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| Author | : Andrew Singmin |
| Publisher | : Prompt |
| Total Pages | : 0 |
| Release | : 2000 |
| Genre | : Electronic apparatus and appliances |
| ISBN | : 9780790611990 |
Offers up-to-date techniques for the use of soldering in electronic components.
| Author | : Jennie S. Hwang |
| Publisher | : McGraw Hill Professional |
| Total Pages | : 678 |
| Release | : 1996 |
| Genre | : Technology & Engineering |
| ISBN | : 9780070317499 |
Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cleaning Manufacture No-Clean Manufacture Protective and Reactive Atmosphere Soldering Surface Mount Fine Pitch Technology Surface Mount-BGA/PAC Technology Soldering Methodology and Equipment Soldering and Soldering Related Issues Strengthened Solders Lead-Free Solders Solder Joint Failure Mode Solder Joint Failure Assessment-Case Studies Solder Joint Quality and Reliability New and Emerging Specifications and Standards Future Trends.
| Author | : Jennie Hwang |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 374 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 146153528X |
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
| Author | : Tae-Kyu Lee |
| Publisher | : Springer |
| Total Pages | : 266 |
| Release | : 2014-11-05 |
| Genre | : Technology & Engineering |
| ISBN | : 1461492661 |
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
| Author | : Williams Peterson |
| Publisher | : Independently Published |
| Total Pages | : 34 |
| Release | : 2021-10-02 |
| Genre | : |
| ISBN | : |
Soldering is a fun craft that can produce beautiful custom pieces from jewelry to picture frames, but if you've never had the chance to pick up a soldering iron, the process can seem a little daunting. Where can you find the tools you will need? What do you do with them once you have them? And what materials should you work with? If you do not have the adequate answer to these questions then this book is for you! I will take you to the very beginning of the soldering process and teach you about the tools you will need and the materials you should buy. Then, take you step by step through the basic soldering techniques you will need to know to create your own woks of art. Projects for beginner, intermediate, and advanced craft enthusiasts are included, ensuring that you'll always have something new to inspire and create as your skills increase. Use this book to make pendants, bracelets, earrings, frames, and more, all in your own unique, creative style. Get started today! Soldering--the art of permanently joining metal components with a torch and solder--is seen as a challenge by many crafters. This comprehensive volume takes the mystery out of this misunderstood technique with clear instruction for jewelers of all levels. COVERED IN THIS BOOK ARE: - An introduction to the history of soldering with an overview of conventional and lesser known methods - An in-depth look at essential equipment and tools as well as health and safety precautions - The fundamentals of soldering, from setting up and handling parts to understanding solder and fixing mistakes - A range of soldering techniques--from simple to more complex
| Author | : R. Sengupta |
| Publisher | : New Age International |
| Total Pages | : 122 |
| Release | : 1997 |
| Genre | : |
| ISBN | : 9788122411096 |
Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.
| Author | : Ning-Cheng Lee |
| Publisher | : Elsevier |
| Total Pages | : 288 |
| Release | : 2002-01-24 |
| Genre | : Technology & Engineering |
| ISBN | : 008049224X |
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
| Author | : RUDOLF STRAUSS |
| Publisher | : Elsevier |
| Total Pages | : 389 |
| Release | : 1998-02-24 |
| Genre | : Technology & Engineering |
| ISBN | : 0080480977 |
Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. Written by founding father of SMT technology Standard specifications have been fully updated New chapter covering Ball Grid Array (BGA) technology
| Author | : C. J. Thwaites |
| Publisher | : |
| Total Pages | : 28 |
| Release | : 1972 |
| Genre | : |
| ISBN | : |
| Author | : MIKE JUDD |
| Publisher | : Elsevier |
| Total Pages | : 385 |
| Release | : 1999-03-26 |
| Genre | : Technology & Engineering |
| ISBN | : 008051734X |
Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. A practical guide for the industry covering all the main soldering processes currently in use Cleaning, faults, troubleshooting and standards are all major topics Considers safety and solder process quality assessment
