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| Author | : Thomas Brunschwiler |
| Publisher | : |
| Total Pages | : 172 |
| Release | : 2012-04-12 |
| Genre | : |
| ISBN | : 9783954040346 |
| Author | : Paul D. Franzon |
| Publisher | : John Wiley & Sons |
| Total Pages | : 488 |
| Release | : 2019-05-06 |
| Genre | : Technology & Engineering |
| ISBN | : 3527338551 |
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
| Author | : John R Thome |
| Publisher | : World Scientific Publishing |
| Total Pages | : 1372 |
| Release | : 2018-05-18 |
| Genre | : Technology & Engineering |
| ISBN | : 9813234385 |
Set IV is a new addition to the previous Sets I, II and III. It contains 23 invited chapters from international specialists on the topics of numerical modeling of pulsating heat pipes and of slug flows with evaporation; lattice Boltzmann modeling of pool boiling; fundamentals of boiling in microchannels and microfin tubes, CO2 and nanofluids; testing and modeling of micro-two-phase cooling systems for electronics; and various special topics (flow separation in microfluidics, two-phase sensors, wetting of anisotropic surfaces, ultra-compact heat exchangers, etc.). The invited authors are leading university researchers and well-known engineers from leading corporate research laboratories (ABB, IBM, Nokia Bell Labs). Numerous 'must read' chapters are also included here for the two-phase community. Set IV constitutes a 'must have' engineering and research reference together with previous Sets I, II and III for thermal engineering researchers and practitioners.
| Author | : Dongkai Shangguan |
| Publisher | : CRC Press |
| Total Pages | : 463 |
| Release | : 2024-06-28 |
| Genre | : Technology & Engineering |
| ISBN | : 1040028640 |
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
| Author | : Calvin R. King (Jr) |
| Publisher | : |
| Total Pages | : |
| Release | : 2012 |
| Genre | : Heat |
| ISBN | : |
Heat removal technologies are among the most critical needs for three-dimensional (3D) stacking of high-performance microprocessors. This research reports a 3D integration platform that can support the heat removal requirements for 3D integrated circuits that contain high-performance microprocessors in the 3D stack. :This work shows the use of wafer-level batch fabrication to develop advanced electrical and fluidic three-dimensional interconnect networks in a 3D stack. Fabrication results are shown for the integration of microchannels and electrical through-silicon vias (TSVs). A compact physical model is developed to determine the design trade-offs for microchannel heat sink and electrical TSV integration. An experimental thermal measurement test-bed for evaluating a 3D inter-layer liquid cooling platform is developed. Experimental thermal testing results for an air-cooled chip and a liquid-cooled chip are compared. Microchannel heat sink cooling shows a significant junction temperature and heat sink thermal resistance reduction compared to air-cooling. The on-chip integrated microchannel heat sink, which has a thermal resistance of 0.229 °C/W, enables cooling of>100W/cm2 of each high-power density chip, while maintaining an average junction temperature of less than 50°C. Cooling liquid is circulated through the 3D stack (two layers) at flow rates of up to 100 ml/min. :The ability to assemble chips with integrated electrical and fluidic I/Os and seal fluidic interconnections at each strata interface is demonstrated using three assembly and fluidic sealing techniques. Assembly results show the stacking of up to four chips that contain integrated electrical and fluidic I/O interconnects, with an electrical I/O density of ~1600/cm2.
| Author | : Anil Leblebici |
| Publisher | : Springer |
| Total Pages | : 227 |
| Release | : 2018-12-24 |
| Genre | : Technology & Engineering |
| ISBN | : 3319991094 |
This book presents the overall vision and research outcomes of Nano-Tera.ch, which is a landmark Swiss federal program to advance engineering system and device technologies with applications to Health and the Environment, including smart Energy generation and consumption. The authors discuss this unprecedented nation-wide program, with a lifetime of almost 10 years and a public funding of more than 120 MCHF, which helped to position Switzerland at the forefront of the research on multi-scale engineering of complex systems and networks, and strongly impacted the Swiss landscape in Engineering Sciences.
| Author | : Jörg Dubbert |
| Publisher | : Springer |
| Total Pages | : 201 |
| Release | : 2018-08-17 |
| Genre | : Technology & Engineering |
| ISBN | : 3319997629 |
This volume of the Lecture Notes in Mobility series contains papers written by speakers at the 22nd International Forum on Advanced Microsystems for Automotive Applications (AMAA 2018) "Smart Systems for Clean, Safe and Shared Road Vehicles" that was held in Berlin, Germany in September 2018. The authors report about recent breakthroughs in electric and electronic components and systems, driver assistance, vehicle automation and electrification as well as data, clouds and machine learning. Furthermore, innovation aspects and impacts of connected and automated driving are covered. The target audience primarily comprises research experts and practitioners in industry and academia, but the book may also be beneficial for graduate students alike.
| Author | : Philip Garrou |
| Publisher | : John Wiley & Sons |
| Total Pages | : 798 |
| Release | : 2011-09-22 |
| Genre | : Technology & Engineering |
| ISBN | : 352762306X |
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
| Author | : Weixia Xu |
| Publisher | : Springer |
| Total Pages | : 197 |
| Release | : 2016-01-13 |
| Genre | : Computers |
| ISBN | : 3662492830 |
This book constitutes the refereed proceedings of the 19th CCF Conference on Computer Engineering and Technology, NCCET 2015, held in Hefei, China, in October 2015. The 18 papers presented were carefully reviewed and selected from 158 submissions. They are organized in topical sections on processor architecture; application specific processors; computer application and software optimization; technology on the horizon.
| Author | : Rohit Sharma |
| Publisher | : CRC Press |
| Total Pages | : 328 |
| Release | : 2018-09-03 |
| Genre | : Technology & Engineering |
| ISBN | : 1351831593 |
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
