. Dynamic behavior of contact-type electrostatic microactuators, such as a microswitches, is determined by nonlinear fluidic-structural, electrostatic-structural and vibro-impact interactions. The latter is particularly important: Therefore it is crucial to develop accurate computational models for numerical analysis of the aforementioned interactions in order to better understand coupled-field effects, study important system dynamic characteristics and thereby formulate guidelines for the development of more reliable microdevices with enhanced performance, reliability and functionality.