Reliability Physics Analysis Of Electrical Electronic And Electromechanical Equipment Modules And Components PDF Download

Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Reliability Physics Analysis Of Electrical Electronic And Electromechanical Equipment Modules And Components PDF full book. Access full book title Reliability Physics Analysis Of Electrical Electronic And Electromechanical Equipment Modules And Components.

Reliability Physics Analysis of Electrical, Electronic, and Electromechanical Equipment, Modules and Components

Reliability Physics Analysis of Electrical, Electronic, and Electromechanical Equipment, Modules and Components
Author: Automotive Electronic Systems Reliability Standards
Publisher:
Total Pages: 0
Release: 2021
Genre:
ISBN:

Download Reliability Physics Analysis of Electrical, Electronic, and Electromechanical Equipment, Modules and Components Book in PDF, ePub and Kindle

This recommended practice has been developed for use in any EEE system used in the AADHP industries. RPA is especially important to AADHP systems, which are often safety critical applications that must operate for long times in rugged environments. These EEE systems often use EEE components that were originally designed and produced for more benign consumer applications.Although the focus of this recommended practice is on AADHP applications, the process described herein is not limited to AADHP and may be used for EEE systems and components in any industry. This recommended practice has been developed jointly by the SAE International Automotive Electronic Systems Reliability Standards Committee (AESRS) and the SAE Avionics Process Management Committee (APMC) to describe a standard process for reliability physics analysis (RPA) of electrical, electronic, and electromechanical (EEE) systems, equipment, sub-assemblies, modules, and components used in the aerospace, automotive, defense, and other high-performance (AADHP) industries.RPA is a science based, engineering discipline that augments classical reliability prediction methods that are based on part counting tabulation of averaged, historic failure rates of generic component categories.RPA combines failure mechanism models developed by physics-of-failure (PoF) research with lifetime load profiles to calculate durability life and likelihood of failure over time of specific designs incorporating various EEE parts, modules, or assemblies operating in specifics applications. RPA leverages knowledge of material properties and failure mechanisms to identify failure risks, predict reliability-durability, and improve design robustness through durability simulations and models executed in a computer-aided engineering (CAE) environment.RPA interacts with and augments traditional performance related EEE simulation methods, such as electrical, electromagnetic, thermal, and mechanical analysis. RPA uses the outputs of performance CAE tools to capture stresses due to usage conditions and environmental loads (e.g., shock, vibration, temperature, electric field, etc.) and uses this information to predict time to failure based on the material science principle of stress driven damage accumulation of materials for determining the rate and degree of damage accumulation over time or usage cycles.This document standardizes and defines RPA best practices and provides a clear process for exchanging RPA results up and down the supply chain. RPA results may be used for: 1Assessment of new component technology and packaging: Unlike traditional failure rate tabulations using handbooks of historic generic component failure rates, RPA can evaluate the potential reliability performance of new component technologies (i.e., 45 nm SOI, 22 nm FinFET, 10 nm planar, etc.) and packaging (i.e., BGA, QFN, CSP, SiP, 3D-IC, etc.) with minimal physical testing or field failure data. 2Design verification/validation of EEE modules: Traditional qualification methods rely on physical tests that are expensive, time-consuming, and too late in the process to effectively identify all potential reliability issues/failure risks. RPA durability simulations allows for a virtual validation process that provides the Tier 1, OEM, and Airframe Integrator (for avionics) insight into reliability performance and failure risk identification so that the risks can be eliminated or mitigated early in the design process. 3Inputs to certification analyses of EEE equipment and systems (e.g., ISO 26262, Functional Safety or FAA Airworthiness Requirements). 4Change evaluation and acceptance: Modifications to fielded products can be stymied due to cumbersome and ill-defined processes for reviewing and approving change requests from suppliers, and the potential for expensive physical retesting. RPA allow for a standardize evaluation process.


Handbook for Robustness Validation of Automotive Electrical/Electronic Modules

Handbook for Robustness Validation of Automotive Electrical/Electronic Modules
Author: Automotive Electronic Systems Reliability Standards
Publisher:
Total Pages: 0
Release: 2012
Genre:
ISBN:

Download Handbook for Robustness Validation of Automotive Electrical/Electronic Modules Book in PDF, ePub and Kindle

This document addresses robustness of electrical/electronic modules for use in automotive applications. Where practical, methods of extrinsic reliability detection and prevention will also be addressed. This document primarily deals with electrical/electronic modules (EEMs), but can easily be adapted for use on mechatronics, sensors, actuators and switches. EEM qualification is the main scope of this document. Other procedures addressing random failures are specifically addressed in the CPI (Component Process Interaction) section 10. This document is to be used within the context of the Zero Defect concept for component manufacturing and product use.It is recommended that the robustness of semiconductor devices and other components used in the EEM be assured using SAE J1879 OCT2007, Handbook for Robustness Validation of Semiconductor Devices in Automotive Applications.The emphasis of this document is on hardware and manufacturing failure mechanisms, however, other contemporary issues as shown in Figure 1 need to be addressed for a thorough Robustness Validation. A Pareto of contemporary issues is shown in Figure 1. Although this document addresses many of the issues shown, however some are outside the scope of this document and will need to be addressed for a thorough RV process application. Examples of issues outside the scope of this document are system interactions, interfaces, functionality, HMI (Human-Machine Interface) and software. At the time of publication of this handbook, a system level Robustness Validation handbook, which addresses these issues, had been initiated. In late 2006 Members of the SAE International Automotive Electronic Systems Reliability Standards Committee and ZVEI (German Electrical and Electronic Manufacturers` Association) formed a joint task force to update SAE Recommended Practice J1211 NOV1978 "Recommended Environmental Practices for Electronic Equipment Design." The 1978 of version of SAE J1211* was written in an era when electronics were first being introduced to the automobile. There was a high level of concern that the harsh environmental conditions experienced in locations in the vehicle could have a serious negative affect on the reliability of electronic components and systems. Some early engine control modules (ECMs) had failure rates in the 350 failures per million hours (f/106 hrs) range, or expressed in the customer's terms, a 25% probability of failure in the first 12 months of vehicle ownership. At that time, warranty data was presented in R/100 (repairs per 100 vehicles) units, for example, 25 R/100 at 12 months.In these early years, when the automotive electronics industry was in it's infancy, a large percentage of these were "hard" catastrophic and intermittent failures exacerbated by exposure to environmental extremes of temperature (40 °C to +85 °C); high mechanical loads from rough road vibration and rail shipment; mechanical shocks of up to 100g from handling and crash impact; severe electrical transients, electrostatic discharge and electromagnetic interference; large swings in electrical supply voltage; reverse electrical supply voltage; and exposure to highly corrosive chemicals (e.g., road salt and battery acid). The focus of the 1978 version of J1211 was on characterizing these harsh vehicle environment for areas of the vehicle (engine compartment, instrument panel, passenger compartment, truck, under body, etc.) and suggesting lab test methods which design engineers could use to evaluate the performance of their components and systems at or near the worst-case conditions expected in the area of the vehicle where their electrical/electronic components would be mounted. By testing their prototypes at the worst case conditions (i.e., at the product's specification limits) described in the 1978 version of J1211 designers were able to detect and design out weaknesses and thereby reduce the likelihood of failure due to environmental factors.By the mid-1980s, it became common practice to specify "test-to-pass" (zero failures allowed) environmental conditions-based reliability demonstration life tests with acceptance levels in the 90% to 95% reliability range (with confidence levels of 70% to 90%). This translates to approximately 5 to 20 f/106 hrs. The sample size for these tests was determined using binomial distribution statistical tables and this would result in a requirement to test 6 to 24 test units without experiencing a failure. If a failure occurred, the sample size would have to be increased and the testing continued without another failure till the "bogie" was reached. The environmental conditions during the test were typically defined such that the units under test were operated at specification limits based on J1211 recommended practices (e.g., 40°C and +85°C) for at least some portion of the total test time. The "goal" of passing such a demonstration test was often very challenging and the "test-analyze-fix" programs that resulted, although very time-consuming and expensive, produced much-needed reliability growth. Reliability improved significantly in the late 1980s and early 1990s and vehicle manufactures and their suppliers began expressing warranty data in R/1000 units instead of R/100 units.By the turn of the century automobile warranty periods had increased from 12 months to 3, 4, 5 (and even 10 years for some systems) and most manufacturers had started specifying life expectancies for vehicle components of 10, 15 and sometimes 20 years. And by this time several vehicle manufacturers and their best electrical/electronic component suppliers had improved reliability to the point where warranty data was being expressed in parts-per-million (ppm) in the triple, double and even single-digit range. This translates to failure rates in the 0.05 f/106 hrs range and better! The achievement of such high reliability is not the result of test-to-pass reliability demonstration testing based on binomial distribution statistical tables. With this method, reliability demonstration in the 99.99% to 99.9999% range would require thousands of test units! On the contrary, the methods and techniques used by engineering teams achieving such reliability excellence did not require increasingly large sample sizes, more expensive and lengthy testing, or more engineers. It is about working smarter, not harder; and about systems-level robust design and robustness validation thinking rather than component-level "test-to-pass" thinking.The task force leaders and members were of the strong opinion that the 2008 version of SAE J1211 should document the state-of-the-art methods and techniques being used by leading companies and engineering teams to achieve ultra-high reliability while at the same time reducing overall cost life-cycle and shortening time-to-market. The SAE International Automotive Electronic Systems Reliability Standards Committee and ZVEI (German Electrical and Electronic Manufacturers` Association) are hopeful that this Handbook for Robustness Validation of Automotive Electrical/Electronic Modules will help many companies and engineering teams make the transition from the 1980s "cookbook" reliability demonstration approach to a more effective, economically feasible knowledge-based Robustness Validation approach.* Relevant information and data from SAE J1211 NOV1978 is preserved in SAE J2837 "Environmental Conditions and Design Practices for Automotive Electronic Equipment: Reference Data from SAE J1211 NOV1978"


Long-Term Non-Operating Reliability of Electronic Products

Long-Term Non-Operating Reliability of Electronic Products
Author: Judy Pecht
Publisher: CRC Press
Total Pages: 194
Release: 2019-07-23
Genre: Mathematics
ISBN: 1351091077

Download Long-Term Non-Operating Reliability of Electronic Products Book in PDF, ePub and Kindle

In today's electronic environment, operating reliability for continued daily use of electronic products is essential. This book discusses the reliability of products that lie dormant for long periods of time and are subject to stresses such as humidity, ionic contaminants, temperature, radiation, shock, and vibration. Non-operating reliability is especially critical for life-saving electronic products such as fire alarm systems, standby power sources, and burglar alarms. Air bags in automobiles, earthquake alarm systems, and radiation warning systems in nuclear power plants are also covered. This physics-of-failure approach is also important to maintaining defense hardware such as missiles and munitions systems which often lie dormant for years before being deployed on very short notice


Failure Analysis of Integrated Circuits

Failure Analysis of Integrated Circuits
Author: Lawrence C. Wagner
Publisher: Springer Science & Business Media
Total Pages: 256
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1461549191

Download Failure Analysis of Integrated Circuits Book in PDF, ePub and Kindle

This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.


Electronic Failure Analysis Handbook

Electronic Failure Analysis Handbook
Author: Perry L. Martin
Publisher: McGraw-Hill Professional Publishing
Total Pages: 776
Release: 1999
Genre: Technology & Engineering
ISBN:

Download Electronic Failure Analysis Handbook Book in PDF, ePub and Kindle

Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.


Reliability Physics

Reliability Physics
Author: Calif.) International Reliability Physics Symposium (17th : 1979 : San Francisco
Publisher:
Total Pages: 263
Release: 1979
Genre:
ISBN:

Download Reliability Physics Book in PDF, ePub and Kindle


Procedings of the 11th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis

Procedings of the 11th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis
Author: L. J. Balk
Publisher: Pergamon Press
Total Pages: 544
Release: 2000-11-17
Genre: Science
ISBN: 9780080439143

Download Procedings of the 11th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis Book in PDF, ePub and Kindle

This book contains the papers presented at ESREF 2000, the 11th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, which was held in Dresden, Germany, from October 2-6 2000. The papers are being published concurrently as a special issue of the journal http://www.elsevier.nl/locate/microrelMicroelectronics Reliability. The ESREF symposium is the annual European forum for reliability physics and analysis of electronic components. This Proceedings volume contains oral papers from the nine conference sessions in ESREF 2000. The session topics, reflecting the main areas of interest within the scope of the Symposium, are as follows: • Design for reliability • Failure mechanisms in metallizations and dielectrics • Fault localisation • Packaging, assemblies and reliability • Silicon devices • Product realisation • Power devices and high temperature electronics • Compound semiconductors • Physical failure analysis The Proceedings contains oral and poster papers from the Symposium, and includes a number of keynote and invited papers. The invited papers feature an international spread of authors and serve to introduce the conference sessions and focus on leading work in these areas. In addition, the Proceedings includes the winner of the Best Paper Award at the Reliability Center Japanese Conference (RCJ 99, Japan). These Proceedings are available as a CD. The CD-ROM is a hybrid disc allowing PC, Macintosh and UNIX users to share the same directory structure and access common files. All materials are published using Adobe® Acrobat technology. The CD includes versions of Acrobat® Reader 4.0 for Microsoft® Windows™, Apple® Macintosh™ and UNIX®.


Scientific and Technical Aerospace Reports

Scientific and Technical Aerospace Reports
Author:
Publisher:
Total Pages: 652
Release: 1994
Genre: Aeronautics
ISBN:

Download Scientific and Technical Aerospace Reports Book in PDF, ePub and Kindle

Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.


Reliability Physics

Reliability Physics
Author: Eswaran Subrahmanian
Publisher: Delft University Press
Total Pages: 788
Release: 2005-04
Genre: Electronic apparatus and appliances
ISBN:

Download Reliability Physics Book in PDF, ePub and Kindle