Materials For Mechanical And Optical Microsystems Volume 444 PDF Download

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Materials for Mechanical and Optical Microsystems: Volume 444

Materials for Mechanical and Optical Microsystems: Volume 444
Author: Michael L. Reed
Publisher:
Total Pages: 264
Release: 1997-03-30
Genre: Mathematics
ISBN:

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A selection of 33 reviewed papers explore the materials aspects of microsystems, especially those involving mechanical, optical, and thermal components. The topics include technology for micro- assembling, selective electroless copper metallization of epoxy substrates, an improved auto-adhesion measurement method for micro-machines polysilicon beams, patterned sol-gel structures by micro-molding in capillaries, the experimental analysis of the process of anodic bonding using an evaporated glass layer, the effect of inorganic thin film material processing and properties on stress in silicon piezoresistive pressure sensors, and photoconductivity in vacuum-deposited films of silicon-based polymers. Annotation copyrighted by Book News, Inc., Portland, OR


Materials for Optical Limiting

Materials for Optical Limiting
Author:
Publisher:
Total Pages: 360
Release: 1997
Genre: Eyeglasses, Protective
ISBN:

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Materials Reliability in Microelectronics VII: Volume 473

Materials Reliability in Microelectronics VII: Volume 473
Author: J. Joseph Clement
Publisher:
Total Pages: 488
Release: 1997-10-20
Genre: Technology & Engineering
ISBN:

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The inexorable drive for increased integrated circuit functionality and performance places growing demands on the metal and dielectric thin films used in fabricating these circuits, as well as spurring demand for new materials applications and processes. This book directly addresses issues of widespread concern in the microelectronics industry - smaller feature sizes, new materials and new applications that challenge the reliability of new technologies. While the book continues the focus on issues related to interconnect reliability, such as electromigration and stress, particular emphasis is placed on the effects of microstructure. An underlying theme is understanding the importance of interactions among different materials and associated interfaces comprising a single structure with dimensions near or below the micrometer scale. Topics include: adhesion and fracture; gate oxide growth and oxide interfaces; surface preparation and gate oxide reliability; oxide degradation and defects; micro-structure, texture and reliability; novel measurement techniques; interconnect performance and reliability modeling; electromigration and interconnect reliability and stress and stress relaxation.


Materials for Optical Limiting II: Volume 479

Materials for Optical Limiting II: Volume 479
Author: Richard Lee Sutherland
Publisher:
Total Pages: 358
Release: 1997-12-30
Genre: Technology & Engineering
ISBN:

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The proliferation of lasers and systems employing lasers has brought with it the potential for adverse effects from these bright, coherent light sources. This includes the possibility of damage from pulsed lasers, as well as temporary blinding by continuous-waver lasers. With nearly every wavelength possible being emitted by these sources, there exists a need to develop optical limiters and tunable filters which can suppress undesired radiation of any wavelength. This book addresses a number of materials and devices which have the potential for meeting the challenge. The proceedings is divided into five parts. Parts I and II cover research in organic and inorganic materials primarily based on nonlinear absorption or phase transitions for optical limiting of pulsed lasers. Part III includes photo-refractive materials and liquid crystals which find primary applications in dynamic filters. Part IV covers various aspects of device and material characterization, including nonlinear beam propagation effects. Theoretical modelling of materials properties is the subject of Part V.


Thin Films - Structure and Morphology: Volume 441

Thin Films - Structure and Morphology: Volume 441
Author: Steven C. Moss
Publisher:
Total Pages: 904
Release: 1997-07-29
Genre: Technology & Engineering
ISBN:

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An interdisciplinary group of materials scientists, physicists, chemists and engineers come together in this book to discuss recent advances in the structure and morphology of thin films. Both scientific and technological issues are addressed. Work on thin films for a host of applications including microelectronics, optics, tribology, biomedical technologies and microelectromechanical systems (MEMS) are featured. Topics include: kinetics of growth; grain growth; instabilities, segregation and ordering; silicides; metallization; stresses in thin films; deposition and growth simulations; energetic growth processes; diamond films and carbide and nitride films.


Micromechanics and Nanoscale Effects

Micromechanics and Nanoscale Effects
Author: Vasyl Michael Harik
Publisher: Springer Science & Business Media
Total Pages: 251
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 9400710135

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This volume consists of the state-of-the-art reports on new developments in micromechanics and the modeling of nanoscale effects, and is a companion book to the recent Kluwer volume on nanomechanics and mul- scale modeling (it is entitled Trends in Nanoscale Mechanics). The two volumes grew out of a series of discussions held at NASA Langley Research Center (LaRC), lectures and other events shared by many researchers from the national research laboratories and academia. The key events include the 2001 Summer Series of Round-Table Discussions on Nanotechnology at ICASE Institute (NASA LaRC) organized by Drs. V. M. Harik and M. D. Salas and the 2002 NASA LaRC Workshop on Multi-scale Modeling. The goal of these interactions was to foster collaborations between academic researchers and the ICASE Institute (NASA LaRC), a universi- based institute, which has pioneered world-class computational, theoretical and experimental research in the disciplines that are important to NASA. Editors gratefully acknowledge help of Ms. E. Todd (ICASE, NASA LaRC), the ICASE Director M. D. Salas and all reviewers, in particular, Dr. B. Diskin (ICASE/NIA, NASA LaRC), Prof. R. Haftka (University of Florida), Dr. V. M. Harik (ICASE/Swales Aerospace, NASA LaRC), Prof.