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A Guide to Lead-free Solders

A Guide to Lead-free Solders
Author: John W. Evans
Publisher: Springer Science & Business Media
Total Pages: 212
Release: 2007-01-05
Genre: Technology & Engineering
ISBN: 1846283108

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The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.


Lead-Free Solder Interconnect Reliability

Lead-Free Solder Interconnect Reliability
Author: Dongkai Shangguan
Publisher: ASM International
Total Pages: 292
Release: 2005
Genre: Technology & Engineering
ISBN: 161503093X

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Lead Free Solder

Lead Free Solder
Author: John Hock Lye Pang
Publisher: Springer Science & Business Media
Total Pages: 184
Release: 2011-10-15
Genre: Technology & Engineering
ISBN: 1461404630

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Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.


Lead-Free Soldering in Electronics

Lead-Free Soldering in Electronics
Author: Katsuaki Suganuma
Publisher: CRC Press
Total Pages: 355
Release: 2003-12-11
Genre: Technology & Engineering
ISBN: 0824758595

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Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.


Lead-Free Electronic Solders

Lead-Free Electronic Solders
Author: KV Subramanian
Publisher: Springer Science & Business Media
Total Pages: 370
Release: 2007-06-28
Genre: Technology & Engineering
ISBN: 0387484337

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Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.


Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Author: Karl J. Puttlitz
Publisher: CRC Press
Total Pages: 1044
Release: 2004-02-27
Genre: Technology & Engineering
ISBN: 0203021487

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This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif


Lead-Free Soldering

Lead-Free Soldering
Author: Jasbir Bath
Publisher: Springer Science & Business Media
Total Pages: 307
Release: 2007-06-26
Genre: Technology & Engineering
ISBN: 0387684220

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The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.


Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints
Author: John H. Lau
Publisher: Springer Nature
Total Pages: 545
Release: 2020-05-29
Genre: Technology & Engineering
ISBN: 9811539200

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This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.


Lead-free Soldering Process Development and Reliability

Lead-free Soldering Process Development and Reliability
Author: Jasbir Bath
Publisher: John Wiley & Sons
Total Pages: 512
Release: 2020-06-12
Genre: Technology & Engineering
ISBN: 1119482046

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Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.


Lead Free Solders

Lead Free Solders
Author: Abhijit Kar
Publisher:
Total Pages: 94
Release: 2019
Genre:
ISBN: 9781839622786

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This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.