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Solder Materials

Solder Materials
Author: Kwang-lung Lin
Publisher: World Scientific
Total Pages: 388
Release: 2018-07-13
Genre: Technology & Engineering
ISBN: 9813238216

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This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.


Solder Joint Technology

Solder Joint Technology
Author: King-Ning Tu
Publisher: Springer Science & Business Media
Total Pages: 376
Release: 2007-07-27
Genre: Technology & Engineering
ISBN: 0387388923

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The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.


Solders and Soldering

Solders and Soldering
Author: Howard H. Manko
Publisher: McGraw-Hill Companies
Total Pages: 376
Release: 1979
Genre: Technology & Engineering
ISBN:

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Get the latest developments in solder technology You can't work in electronics without solder -- and you shouldn't work with solder without Solders and Soldering, Fourth Edition. Profusely illustrated, this book by the world's top solder educator has been the leader in its field for two decades. You'll learn 29 different methods for soldering and heating (for both automatic and manual procedures), and learn about the strengths and weaknesses of each method for varying applications. This up-to-date edition deals at length with modern cleaning materials and processes, emphasizing EPA and OSHA guidelines and regulations, and provides you with state-of-the-art techniques for soldering with miniaturized circuit boards.


Soldering

Soldering
Author: Mel Schwartz
Publisher: ASM International
Total Pages: 207
Release: 2014-03-01
Genre: Technology & Engineering
ISBN: 1627080589

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Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.


Solders and Soldering

Solders and Soldering
Author: Howard H. Manko
Publisher: McGraw Hill Professional
Total Pages: 546
Release: 2001-03-01
Genre: Technology & Engineering
ISBN: 9780071382960

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Get the latest developments in solder technology You can't work in electronics without solder -- and you shouldn’t work with solder without Solders and Soldering, Fourth Edition. Profusely illustrated, this book by the world's top solder educator has been the leader in its field for two decades. You’ll learn 29 different methods for soldering and heating (for both automatic and manual procedures), and learn about the strengths and weaknesses of each method for varying applications. This up-to-date edition deals at length with modern cleaning materials and processes, emphasizing EPA and OSHA guidelines and regulations, and provides you with state-of-the-art techniques for soldering with miniaturized circuit boards.


Lead-Free Solder Interconnect Reliability

Lead-Free Solder Interconnect Reliability
Author: Dongkai Shangguan
Publisher: ASM International
Total Pages: 292
Release: 2005
Genre: Technology & Engineering
ISBN: 161503093X

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A Guide to Lead-free Solders

A Guide to Lead-free Solders
Author: John W. Evans
Publisher: Springer Science & Business Media
Total Pages: 212
Release: 2007-01-05
Genre: Technology & Engineering
ISBN: 1846283108

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The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.


Principles of Soldering

Principles of Soldering
Author: Giles Humpston
Publisher: ASM International
Total Pages: 284
Release: 2004
Genre: Technology & Engineering
ISBN: 1615031707

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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Author: Karl J. Puttlitz
Publisher: CRC Press
Total Pages: 1044
Release: 2004-02-27
Genre: Technology & Engineering
ISBN: 082475249X

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This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.


Lead Free Solder

Lead Free Solder
Author: John Hock Lye Pang
Publisher: Springer Science & Business Media
Total Pages: 184
Release: 2011-10-15
Genre: Technology & Engineering
ISBN: 1461404630

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Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.