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| Author | : Y. Obeng |
| Publisher | : The Electrochemical Society |
| Total Pages | : 130 |
| Release | : |
| Genre | : |
| ISBN | : 1607687135 |
| Author | : |
| Publisher | : |
| Total Pages | : |
| Release | : 2014 |
| Genre | : |
| ISBN | : 9781607685210 |
| Author | : |
| Publisher | : |
| Total Pages | : 91 |
| Release | : 2012 |
| Genre | : |
| ISBN | : 9781623320133 |
| Author | : Yong Liu |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 606 |
| Release | : 2012-02-15 |
| Genre | : Technology & Engineering |
| ISBN | : 1461410533 |
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
| Author | : Shichun Qu |
| Publisher | : Springer |
| Total Pages | : 336 |
| Release | : 2014-09-10 |
| Genre | : Technology & Engineering |
| ISBN | : 1493915568 |
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
| Author | : ASM International |
| Publisher | : ASM International |
| Total Pages | : 551 |
| Release | : 2008-01-01 |
| Genre | : Electronic apparatus and appliances |
| ISBN | : 1615030913 |
| Author | : D. Nirmal |
| Publisher | : CRC Press |
| Total Pages | : 446 |
| Release | : 2019-05-14 |
| Genre | : Science |
| ISBN | : 0429862520 |
This book focusses on III-V high electron mobility transistors (HEMTs) including basic physics, material used, fabrications details, modeling, simulation, and other important aspects. It initiates by describing principle of operation, material systems and material technologies followed by description of the structure, I-V characteristics, modeling of DC and RF parameters of AlGaN/GaN HEMTs. The book also provides information about source/drain engineering, gate engineering and channel engineering techniques used to improve the DC-RF and breakdown performance of HEMTs. Finally, the book also highlights the importance of metal oxide semiconductor high electron mobility transistors (MOS-HEMT). Key Features Combines III-As/P/N HEMTs with reliability and current status in single volume Includes AC/DC modelling and (sub)millimeter wave devices with reliability analysis Covers all theoretical and experimental aspects of HEMTs Discusses AlGaN/GaN transistors Presents DC, RF and breakdown characteristics of HEMTs on various material systems using graphs and plots
| Author | : Abdoulaye Gamatié |
| Publisher | : Springer |
| Total Pages | : 283 |
| Release | : 2014-10-11 |
| Genre | : Technology & Engineering |
| ISBN | : 3319082396 |
This book describes the trends, challenges and solutions in computing use for scientific research and development within different domains in Africa, such as health, agriculture, environment, economy, energy, education and engineering. The benefits expected are discussed by a number of recognized, domain-specific experts, with a common theme being computing as solution enabler. This book is the first document providing such a representative up-to-date view on this topic at the continent level.
| Author | : Sergey Balandin |
| Publisher | : Springer |
| Total Pages | : 817 |
| Release | : 2015-08-12 |
| Genre | : Computers |
| ISBN | : 331923126X |
This book constitutes the joint refereed proceedings of the 15th International Conference on Next Generation Wired/Wireless Advanced Networks and Systems, NEW2AN 2015, and the 8th Conference on Internet of Things and Smart Spaces, ruSMART 2015, held in St. Petersburg, Russia, in August 2015. The 74 revised full papers were carefully reviewed and selected from numerous submissions. The 15 papers selected for ruSMART are organized in topical sections on IoT infrastructure, IoT platforms, smart spaces and IoT cases, and smart services and solutions. The 59 papers from NEW2AN deal with the following topics: streaming, video, and TCP applications, mobile "ad hoc" networks, security, and clouds, sensor networks and IoT, cellular systems, novel systems and techniques, business and services, signals and circuits, optical and satellite systems, and advanced materials and their properties.
| Author | : Chuan Seng Tan |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 365 |
| Release | : 2009-06-29 |
| Genre | : Technology & Engineering |
| ISBN | : 0387765344 |
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
