Techniques For The Control Of Integrated Circuit Quality And Reliability PDF Download
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Author | : Erwin A. Herr |
Publisher | : |
Total Pages | : 332 |
Release | : 1967 |
Genre | : |
ISBN | : |
Download Techniques for the Control of Integrated Circuit Quality and Reliability Book in PDF, ePub and Kindle
The use of the test pattern concept, TEG, for in-process quality control and device reliability of integrated circuits was investigated during the fabrication and reliability testing phases of integrated circuit production. The Test Element Group (TEG), which was diffused on the wafer at the same time as the elements of the integrated circuit, proved to be a very successful vehicle for achieving the goals of this program. The TEG was made up of a number of selected elements in the integrated circuit diffusion pattern, metallized and connected for test evaluation as discrete components. The relationship was investigated between in-process variables of semi-conductor fabrication, pre-stress characteristics of TEGS and integrated circuits and the post-stress characteristics of TEGS and integrated circuits. The basic purpose of this program has been met.
Author | : Erwin A. Herr |
Publisher | : |
Total Pages | : 317 |
Release | : 1967 |
Genre | : |
ISBN | : |
Download Techniques for the Control of Integrated Circuit Quality and Reliability Volume Ii - Appendices Book in PDF, ePub and Kindle
This is a program directed to establish techniques for the control of integrated circuit quality and reliability. The primary objective of this program was to investigate a method to monitor integrated circuit fabrication which would provide information about the quality and reliability of the device. The use of the test pattern concept, TEG, for in-process quality control and device reliability of integrated circuits was investigated during the fabrication and reliability testing phases of integrated circuit production. The Test Element Group (TEG), which was diffused on the wafer at the same time as the elements of the integrated circuit, proved to be a very successful vehicle for achieving the goals of this program. The TEG was made up of a number of selected elements in the integrated circuit diffusion pattern, metallized and connected for test evaluation as discrete components. The relationship was investigated between in-process variables of semiconductor fabrication, pre-stress characteristics of TEGS and integrated circuits and the post-stress characteristics of TEGS and integrated circuits.
Author | : Eugene R. Hnatek |
Publisher | : |
Total Pages | : 736 |
Release | : 1987 |
Genre | : Technology & Engineering |
ISBN | : |
Download Integrated Circuit Quality and Reliability Book in PDF, ePub and Kindle
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
Author | : Eugene R. Hnatek |
Publisher | : CRC Press |
Total Pages | : 809 |
Release | : 2018-10-03 |
Genre | : Technology & Engineering |
ISBN | : 1482277719 |
Download Integrated Circuit Quality and Reliability Book in PDF, ePub and Kindle
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
Author | : Robert Zorich |
Publisher | : Academic Press |
Total Pages | : 604 |
Release | : 2012-12-02 |
Genre | : Technology & Engineering |
ISBN | : 0323140556 |
Download Handbook of Quality Integrated Circuit Manufacturing Book in PDF, ePub and Kindle
Here is a comprehensive practical guide to entire wafer fabrication process from A to Z. Written by a practicing process engineer with years of experience, this book provides a thorough introduction to the complex field of IC manufacturing, including wafer area layout and design, yield optimization, just-in-time management systems, statistical quality control, fabrication equipment and its setup, and cleanroom techniques. In addition, it contains a wealth of information on common process problems: How to detect them, how to confirm them, and how to solve them. Whether you are a new enginner or technician just entering the field, a fabrication manager looking for ways to improve quality and production, or someone who would just like to know more about IC manufacturing, this is the book you're looking for. Provides a readable, practical overview of the entire wafer fabrication process for new engineers and those just entering this complex field Enables engineers and managers to improve production, raise quality levels, and solve problems that commonly occur in the fabrication process Presents the latest techniques and gives special attention to Japanese IC manufacturing techniques, showing how they obtain outstanding quality
Author | : |
Publisher | : |
Total Pages | : 912 |
Release | : |
Genre | : Science |
ISBN | : |
Download Technical Abstract Bulletin Book in PDF, ePub and Kindle
Author | : Alan Bimson |
Publisher | : |
Total Pages | : 20 |
Release | : 1974 |
Genre | : Electronic apparatus and appliances |
ISBN | : 9780905066011 |
Download Modern Techniques in Quality Control of Plastic Encapsulated Integrated Circuits for High Reliability Application Book in PDF, ePub and Kindle
Author | : Michael Pecht |
Publisher | : CRC Press |
Total Pages | : 224 |
Release | : 2017-11-22 |
Genre | : Technology & Engineering |
ISBN | : 1351443577 |
Download Guidebook for Managing Silicon Chip Reliability Book in PDF, ePub and Kindle
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Author | : Arman Vassighi |
Publisher | : Springer Science & Business Media |
Total Pages | : 188 |
Release | : 2006-06-01 |
Genre | : Technology & Engineering |
ISBN | : 0387297499 |
Download Thermal and Power Management of Integrated Circuits Book in PDF, ePub and Kindle
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Author | : G. H. Tully |
Publisher | : |
Total Pages | : 149 |
Release | : 1974 |
Genre | : |
ISBN | : |
Download Production Engineering Measure for Hybrid Integrated Circuits for Fuze Applications. Volume III. Quality Control Manual Book in PDF, ePub and Kindle
The manual outlines the methods and procedures of the Quality Assurance and Reliability (QAR) Department of the Sprauge Electric Company, Integrated Circuit Division, located at Worcester, Massachusetts. The manual describes the techniques used by the QAR Department to monitor product quality and reliability so the optimum product capability can be obtained. This manual was prepared to meet the requirements and intent of MIL-C-45662, MIL-I-45208, NASA Quality Publication NPC 200-3 and MIL-Q-9858A.