Materials Reliability Issues In Microelectronics PDF Download
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Author | : |
Publisher | : |
Total Pages | : 392 |
Release | : 1991 |
Genre | : Microelectronics |
ISBN | : |
Download Materials Reliability Issues in Microelectronics Book in PDF, ePub and Kindle
Proceedings of the "MRS Symposium on Materials Reliability Issues in Microelectronics"--Dedication, p. xiii.
Author | : James R. Lloyd |
Publisher | : Mrs Proceedings |
Total Pages | : 390 |
Release | : 1991-10-22 |
Genre | : Science |
ISBN | : |
Download Materials Reliability Issues in Microelectronics: Volume 225 Book in PDF, ePub and Kindle
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author | : |
Publisher | : |
Total Pages | : 488 |
Release | : 1997 |
Genre | : Microelectronics |
ISBN | : |
Download Materials Reliability in Microelectronics Book in PDF, ePub and Kindle
Author | : A. Christou |
Publisher | : RIAC |
Total Pages | : 410 |
Release | : 2006 |
Genre | : Microelectronics |
ISBN | : 1933904151 |
Download Reliability and Quality in Microelectronic Manufacturing Book in PDF, ePub and Kindle
Author | : Materials Research Society |
Publisher | : Materials Research Society |
Total Pages | : |
Release | : 1994-01-01 |
Genre | : Technology & Engineering |
ISBN | : 9783380000006 |
Download Materials Reliability in Microelectronics IV Book in PDF, ePub and Kindle
Author | : Willem Dirk van Driel |
Publisher | : Springer Nature |
Total Pages | : 552 |
Release | : 2022-01-31 |
Genre | : Technology & Engineering |
ISBN | : 3030815765 |
Download Reliability of Organic Compounds in Microelectronics and Optoelectronics Book in PDF, ePub and Kindle
This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Author | : Milton Ohring |
Publisher | : Academic Press |
Total Pages | : 759 |
Release | : 2014-10-14 |
Genre | : Technology & Engineering |
ISBN | : 0080575528 |
Download Reliability and Failure of Electronic Materials and Devices Book in PDF, ePub and Kindle
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author | : Osamu Tabata |
Publisher | : John Wiley & Sons |
Total Pages | : 325 |
Release | : 2013-03-26 |
Genre | : Technology & Engineering |
ISBN | : 3527675035 |
Download Reliability of MEMS Book in PDF, ePub and Kindle
This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
Author | : Pradeep Lall |
Publisher | : CRC Press |
Total Pages | : 332 |
Release | : 2020-07-09 |
Genre | : Technology & Engineering |
ISBN | : 0429605595 |
Download Influence of Temperature on Microelectronics and System Reliability Book in PDF, ePub and Kindle
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Author | : Way Kuo |
Publisher | : Springer Science & Business Media |
Total Pages | : 424 |
Release | : 1998-01-31 |
Genre | : Technology & Engineering |
ISBN | : 9780792381075 |
Download Reliability, Yield, and Stress Burn-In Book in PDF, ePub and Kindle
The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.