Recent Progress In Lead Free Solder Technology PDF Download
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| Author | : Mohd Arif Anuar Mohd Salleh |
| Publisher | : Springer Nature |
| Total Pages | : 332 |
| Release | : 2022-03-01 |
| Genre | : Technology & Engineering |
| ISBN | : 3030934411 |
Download Recent Progress in Lead-Free Solder Technology Book in PDF, ePub and Kindle
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
| Author | : Tae-Kyu Lee |
| Publisher | : Springer |
| Total Pages | : 266 |
| Release | : 2014-11-05 |
| Genre | : Technology & Engineering |
| ISBN | : 1461492661 |
Download Fundamentals of Lead-Free Solder Interconnect Technology Book in PDF, ePub and Kindle
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
| Author | : Ahmad Azmin Mohamad |
| Publisher | : BoD – Books on Demand |
| Total Pages | : 120 |
| Release | : 2017-11-29 |
| Genre | : Science |
| ISBN | : 9535136437 |
Download Recent Progress inSoldering Materials Book in PDF, ePub and Kindle
This book is about solders and their composition and focuses on material characterizations and the methods used to make alloys and determine their structures, physical properties and applications. Physical properties and the factors that control them and theoretical verification are the main contents of this book. Corrosion of solders is included in the coverage of the properties related to solder composition and mechanical properties.
| Author | : John W. Evans |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 212 |
| Release | : 2007-01-05 |
| Genre | : Technology & Engineering |
| ISBN | : 1846283108 |
Download A Guide to Lead-free Solders Book in PDF, ePub and Kindle
The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.
| Author | : K. Subramanian |
| Publisher | : John Wiley & Sons |
| Total Pages | : 510 |
| Release | : 2012-03-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1119966809 |
Download Lead-free Solders Book in PDF, ePub and Kindle
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.
| Author | : KV Subramanian |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 370 |
| Release | : 2007-06-28 |
| Genre | : Technology & Engineering |
| ISBN | : 0387484337 |
Download Lead-Free Electronic Solders Book in PDF, ePub and Kindle
Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
| Author | : Mohd Arif Anuar Mohd Salleh |
| Publisher | : Springer Nature |
| Total Pages | : 873 |
| Release | : 2023-07-02 |
| Genre | : Science |
| ISBN | : 9811992673 |
Download Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium Book in PDF, ePub and Kindle
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
| Author | : Gregory Henshall |
| Publisher | : John Wiley & Sons |
| Total Pages | : 241 |
| Release | : 2011-03-29 |
| Genre | : Technology & Engineering |
| ISBN | : 1118102746 |
Download Lead-Free Solder Process Development Book in PDF, ePub and Kindle
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
| Author | : King-Ning Tu |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 376 |
| Release | : 2007-07-27 |
| Genre | : Technology & Engineering |
| ISBN | : 0387388923 |
Download Solder Joint Technology Book in PDF, ePub and Kindle
The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
| Author | : M. Shafik |
| Publisher | : IOS Press |
| Total Pages | : 442 |
| Release | : 2021-09-23 |
| Genre | : Technology & Engineering |
| ISBN | : 1643681990 |
Download Advances in Manufacturing Technology XXXIV Book in PDF, ePub and Kindle
The development of technologies and management of operations is key to sustaining the success of manufacturing businesses, and since the late 1970s, the International Conference on Manufacturing Research (ICMR) has been a major annual event for academics and industrialists engaged in manufacturing research. The conference is renowned as a friendly and inclusive platform that brings together a broad community of researchers who share a common goal. This book presents the proceedings of ICMR2021, the 18th International Conference on Manufacturing Research, incorporating the 35th National Conference on Manufacturing Research, and held in Derby, UK, from 7 to 10 September 2021. The theme of the ICMR2021 conference is digital manufacturing. Within the context of Industrial 4.0, ICMR2021 provided a platform for researchers, academics and industrialists to share their vision, knowledge and experience, and to discuss emerging trends and new challenges in the field. The 60 papers included in the book are divided into 10 parts, each covering a different area of manufacturing research. These are: digital manufacturing, smart manufacturing; additive manufacturing; robotics and industrial automation; composite manufacturing; machining processes; product design and development; information and knowledge management; lean and quality management; and decision support and production optimization. The book will be of interest to all those involved in developing and managing new techniques in manufacturing industry.
