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| Author | : Arman Vassighi |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 188 |
| Release | : 2006-06-01 |
| Genre | : Technology & Engineering |
| ISBN | : 0387297499 |
Download Thermal and Power Management of Integrated Circuits Book in PDF, ePub and Kindle
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
| Author | : Weiping Liao |
| Publisher | : |
| Total Pages | : 330 |
| Release | : 2005 |
| Genre | : |
| ISBN | : |
Download Power-thermal Modeling and Management of Integrated Circuits and Systems Book in PDF, ePub and Kindle
| Author | : Arman Vassighi |
| Publisher | : Springer |
| Total Pages | : 0 |
| Release | : 2008-11-01 |
| Genre | : Technology & Engineering |
| ISBN | : 9780387506920 |
Download Thermal and Power Management of Integrated Circuits Book in PDF, ePub and Kindle
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
| Author | : Arman Vassighi |
| Publisher | : Springer |
| Total Pages | : 182 |
| Release | : 2008-11-01 |
| Genre | : Technology & Engineering |
| ISBN | : 9780387506920 |
Download Thermal and Power Management of Integrated Circuits Book in PDF, ePub and Kindle
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
| Author | : Seda Ogrenci-Memik |
| Publisher | : |
| Total Pages | : 253 |
| Release | : 2015 |
| Genre | : TECHNOLOGY & ENGINEERING |
| ISBN | : 9781523101009 |
Download Heat Management in Integrated Circuits Book in PDF, ePub and Kindle
"As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the system to dissipate the generated heat. Thermal effects are forcing chip designers to apply conservative design margins, creating sub-optimal results. At a larger scale, cooling is the second most costly item in the electricity bills of well-designed high-performance computing and data centers, costing 30-50% of the total. Thermal monitoring and management in integrated circuits is therefore becoming increasingly important. This book covers thermal monitoring and management in integrated circuits, with a focus on devices and materials that are intimately integrated on-chip as opposed to in-package or on-board. The devices and circuits discussed include various designs used for the purpose of converting temperature to a digital measurement and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. Topics covered include an overview of heat in integrated circuits and systems, on-chip temperature sensing, dynamic thermal management, active cooling, and mitigating thermal events at the system-level and above"--Provided by publisher.
| Author | : Jose L. Ayala |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 362 |
| Release | : 2011-09-15 |
| Genre | : Computers |
| ISBN | : 3642241530 |
Download Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation Book in PDF, ePub and Kindle
This book constitutes the refereed proceedings of the 21st International Conference on Integrated Circuit and System Design, PATMOS 2011, held in Madrid, Spain, in September 2011. The 34 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems and focus especially on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.
| Author | : José Monteiro |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 380 |
| Release | : 2010-02-18 |
| Genre | : Computers |
| ISBN | : 3642118011 |
Download Integrated Circuit and System Design: Power and Timing Modeling, Optimization and Simulation Book in PDF, ePub and Kindle
This book constitutes the thoroughly refereed post-conference proceedings of 19th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2009, featuring Integrated Circuit and System Design, held in Delft, The Netherlands during September 9-11, 2009. The 26 revised full papers and 10 revised poster papers presented were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on variability & statistical timing, circuit level techniques, power management, low power circuits & technology, system level techniques, power & timing optimization techniques, self-timed circuits, low power circuit analysis & optimization, and low power design studies.
| Author | : Rohit Sharma |
| Publisher | : CRC Press |
| Total Pages | : 328 |
| Release | : 2018-09-03 |
| Genre | : Technology & Engineering |
| ISBN | : 1351831593 |
Download Design of 3D Integrated Circuits and Systems Book in PDF, ePub and Kindle
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
| Author | : Yue Fu |
| Publisher | : CRC Press |
| Total Pages | : 364 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1466583835 |
Download Integrated Power Devices and TCAD Simulation Book in PDF, ePub and Kindle
From power electronics to power integrated circuits (PICs), smart power technologies, devices, and beyond, Integrated Power Devices and TCAD Simulation provides a complete picture of the power management and semiconductor industry. An essential reference for power device engineering students and professionals, the book not only describes the physics inside integrated power semiconductor devices such lateral double-diffused metal oxide semiconductor field-effect transistors (LDMOSFETs), lateral insulated-gate bipolar transistors (LIGBTs), and super junction LDMOSFETs but also delivers a simple introduction to power management systems. Instead of abstract theoretical treatments and daunting equations, the text uses technology computer-aided design (TCAD) simulation examples to explain the design of integrated power semiconductor devices. It also explores next generation power devices such as gallium nitride power high electron mobility transistors (GaN power HEMTs). Including a virtual process flow for smart PIC technology as well as a hard-to-find technology development organization chart, Integrated Power Devices and TCAD Simulation gives students and junior engineers a head start in the field of power semiconductor devices while helping to fill the gap between power device engineering and power management systems.
| Author | : |
| Publisher | : |
| Total Pages | : |
| Release | : 2004 |
| Genre | : |
| ISBN | : |
Download Development of Strategies in Finding the Optimal Cooling of Systems of Integrated Circuits Book in PDF, ePub and Kindle
The task of thermal management in electrical systems has never been simple and has only become more difficult in recent years as the power electronics industry pushes towards devices with higher power densities. At the Center for Power Electronic Systems (CPES), a new approach to power electronic design is being implemented with the Integrated Power Electronic Module (IPEM). It is believed that an IPEM-based design approach will significantly enhance the competitiveness of the U.S. electronics industry, revolutionize the power electronics industry, and overcome many of the technology limits in today's industry by driving down the cost of manufacturing and design turnaround time. But with increased component integration comes the increased risk of component failure due to overheating. This thesis addresses the issues associated with the thermal management of integrated power electronic devices. Two studies are presented in this thesis. The focus of these studies is on the thermal design of a DC-DC front-end power converter developed at CPES with an IPEM-based approach. The first study investigates how the system would respond when the fan location and heat sink fin arrangement are varied in order to optimize the effects of conduction and forced-convection heat transfer to cool the system. The set-up of an experimental test is presented, and the results are compared to the thermal model. The second study presents an improved methodology for the thermal modeling of large-scale electrical systems and their many subsystems.
