Interfacial Forces In Chemical Mechanical Polishing Cmp PDF Download
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Author | : Dedy Ng |
Publisher | : |
Total Pages | : |
Release | : 2010 |
Genre | : |
ISBN | : |
Download Interfacial Forces in Chemical-mechanical Polishing (CMP) Book in PDF, ePub and Kindle
The demand for microelectronic device miniaturization requires new concepts and technology improvement in the integrated circuits fabrication. In last two decades, Chemical-Mechanical Polishing (CMP) has emerged as the process of choice for planarization. The process takes place at the interface of a substrate, a polishing pad, and an abrasive containing slurry. This synergetic process involves several forces in multi-length scales and multi-mechanisms. This research contributes fundamental understanding of surface and interface sciences of microelectronic materials with three major objectives. In order to extend the industrial impact of this research, the chemical-mechanical polishing (CMP) is used as a model system for this study. The first objective of this research is to investigate the interfacial forces in the CMP system. For the first time, the interfacial forces are discussed systematically and comparatively so that key forces in CMP can be pinpointed. The second objective of this research is to understand the basic principles of lubrication, i.e., fluid drag force that can be used to monitor, evaluate, and optimize CMP processes. New parameters were introduced to include the change of material properties during CMP. Using the experimental results, a new equation was developed to understand the principle of lubrication behind the CMP. The third objective is to study the synergy of those interfacial forces with electrochemistry. The electro-chemical-mechanical polishing (ECMP) of copper was studied. Experiments were conducted on the tribometer in combination with a potentiostat. Friction coefficient was used to monitor the polishing process and correlated with the wear behavior of post-CMP samples. Surface characterization was performed using AFM, SEM, and XPS techniques. Results from experiments were used to generate a new wear model, which provided insight from CMP mechanisms. The ECMP is currently the newest technique used in the semiconductor industries. This research is expected to contribute to the CMP technology and improve its process performance. This dissertation consists of six chapters. The first chapter covers the introduction and background information of surface forces and CMP. The motivation and objectives are discussed in the second chapter. The three major objectives which include approaches and expected results are covered in the next three chapters. Finally chapter VI summarizes the major discovery in this research and provides some recommendations for future work.
Author | : Wonseop Choi |
Publisher | : |
Total Pages | : 324 |
Release | : 2003 |
Genre | : |
ISBN | : |
Download Study of Interfacial Interaction During Chemical Mechanical Polishing (cmp) of Dielectric Silicon Dioxide Book in PDF, ePub and Kindle
Author | : Mingjie Zhong |
Publisher | : |
Total Pages | : 350 |
Release | : 2013 |
Genre | : Chemical mechanical planarization |
ISBN | : |
Download Interfacial Chemistry in Chemical Mechanical Planarization (CMP) and Post-CMP Cleaning of Surfaces for Microelestronic Applications Book in PDF, ePub and Kindle
Author | : R. Rhoades |
Publisher | : The Electrochemical Society |
Total Pages | : 93 |
Release | : 2016-09-21 |
Genre | : Science |
ISBN | : 1607687453 |
Download Chemical Mechanical Polishing 14 Book in PDF, ePub and Kindle
Author | : Sudipta Seal |
Publisher | : The Electrochemical Society |
Total Pages | : 370 |
Release | : 2003 |
Genre | : Technology & Engineering |
ISBN | : 9781566774048 |
Download Chemical Mechanical Planarization VI Book in PDF, ePub and Kindle
Author | : S. V. Babu |
Publisher | : |
Total Pages | : 304 |
Release | : 2000-02-10 |
Genre | : Technology & Engineering |
ISBN | : |
Download Chemical-Mechanical Polishing - Fundamentals and Challenges: Volume 566 Book in PDF, ePub and Kindle
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author | : Babu Suryadevara |
Publisher | : Woodhead Publishing |
Total Pages | : 650 |
Release | : 2021-09-10 |
Genre | : Technology & Engineering |
ISBN | : 0128218193 |
Download Advances in Chemical Mechanical Planarization (CMP) Book in PDF, ePub and Kindle
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP
Author | : Yongsik Moon |
Publisher | : |
Total Pages | : 436 |
Release | : 1999 |
Genre | : |
ISBN | : |
Download Mechanical Aspects of the Material Removal Mechanism in Chemical Mechanical Polishing (CMP) Book in PDF, ePub and Kindle
Author | : A. Kumar |
Publisher | : |
Total Pages | : 330 |
Release | : 2005-07-19 |
Genre | : Technology & Engineering |
ISBN | : |
Download Chemical-Mechanical Planarization: Volume 867 Book in PDF, ePub and Kindle
Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.
Author | : Yuzhuo Li |
Publisher | : John Wiley & Sons |
Total Pages | : 760 |
Release | : 2007-12-04 |
Genre | : Technology & Engineering |
ISBN | : 9780470180891 |
Download Microelectronic Applications of Chemical Mechanical Planarization Book in PDF, ePub and Kindle
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.