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| Author | : IPC International |
| Publisher | : |
| Total Pages | : |
| Release | : 2022-01-31 |
| Genre | : |
| ISBN | : 9781638160809 |
| Author | : IPC International |
| Publisher | : |
| Total Pages | : |
| Release | : 2022-01-31 |
| Genre | : |
| ISBN | : 9781638160434 |
| Author | : |
| Publisher | : |
| Total Pages | : 64 |
| Release | : 2000 |
| Genre | : Electronic apparatus and appliances |
| ISBN | : 9781580984126 |
| Author | : Eric Bogatin |
| Publisher | : Pearson Education |
| Total Pages | : 793 |
| Release | : 2010 |
| Genre | : Technology & Engineering |
| ISBN | : 0132349795 |
With the inclusion of the two new hot topics in signal integrity, power integrity and high speed serial links, this book will be the most up to date complete guide to understanding and designing for signal integrity.
| Author | : Kraig Mitzner |
| Publisher | : Elsevier |
| Total Pages | : 529 |
| Release | : 2011-04-01 |
| Genre | : Technology & Engineering |
| ISBN | : 0080549209 |
Complete PCB Design Using OrCad Capture and Layout provides instruction on how to use the OrCAD design suite to design and manufacture printed circuit boards. The book is written for both students and practicing engineers who need a quick tutorial on how to use the software and who need in-depth knowledge of the capabilities and limitations of the software package. There are two goals the book aims to reach: The primary goal is to show the reader how to design a PCB using OrCAD Capture and OrCAD Layout. Capture is used to build the schematic diagram of the circuit, and Layout is used to design the circuit board so that it can be manufactured. The secondary goal is to show the reader how to add PSpice simulation capabilities to the design, and how to develop custom schematic parts, footprints and PSpice models. Often times separate designs are produced for documentation, simulation and board fabrication. This book shows how to perform all three functions from the same schematic design. This approach saves time and money and ensures continuity between the design and the manufactured product. Information is presented in the exact order a circuit and PCB are designed Straightforward, realistic examples present the how and why the designs work, providing a comprehensive toolset for understanding the OrCAD software Introduction to the IPC, JEDEC, and IEEE standards relating to PCB design Full-color interior and extensive illustrations allow readers to learn features of the product in the most realistic manner possible
| Author | : Hank Zumbahlen |
| Publisher | : |
| Total Pages | : |
| Release | : 2005-01-01 |
| Genre | : Electric circuits, Linear |
| ISBN | : 9780916550288 |
| Author | : Sanka Ganesan |
| Publisher | : John Wiley & Sons |
| Total Pages | : 804 |
| Release | : 2006-02-17 |
| Genre | : Technology & Engineering |
| ISBN | : 0471786179 |
Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
| Author | : Mohammad Azadeh |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 378 |
| Release | : 2009-08-05 |
| Genre | : Science |
| ISBN | : 1441903046 |
Within the past few decades, information technologies have been evolving at a tremendous rate, causing profound changes to our world and our ways of life. In particular, fiber optics has been playing an increasingly crucial role within the telecommunication revolution. Not only most long-distance links are fiber based, but optical fibers are increasingly approaching the individual end users, providing wide bandwidth links to support all kinds of data-intensive applications such as video, voice, and data services. As an engineering discipline, fiber optics is both fascinating and challenging. Fiber optics is an area that incorporates elements from a wide range of techno- gies including optics, microelectronics, quantum electronics, semiconductors, and networking. As a result of rapid changes in almost all of these areas, fiber optics is a fast evolving field. Therefore, the need for up-to-date texts that address this growing field from an interdisciplinary perspective persists. This book presents an overview of fiber optics from a practical, engineering perspective. Therefore, in addition to topics such as lasers, detectors, and optical fibers, several topics related to electronic circuits that generate, detect, and process the optical signals are covered. In other words, this book attempts to present fiber optics not so much in terms of a field of “optics” but more from the perspective of an engineering field within “optoelectronics.
| Author | : United States. Environmental Protection Agency. Sediment Oversight Technical Committee |
| Publisher | : |
| Total Pages | : 234 |
| Release | : 1992 |
| Genre | : Environmental protection |
| ISBN | : |
This document is a compendium of scientifically valid and accepted methods that can be used to assess sediment quality and predict ecological impacts...the intent here is to provide the most useful overall measures or predictors of ecological impacts currently in use rather than procedures that may have limited application outside of a particular regulatory framework... parag The information provided in the compendium on the relative strengths and weaknesses of the different assessment methods can provide assistance in selecting the appropriate methods.
| Author | : Barrie D. Dunn |
| Publisher | : Springer |
| Total Pages | : 677 |
| Release | : 2015-12-29 |
| Genre | : Technology & Engineering |
| ISBN | : 3319233629 |
The objective of this book is to assist scientists and engineers select the ideal material or manufacturing process for particular applications; these could cover a wide range of fields, from light-weight structures to electronic hardware. The book will help in problem solving as it also presents more than 100 case studies and failure investigations from the space sector that can, by analogy, be applied to other industries. Difficult-to-find material data is included for reference. The sciences of metallic (primarily) and organic materials presented throughout the book demonstrate how they can be applied as an integral part of spacecraft product assurance schemes, which involve quality, material and processes evaluations, and the selection of mechanical and component parts. In this successor edition, which has been revised and updated, engineering problems associated with critical spacecraft hardware and the space environment are highlighted by over 500 illustrations including micrographs and fractographs. Space hardware captured by astronauts and returned to Earth from long durations in space are examined. Information detailed in the Handbook is applicable to general terrestrial applications including consumer electronics as well as high reliability systems associated with aeronautics, medical equipment and ground transportation. This Handbook is also directed to those involved in maximizing the relia bility of new materials and processes for space technology and space engineering. It will be invaluable to engineers concerned with the construction of advanced structures or mechanical and electronic sub-systems.
