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Reliability Physics and Engineering

Reliability Physics and Engineering
Author: J. W. McPherson
Publisher: Springer Science & Business Media
Total Pages: 406
Release: 2013-06-03
Genre: Technology & Engineering
ISBN: 3319001221

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"Reliability Physics and Engineering" provides critically important information for designing and building reliable cost-effective products. The textbook contains numerous example problems with solutions. Included at the end of each chapter are exercise problems and answers. "Reliability Physics and Engineering" is a useful resource for students, engineers, and materials scientists.


Reliability Physics and Engineering

Reliability Physics and Engineering
Author: J. W. McPherson
Publisher: Springer Science & Business Media
Total Pages: 324
Release: 2010-08-05
Genre: Technology & Engineering
ISBN: 1441963480

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All engineers could bene?t from at least one course in reliability physics and engineering. It is very likely that, starting with your very ?rst engineering po- tion, you will be asked — how long is your newly developed device expected to last? This text was designed to help you to answer this fundamentally important question. All materials and devices are expected to degrade with time, so it is very natural to ask — how long will the product last? The evidence for material/device degradation is apparently everywhere in nature. A fresh coating of paint on a house will eventually crack and peel. Doors in a new home can become stuck due to the shifting of the foundation. The new ?nish on an automobile will oxidize with time. The tight tolerances associated with ?nely meshed gears will deteriorate with time. Critical parameters associated with hi- precision semiconductor devices (threshold voltages, drive currents, interconnect resistances, capacitor leakages, etc.) will degrade with time. In order to und- stand the lifetime of the material/device, it is important to understand the reliability physics (kinetics) for each of the potential failure mechanisms and then be able to develop the required reliability engineering methods that can be used to prevent, or at least minimize the occurrence of, device failure.


Probabilistic Physics of Failure Approach to Reliability

Probabilistic Physics of Failure Approach to Reliability
Author: Mohammad Modarres
Publisher: John Wiley & Sons
Total Pages: 289
Release: 2017-06-23
Genre: Technology & Engineering
ISBN: 1119388686

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The book presents highly technical approaches to the probabilistic physics of failure analysis and applications to accelerated life and degradation testing to reliability prediction and assessment. Beside reviewing a select set of important failure mechanisms, the book covers basic and advanced methods of performing accelerated life test and accelerated degradation tests and analyzing the test data. The book includes a large number of very useful examples to help readers understand complicated methods described. Finally, MATLAB, R and OpenBUGS computer scripts are provided and discussed to support complex computational probabilistic analyses introduced.


Reliability Physics

Reliability Physics
Author: Calif.). International Reliability Physics Symposium (16th : 1978 : San Diego
Publisher:
Total Pages:
Release: 1978
Genre:
ISBN:

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Reliability Physics

Reliability Physics
Author: Calif.) International Reliability Physics Symposium (17th : 1979 : San Francisco
Publisher:
Total Pages: 263
Release: 1979
Genre:
ISBN:

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Phase Change Memory

Phase Change Memory
Author: Andrea Redaelli
Publisher: Springer
Total Pages: 342
Release: 2017-11-18
Genre: Technology & Engineering
ISBN: 3319690531

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This book describes the physics of phase change memory devices, starting from basic operation to reliability issues. The book gives a comprehensive overlook of PCM with particular attention to the electrical transport and the phase transition physics between the two states. The book also contains design engineering details on PCM cell architecture, PCM cell arrays (including electrical circuit management), as well as the full spectrum of possible future applications.


Influence of Temperature on Microelectronics and System Reliability

Influence of Temperature on Microelectronics and System Reliability
Author: Pradeep Lall
Publisher: CRC Press
Total Pages: 332
Release: 2020-07-09
Genre: Technology & Engineering
ISBN: 0429605595

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This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The


Reliability Physics 1982

Reliability Physics 1982
Author: Calif.) International Reliability Physics Symposium (20th : 1982 : San Diego
Publisher:
Total Pages: 324
Release: 1982
Genre:
ISBN:

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Reliability Physics

Reliability Physics
Author: International Reliability Physics Symposium (Atlanta, Calif.))
Publisher:
Total Pages: 411
Release: 1994
Genre: Electronic apparatus and appliances
ISBN: 9780780313583

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Product Reliability, Maintainability, and Supportability Handbook

Product Reliability, Maintainability, and Supportability Handbook
Author: Michael Pecht
Publisher: CRC Press
Total Pages: 450
Release: 1995-05-04
Genre: Technology & Engineering
ISBN: 9780849394577

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This unique publication addresses the role of reliability, maintainability, and supportability in the life-cycle of a product, in the context of product effectiveness and worth. It emphasizes all aspects of producing an effective electrical or mechanical system. This is the only handbook available on this subject and the only book that is this comprehensive and informative. The Product Reliability, Maintainability, and Supportability Handbook examines the logistics, cost, and the physics of failure-topics never before found in a single volume on reliability. It describes the factors that affect product effectiveness and worth: performance, reliability, design effectiveness and margin for error, availability, affordability, use effectiveness, and logistic effectiveness. The handbook contains 13 in-depth chapters, opening with an introduction on product effectiveness and worth and concluding with reliability and maintainability data that can be combined with performance data to assess overall effectiveness of the product. The pages are filled with valuable information that can be easily and quickly put to practical use. Basic principles of the mathematical theory of probability and necessary background are provided. Concepts and basic theory of reliability in terms of probability and statistical inference are also given. Techniques for deriving probabilistic models from observational data as well as reliability models and associated validation techniques are detailed. Software and software reliability, quality, and safety are all covered, including the development life-cycle process and mechanisms by which software errors are introduced. The book presents design guidelines and techniques and the requirements for materials, manufacturing, and assembly. Learn how to analyze the reliability of redundant and fault-tolerant products. Use the methods for modeling and analyzing failures of repairable products that normally exhibit wearout characteristics. The Product Reliability, Maintainability, and Supportability Handbook also provides reliability improvement techniques to improve the competitiveness of existing products. The book includes helpful summaries and numerous problem sections to reinforce and test learned information. This reference source is the guide that professionals and technical managers should turn to when they need a comprehensive and detailed overview of everything that goes into producing systems and products that meet customer needs in an effective and timely manner.