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Practical Guide to the Packaging of Electronics, Second Edition

Practical Guide to the Packaging of Electronics, Second Edition
Author: Ali Jamnia
Publisher: CRC Press
Total Pages: 336
Release: 2008-11-20
Genre: Technology & Engineering
ISBN: 1439870926

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As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.


Practical Guide to the Packaging of Electronics

Practical Guide to the Packaging of Electronics
Author: Ali Jamnia
Publisher: CRC Press
Total Pages: 320
Release: 2019-08-30
Genre:
ISBN: 9780367386306

Download Practical Guide to the Packaging of Electronics Book in PDF, ePub and Kindle

As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader's familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early '90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system's design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.


Practical Guide to the Packaging of Electronics, Second Edition

Practical Guide to the Packaging of Electronics, Second Edition
Author: Ali Jamnia
Publisher: CRC Press
Total Pages: 332
Release: 2008-12-01
Genre: Technology & Engineering
ISBN: 1420065408

Download Practical Guide to the Packaging of Electronics, Second Edition Book in PDF, ePub and Kindle

As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.


Practical Guide to the Packaging of Electronics

Practical Guide to the Packaging of Electronics
Author: Ali Jamnia
Publisher: CRC Press
Total Pages: 335
Release: 2016-12-01
Genre: Technology & Engineering
ISBN: 1315351080

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Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.


Practical Guide to the Packaging of Electronics

Practical Guide to the Packaging of Electronics
Author: Ali Jamnia
Publisher: CRC Press
Total Pages: 226
Release: 2002-10-08
Genre: Technology & Engineering
ISBN: 9780824708658

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Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems. Practical Guide to the Packaging of Electronics discusses Packaging/enclosure design and reliability Thermal, junction-to-case, and contact interface resistance Direct and indirect flow system design Fin design and fan selection Vital elements of shock and vibration Thermal stresses and strains in the design and analysis of mechanically reliable systems Reliability models and system failure The selection of engineering software to facilitate system analysis Design parameters in an avionics electronics package Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.


Principles of Biomechanics

Principles of Biomechanics
Author: Ronald Huston
Publisher: CRC Press
Total Pages: 297
Release: 2008-12-22
Genre: Law
ISBN: 1000611787

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Research and study in biomechanics has grown dramatically in recent years, to the extent that students, researchers, and practitioners in biomechanics now outnumber those working in the underlying discipline of mechanics itself. Filling a void in the current literature on this specialized niche, Principles of Biomechanics provides readers with a so


Heat Exchanger Design Handbook, Second Edition

Heat Exchanger Design Handbook, Second Edition
Author: Kuppan Thulukkanam
Publisher: CRC Press
Total Pages: 1275
Release: 2013-05-20
Genre: Technology & Engineering
ISBN: 1439842124

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Completely revised and updated to reflect current advances in heat exchanger technology, Heat Exchanger Design Handbook, Second Edition includes enhanced figures and thermal effectiveness charts, tables, new chapter, and additional topics––all while keeping the qualities that made the first edition a centerpiece of information for practicing engineers, research, engineers, academicians, designers, and manufacturers involved in heat exchange between two or more fluids. See What’s New in the Second Edition: Updated information on pressure vessel codes, manufacturer’s association standards A new chapter on heat exchanger installation, operation, and maintenance practices Classification chapter now includes coverage of scrapped surface-, graphite-, coil wound-, microscale-, and printed circuit heat exchangers Thorough revision of fabrication of shell and tube heat exchangers, heat transfer augmentation methods, fouling control concepts and inclusion of recent advances in PHEs New topics like EMbaffle®, Helixchanger®, and Twistedtube® heat exchanger, feedwater heater, steam surface condenser, rotary regenerators for HVAC applications, CAB brazing and cupro-braze radiators Without proper heat exchanger design, efficiency of cooling/heating system of plants and machineries, industrial processes and energy system can be compromised, and energy wasted. This thoroughly revised handbook offers comprehensive coverage of single-phase heat exchangers—selection, thermal design, mechanical design, corrosion and fouling, FIV, material selection and their fabrication issues, fabrication of heat exchangers, operation, and maintenance of heat exchangers —all in one volume.


Practical Stress Analysis in Engineering Design

Practical Stress Analysis in Engineering Design
Author: Ronald Huston
Publisher: CRC Press
Total Pages: 664
Release: 2008-12-17
Genre: Science
ISBN: 1420017829

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Updated and revised, this book presents the application of engineering design and analysis based on the approach of understanding the physical characteristics of a given problem and then modeling the important aspects of the physical system. This third edition provides coverage of new topics including contact stress analysis, singularity functions,


Mechanical Tolerance Stackup and Analysis, Second Edition

Mechanical Tolerance Stackup and Analysis, Second Edition
Author: Bryan R. Fischer
Publisher: CRC Press
Total Pages: 510
Release: 2011
Genre: Technology & Engineering
ISBN: 1439863253

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Use Tolerance Analysis Techniques to Avoid Design, Quality, and Manufacturing Problems Before They Happen Often overlooked and misunderstood, tolerance analysis is a critical part of improving products and their design processes. Because all manufactured products are subject to variation, it is crucial that designers predict and understand how these changes can affect form, fit, and function of parts and assemblies—and then communicate their findings effectively. Written by one of the developers of ASME Y14.5 and other geometric dimension and tolerancing (GD&T) standards, Mechanical Tolerance Stackup and Analysis, Second Edition offers an overview of techniques used to assess and convey the cumulative effects of variation on the geometric relationship between part and assembly features. The book focuses on some key components: it explains often misunderstood sources of variation and how they contribute to this deviation in assembled products, as well as how to model that variation in a useful manner. New to the Second Edition: Explores ISO and ASME GD&T standards—including their similarities and differences Covers new concepts and content found in ASME Y14.5-2009 standard Introduces six-sigma quality and tolerance analysis concepts Revamps figures throughout The book includes step-by-step procedures for solving tolerance analysis problems on products defined with traditional plus/minus tolerancing and GD&T. This helps readers understand potential variations, set up the problem, achieve the desired solution, and clearly communicate the results. With added application examples and features, this comprehensive volume will help design engineers enhance product development and safety, ensuring that parts and assemblies carry out their intended functions. It will also help manufacturing, inspection, assembly, and service personnel troubleshoot designs, verify that in-process steps meet objectives, and find ways to improve performance and reduce costs.