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Reliability of Electronic Components

Reliability of Electronic Components
Author: Titu I. Bajenescu
Publisher: Springer Science & Business Media
Total Pages: 547
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 3642585051

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This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.


Reliability and Failure of Electronic Materials and Devices

Reliability and Failure of Electronic Materials and Devices
Author: Milton Ohring
Publisher: Academic Press
Total Pages: 759
Release: 2014-10-14
Genre: Technology & Engineering
ISBN: 0080575528

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Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites


Practical Reliability Of Electronic Equipment And Products

Practical Reliability Of Electronic Equipment And Products
Author: Eugene R. Hnatek
Publisher: CRC Press
Total Pages: 472
Release: 2002-10-25
Genre: Technology & Engineering
ISBN: 9780203909089

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Examining numerous examples of highly sensitive products, this book reviews basic reliability mathematics, describes robust design practices, and discusses the process of selecting suppliers and components. He focuses on the specific issues of thermal management, electrostatic discharge, electromagnetic compatibility, printed wiring assembly, environmental stress testing, and failure analysis. The book presents methods for meeting the reliability goals established for the manufacture of electronic product hardware and addresses the development of reliable software. The appendix provides example guidelines for the derating of electrical and electromechanical components.


Reliable Design of Electronic Equipment

Reliable Design of Electronic Equipment
Author: Dhanasekharan Natarajan
Publisher: Springer
Total Pages: 156
Release: 2014-08-02
Genre: Technology & Engineering
ISBN: 3319091115

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This book explains reliability techniques with examples from electronics design for the benefit of engineers. It presents the application of de-rating, FMEA, overstress analyses and reliability improvement tests for designing reliable electronic equipment. Adequate information is provided for designing computerized reliability database system to support the application of the techniques by designers. Pedantic terms and the associated mathematics of reliability engineering discipline are excluded for the benefit of comprehensiveness and practical applications. This book offers excellent support for electrical and electronics engineering students and professionals, bridging academic curriculum with industrial expectations.


AI Techniques for Reliability Prediction for Electronic Components

AI Techniques for Reliability Prediction for Electronic Components
Author: Bhargava, Cherry
Publisher: IGI Global
Total Pages: 330
Release: 2019-12-06
Genre: Computers
ISBN: 1799814661

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In the industry of manufacturing and design, one major constraint has been enhancing operating performance using less time. As technology continues to advance, manufacturers are looking for better methods in predicting the condition and residual lifetime of electronic devices in order to save repair costs and their reputation. Intelligent systems are a solution for predicting the reliability of these components; however, there is a lack of research on the advancements of this smart technology within the manufacturing industry. AI Techniques for Reliability Prediction for Electronic Components provides emerging research exploring the theoretical and practical aspects of prediction methods using artificial intelligence and machine learning in the manufacturing field. Featuring coverage on a broad range of topics such as data collection, fault tolerance, and health prognostics, this book is ideally designed for reliability engineers, electronic engineers, researchers, scientists, students, and faculty members seeking current research on the advancement of reliability analysis using AI.


Component Reliability for Electronic Systems

Component Reliability for Electronic Systems
Author: Titu I. Băjenescu
Publisher: Artech House
Total Pages: 706
Release: 2010
Genre: Technology & Engineering
ISBN: 1596934360

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The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.


Progress Report on Reliability of Electronic Equipment

Progress Report on Reliability of Electronic Equipment
Author: United States. Department of Defense. Research and Development Board. Ad Hoc Group on Reliability of Electronic Equipment
Publisher:
Total Pages: 144
Release: 1952
Genre: Electronics
ISBN:

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Failure Analysis

Failure Analysis
Author: Marius Bazu
Publisher: John Wiley & Sons
Total Pages: 372
Release: 2011-03-08
Genre: Technology & Engineering
ISBN: 1119990009

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Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.


Practical Reliability Of Electronic Equipment And Products

Practical Reliability Of Electronic Equipment And Products
Author: Eugene R. Hnatek
Publisher: CRC Press
Total Pages: 465
Release: 2002-10-25
Genre: Technology & Engineering
ISBN: 0203909089

Download Practical Reliability Of Electronic Equipment And Products Book in PDF, ePub and Kindle

Examining numerous examples of highly sensitive products, this book reviews basic reliability mathematics, describes robust design practices, and discusses the process of selecting suppliers and components. He focuses on the specific issues of thermal management, electrostatic discharge, electromagnetic compatibility, printed wiring assembly, environmental stress testing, and failure analysis. The book presents methods for meeting the reliability goals established for the manufacture of electronic product hardware and addresses the development of reliable software. The appendix provides example guidelines for the derating of electrical and electromechanical components.


High Temperature Electronics

High Temperature Electronics
Author: F. Patrick McCluskey
Publisher: CRC Press
Total Pages: 279
Release: 2018-05-04
Genre: Technology & Engineering
ISBN: 1351440802

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The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.