Requirements For Electronic Grade Solder Alloys And Fluxed And Non Fluxed Solid Solders For Electronic Soldering Applications Includes Amendments 1 And 2 Russian Language J Std 006b Ru PDF Download

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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Includes Amendments 1 and 2 ( Russian Language), J-STD-006B-RU

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Includes Amendments 1 and 2 ( Russian Language), J-STD-006B-RU
Author:
Publisher:
Total Pages:
Release: 2009-10
Genre:
ISBN: 9781611930191

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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Includes Amendments 1 and 2 (Chinese Language), J-STD-006B-CN

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Includes Amendments 1 and 2 (Chinese Language), J-STD-006B-CN
Author:
Publisher:
Total Pages:
Release: 2009-10
Genre:
ISBN: 9781611930054

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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-fluxed Solid Solders for Electronic Soldering Applications

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-fluxed Solid Solders for Electronic Soldering Applications
Author: IPC (Organization)
Publisher:
Total Pages: 22
Release: 2013
Genre: Solder and soldering
ISBN: 9781611931044

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"This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering applications; and for "special form" (see 1.2.3) electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32."--P. 1.


Requirements for Soldering Fluxes

Requirements for Soldering Fluxes
Author: Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)
Publisher:
Total Pages: 48
Release: 1995
Genre: Solder and soldering
ISBN:

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