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Moisture Sensitivity of Plastic Packages of IC Devices

Moisture Sensitivity of Plastic Packages of IC Devices
Author: X.J. Fan
Publisher: Springer Science & Business Media
Total Pages: 573
Release: 2010-07-23
Genre: Technology & Engineering
ISBN: 1441957197

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Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.


Moisture Sensitivity of Plastic Packages of IC Devices

Moisture Sensitivity of Plastic Packages of IC Devices
Author: Xuejun Fan
Publisher: Springer
Total Pages: 558
Release: 2011-11-14
Genre: Technology & Engineering
ISBN: 9781441957207

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Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.


3D Microelectronic Packaging

3D Microelectronic Packaging
Author: Yan Li
Publisher: Springer
Total Pages: 465
Release: 2017-01-20
Genre: Technology & Engineering
ISBN: 3319445863

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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.


Characterization of Integrated Circuit Packaging Materials

Characterization of Integrated Circuit Packaging Materials
Author: Thomas Moore
Publisher: Elsevier
Total Pages: 293
Release: 2013-10-22
Genre: Technology & Engineering
ISBN: 1483292347

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Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.


Microelectronics Failure Analysis

Microelectronics Failure Analysis
Author:
Publisher: ASM International
Total Pages: 813
Release: 2004-01-01
Genre: Technology & Engineering
ISBN: 0871708043

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For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron


Power Electronic Packaging

Power Electronic Packaging
Author: Yong Liu
Publisher: Springer Science & Business Media
Total Pages: 606
Release: 2012-02-15
Genre: Technology & Engineering
ISBN: 1461410533

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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.


Electronic Enclosures, Housings and Packages

Electronic Enclosures, Housings and Packages
Author: Frank Suli
Publisher: Woodhead Publishing
Total Pages: 490
Release: 2018-11-15
Genre: Technology & Engineering
ISBN: 008102391X

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Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more


Case Studies in Reliability and Maintenance

Case Studies in Reliability and Maintenance
Author: Wallace R. Blischke
Publisher: John Wiley & Sons
Total Pages: 691
Release: 2003-03-27
Genre: Mathematics
ISBN: 0471458732

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Introducing a groundbreaking companion book to a bestselling reliability text Reliability is one of the most important characteristics defining the quality of a product or system, both for the manufacturer and the purchaser. One achieves high reliability through careful monitoring of design, materials and other input, production, quality assurance efforts, ongoing maintenance, and a variety of related decisions and activities. All of these factors must be considered in determining the costs of production, purchase, and ownership of a product. Case Studies in Reliability and Maintenance serves as a valuable addition to the current literature on the subject of reliability by bridging the gap between theory and application. Conceived during the preparation of the editors' earlier work, Reliability: Modeling, Prediction, and Optimization (Wiley, 2000), this new volume features twenty-six actual case studies written by top experts in their fields, each illustrating exactly how reliability models are applied. A valuable companion book to Reliability: Modeling, Prediction, and Optimization, or any other textbook on the subject, the book features: * Case studies from fields such as aerospace, automotive, mining, electronics, power plants, dikes, computer software, weapons, photocopiers, industrial furnaces, granite building cladding, chemistry, and aircraft engines * A logical organization according to the life cycle of a product or system * A unified format of discussion enhanced by tools, techniques, and models for drawing one's own conclusions * Pertinent exercises for reinforcement of ideas Of equal value to both students of reliability theory as well as professionals in industry, Case Studies in Reliability and Maintenance should be required reading for anyone seeking to understand how reliability and maintenance issues can be addressed and resolved in the real world.


Humidity and Electronics

Humidity and Electronics
Author: Rajan Ambat
Publisher: Woodhead Publishing
Total Pages: 399
Release: 2021-11-30
Genre: Technology & Engineering
ISBN: 0323908543

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Humidity and Electronics: Corrosion Reliability Issues and Preventive Measures provides comprehensive information on humidity related corrosion reliability issues surrounding electronics and how to tackle potential issues from a pro-active-design-prevention perspective. The book contains a mix of academic and industrial relevance, making it suitable for a detailed understanding on humidity issues on electronics, both for materials and corrosion experts and electronics and electrical experts. It will be useful for researchers, academics, and industrial personals involved in materials, corrosion, and electronics reliability aspects. Provides basic and applied knowledge surrounding corrosion in electronics Combines electronics/electrical and electrochemical aspects related to failure modes and mechanisms Presents knowledge on influencing factors and how they can be used as preventive measures at the material, component, device and system level