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Mechanic and Dielectric Properties

Mechanic and Dielectric Properties
Author: Maurice H. Francombe
Publisher: Academic Press
Total Pages: 415
Release: 2013-10-22
Genre: Science
ISBN: 1483288927

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Mechanic and Dielectric Properties deals with the mechanical and dielectric properties of thin films. Topics covered range from the deposition and mechanical properties of superlattice thin films to the preparation of hard coatings by sputtering and arc evaporation. The use of thin films in microwave acoustics is also discussed, along with ferroelectric films for integrated electronics and the physics, chemistry, and technology of electrochromic tungsten-oxide-based thin films. Comprised of five chapters, this volume begins with an analysis of the growth, characterization, and mechanical behavior of films comprising multilayers primarily of metal and refractory metallic compound components. The next chapter reviews the mechanical properties of hard coatings prepared by sputtering and arc evaporation, together with the influence of multilayer and gradient structures, and of film crystallinity, crystal orientation, and morphology, on properties such as hardness, coating smoothness, and friction behavior. Subsequent chapters focus on the unique role played by piezoelectric films in signal processing devices utilizing bulk or surface acoustic waves; the properties and applications of ferroelectric films in integrated electronics; and the underlying physics and chemistry of electrochromic tungsten-oxide-based thin films. This book should be of interest to physicists.


Micro- and Macro-Properties of Solids

Micro- and Macro-Properties of Solids
Author: Dinker B. Sirdeshmukh
Publisher: Springer Science & Business Media
Total Pages: 415
Release: 2006-09-02
Genre: Science
ISBN: 3540317864

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This book addresses the most important aspects of solid state physics, reviewing basic properties, related experimental techniques, and summarizing research over six decades. In addition, Micro- and Macro-Properties of Solids provides data on new materials such as rare-earth metals, semiconductors, ferroelectrics, mixed-valence compounds, superionic conductors, optical and optoelectronic materials and biomaterials.


Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
Author: Christopher Lyle Borst
Publisher: Springer Science & Business Media
Total Pages: 235
Release: 2013-11-27
Genre: Technology & Engineering
ISBN: 1461511658

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As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.


Mechanical Properties and Performance of Engineering Ceramics and Composites IX, Volume 35, Issue 2

Mechanical Properties and Performance of Engineering Ceramics and Composites IX, Volume 35, Issue 2
Author: Dileep Singh
Publisher: John Wiley & Sons
Total Pages: 250
Release: 2014-11-18
Genre: Technology & Engineering
ISBN: 1119031311

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The Ceramic Engineering and Science Proceeding has been published by The American Ceramic Society since 1980. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.


Accelerating the Discovery of New Dielectric Properties in Polymer Insulation

Accelerating the Discovery of New Dielectric Properties in Polymer Insulation
Author: Du, Boxue
Publisher: IGI Global
Total Pages: 396
Release: 2017-03-24
Genre: Technology & Engineering
ISBN: 1522523103

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Modern power systems have undergone tremendous progress due to the implementation of new technologies. With these advancements, the standards for insulation materials must be enhanced and revitalized. Accelerating the Discovery of New Dielectric Properties in Polymer Insulation is a pivotal source of academic research on emerging trends in the properties, applications, and developments of polymer dielectrics. Highlighting a range of relevant perspectives on topics such as high thermal conductivity, power storage, and wind energy, this book is ideally designed for students, professionals, academics, and practitioners interested in the optimization of power system infrastructures.


Theory of Dielectrics

Theory of Dielectrics
Author: Herbert Fröhlich
Publisher: Oxford University Press, USA
Total Pages: 214
Release: 1958
Genre: Art
ISBN:

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A systematic account of the theory of dielectric properties, this book is accessible to readers with a working knowledge of calculus, statistical mechanics, electrostatics and atomic and molecular physics. An excellent reference for anyone working in applied physics, engineering, or chemistry.


Electromagnetic Properties of Multiphase Dielectrics

Electromagnetic Properties of Multiphase Dielectrics
Author: Tarek I. Zohdi
Publisher: Springer Science & Business Media
Total Pages: 188
Release: 2012-04-09
Genre: Technology & Engineering
ISBN: 3642284272

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Recently, several applications, primarily driven by microtechnology, have emerged where the use of materials with tailored electromagnetic (dielectric) properties are necessary for a successful overall design. The ``tailored'' aggregate properties are achieved by combining an easily moldable base matrix with particles having dielectric properties that are chosen to deliver (desired) effective properties. In many cases, the analysis of such materials requires the simulation of the macroscopic and microscopic electromagnetic response, as well as its resulting coupled thermal response, which can be important to determine possible failures in ``hot spots.'' This necessitates a stress analysis. Furthermore, because, oftentimes, such processes initiate degratory chemical processes, it can be necessary to also include models for these processes as well. A central objective of this work is to provide basic models and numerical solution strategies to analyze the coupled response of such materials by direct simulation using standard laptop/desktop equipment. Accordingly, this monograph covers: (1) The foundations of Maxwell's equations, (2) Basic homogenization theory, (3) Coupled systems (electromagnetic, thermal, mechanical and chemical), (4) Numerical methods and (5) An introduction to select biological problems. The text can be viewed as a research monograph suitable for use in an upper-division undergraduate or first year graduate course geared towards students in the applied sciences, mechanics and mathematics that have an interest in the analysis of particulate materials.


Low Dielectric Constant Materials for IC Applications

Low Dielectric Constant Materials for IC Applications
Author: Paul S. Ho
Publisher: Springer Science & Business Media
Total Pages: 323
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 3642559085

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Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for


High Dielectric Constant Materials

High Dielectric Constant Materials
Author: Howard Huff
Publisher: Springer Science & Business Media
Total Pages: 740
Release: 2005
Genre: Science
ISBN: 9783540210818

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Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology. Topics include: an extensive review of Moore's Law, the classical regime for SiO2 gate dielectrics; the transition to silicon oxynitride gate dielectrics; the transition to high-K gate dielectrics (including the drive towards equivalent oxide thickness in the single-digit nanometer regime); and future directions and issues for ultimate technology generation scaling. The vision, wisdom, and experience of the team of authors will make this book a timely, relevant, and interesting, resource focusing on fundamentals of the 45 nm Technology Generation and beyond.