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| Author | : Nina Aleksandrovna Adrova |
| Publisher | : |
| Total Pages | : 220 |
| Release | : 1970 |
| Genre | : Science |
| ISBN | : |
May 1993
| Author | : |
| Publisher | : |
| Total Pages | : 162 |
| Release | : 1969 |
| Genre | : Polyimides |
| ISBN | : |
| Author | : Nina Aleksandrovna Adrova |
| Publisher | : |
| Total Pages | : 176 |
| Release | : 1969 |
| Genre | : Polyimides |
| ISBN | : |
| Author | : Mifʻal tirgume ha-madaʻ ha-Yiśreʼeli |
| Publisher | : |
| Total Pages | : 200 |
| Release | : 1972 |
| Genre | : |
| ISBN | : |
| Author | : J.P. Critchley |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 470 |
| Release | : 2013-06-29 |
| Genre | : Science |
| ISBN | : 1489903968 |
Definitions of what is meant by a heat-resistant polymer vary considerably. We have taken the term to mean a polymer which can be used, at least for short time periods, at temperatures from 150°C. The greatest problem which arises in writing a monograph on such materials is the tremendous amount of data that is available. More than 2000 references have been published on one heat-resistant polymer system alone over a period of little more than two years. The result is that a very high degree of selectivity must be exercised with respect to the information reproduced. We have chosen to restrict our coverage to polymers that have received at least some degree of commercial exploitation and to details of their methods of preparation, their thermal and thermo-oxidative stabilities and modes of degradation, and their properties at elevated temperatures. It must be emphasized that other properties not cited, e. g. , hydrolytic and chemical stability, and resistance to ultraviolet radiation, may be equally important in particular uses of these materials. The "older" heat-resistant polymers, e. g. , the thermosets and some of the fluorine-containing materials, are not dealt with in such depth as are the "newer" polymers with aromatic and/or heterocyclic rings in the chain. This is because books have been available for some time on the well-established commercial polymers and developments in them have not been as marked re cently as in the aromatic and heterocyclic macromolecules.
| Author | : K. L. Mittal |
| Publisher | : VSP |
| Total Pages | : 336 |
| Release | : 2001-06-18 |
| Genre | : Technology & Engineering |
| ISBN | : 9789067643399 |
This volume chronicles the proceedings of the International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, held in Newark, New Jersey, November 29 – December 1, 1999. Polyimides constitute an important class of materials because of their many desirable traits, for example: low dielectric constant, high breakdown voltage, good planarization, wear resistance, radiation resistance, inertness to solvents, good adhesion properties, good hydrolytic stability, low thermal expansion, long-term stability and excellent mechanical properties.This volume contains a total of 21 papers, all rigorously peer reviewed and revised before inclusion, addressing many aspects and new developments in polyimides and other high temperature polymers. The book is divided into two parts: “Synthesis, Properties and Bulk Characterization†and “ Interfacial or Adhesion Aspects and Applicationsâ€. The topics covered include: structure-property relationships in polyimides; photochemistry and photophysics of polyimides; thermal and UV laser pyrolyses of polyimides; residual stress evaluation in polyimides; synthesis and characterization of a variety of polyimides; high Tg polyimide; fluorinated polyimides; highly oriented polyimide films; high-temperature aromatic copolymer thermosets; shape-memory polymers; polyimides as liquid crystal alignment layers; surface properties of polyimides; metal-containing polyimides for optoelectronic applications; polyimide L-B films; polyimides coated with copper sulfide; carbon fiber/polyimide composites; and simulations of the polyimide/silica interface.This volume offers a wealth of information and represents current commentary on the R&D activity taking place in the technologically highly important field of polyimides and other high temperature polymers and is of value and interest to anyone interested in the fundamental or applied aspects of this topic.
| Author | : K. L. Mittal |
| Publisher | : BRILL |
| Total Pages | : 434 |
| Release | : 2009-04-24 |
| Genre | : Technology & Engineering |
| ISBN | : 9004170804 |
The topics covered in this proceedings volume include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.
| Author | : Kash L. Mittal |
| Publisher | : CRC Press |
| Total Pages | : 532 |
| Release | : 2003-03-01 |
| Genre | : Science |
| ISBN | : 9047403304 |
This volume documents the proceedings of the Second International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, held in Newark, New Jersey, December 3-6, 2001. Polyimides possess many desirable attributes, so this class of materials has found applications in many technologies ranging from
| Author | : Kash L. Mittal |
| Publisher | : CRC Press |
| Total Pages | : 582 |
| Release | : 2005-04-18 |
| Genre | : Technology & Engineering |
| ISBN | : 9067644226 |
This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003. This volume is divided into three parts. Part 1. “Synthesis, Properties and Bulk Characterization”; Part 2 “Hybrids and Composites” and Part 3 “Applications and General Papers”. The topics covered include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; hybrids and nanocomposites using these materials and their characterization, properties and applications; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polyimide as a tunneling barrier; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.
| Author | : Doug Wilson |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 307 |
| Release | : 2013-11-21 |
| Genre | : Science |
| ISBN | : 9401096619 |
The last twenty years or so have seen a flurry of activity in the synthesis of new polymer systems. This interest has developed largely as a result of the increased need for advanced materials. Despite the emergence of a number of outstanding polymers, it is the polyimides that have captured the imagination of scientists and engineers alike as materials that offer outstanding promise for the high technology applic ations of the future. The reputation of the polyimide has been established on the bases of outstanding thermal stability, excellent mechanical properties and the ability to be fabricated into useful articles. Polyimides offer a versatility unparalleled in most other classes of macromolecules. Polymers can be prepared from a variety of starting materials, by a variety of synthetic routes. They can be tailor-made to suit specific applications. By judicious choice of starting materials, polymers can be made that offer variations in such properties as glass transition tempera ture, oxidative stability, toughness, adhesion, and permeability. It is this versatility that has led to the use of polyimides in a wide variety of applications. The electronics industry makes extensive use of poly imide films in, ior example, semiconductor applications. The leading polymer matrices for high temperature advanced composites are polyimides. High temperature adhesive systems for the bonding of metals or composites are often based on polyimides. In addition, polyimides are now finding use as fibres, foams, sealents and even membranes for the low energy separation of industrial gases.
