Interconnect Technology And Design For Gigascale Integration PDF Download
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| Author | : Jeffrey A. Davis |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 417 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1461504619 |
Download Interconnect Technology and Design for Gigascale Integration Book in PDF, ePub and Kindle
This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
| Author | : Partha Pratim Pande |
| Publisher | : |
| Total Pages | : 80 |
| Release | : 2010 |
| Genre | : |
| ISBN | : |
Download Special Issue on Emerging Interconnect Technologies for Gigascale Integration Book in PDF, ePub and Kindle
| Author | : Raguraman Venkatesan |
| Publisher | : |
| Total Pages | : 602 |
| Release | : 2002 |
| Genre | : Microprocessors |
| ISBN | : |
Download Multilevel Interconnect Architectures for Gigascale Integration (GSI) Book in PDF, ePub and Kindle
| Author | : Jeffrey Alan Davis |
| Publisher | : |
| Total Pages | : 482 |
| Release | : 1999 |
| Genre | : Digital electronics |
| ISBN | : |
Download A Hierarchy of Interconnect Limits and Opportunities for Gigascale Integration (GSI) Book in PDF, ePub and Kindle
| Author | : Wenceslau J. Goedert |
| Publisher | : |
| Total Pages | : 14 |
| Release | : 1967 |
| Genre | : |
| ISBN | : |
Download Contribuição ao estudo das argilas dos solos do Rio Grande do Sul Book in PDF, ePub and Kindle
| Author | : James D. Meindl |
| Publisher | : |
| Total Pages | : |
| Release | : 2003 |
| Genre | : |
| ISBN | : |
Download Focus Center Research Program for Interconnects for Gigascale Integration Book in PDF, ePub and Kindle
| Author | : Muhannad S. Bakir |
| Publisher | : Artech House |
| Total Pages | : 551 |
| Release | : 2008-11-30 |
| Genre | : Technology & Engineering |
| ISBN | : 1596932473 |
Download Integrated Interconnect Technologies for 3D Nanoelectronic Systems Book in PDF, ePub and Kindle
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
| Author | : Yash Agrawal |
| Publisher | : Springer Nature |
| Total Pages | : 286 |
| Release | : 2023-10-17 |
| Genre | : Technology & Engineering |
| ISBN | : 9819944767 |
Download Interconnect Technologies for Integrated Circuits and Flexible Electronics Book in PDF, ePub and Kindle
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
| Author | : Oluwafemi O. Ogunsola |
| Publisher | : |
| Total Pages | : 209 |
| Release | : 2006 |
| Genre | : |
| ISBN | : 9783863090135 |
Download Prospects for Mirror-enabled Polymer Pillar I/O Optical Interconnects for Gigascale Integration Book in PDF, ePub and Kindle
Digital systems have derived performance benefits due to the scaling down of CMOS microprocessor feature sizes towards packing billions of transistors on a chip, or gigascale integration (GSI). This has placed immense bandwidth demands on chip-to-chip and chip-to-board interconnects. The present-day electrical interconnect may limit bandwidth as transmission rates grow. As such, optical interconnects have been proposed as a potential solution. A critical requirement for enabling chip-to-chip and chip-to-board optical interconnection is out-of-plane coupling for directing light between a chip and the board. Any solution for this problem must be compatible with conventional packaging and assembly requirements. This research addresses the prospects for integrating waveguides with mirrors and polymer pillar optical I/O interconnects to provide such a compatible, out-of-plane, chip-to-board packaging solution through the design, analysis, fabrication, and testing of its constituent parts and their ultimate integration.
| Author | : Gerald Gabriel Lopez |
| Publisher | : |
| Total Pages | : |
| Release | : 2009 |
| Genre | : Copper |
| ISBN | : |
Download The Impact of Interconnect Process Variations and Size Effects for Gigascale Integration Book in PDF, ePub and Kindle
The objective of this research is to demonstrate the impact of interconnect process variations, line-edge roughness and size effects on interconnect effective resistivity and ultimately chip performance. The investigation is accomplished through five tasks. In Task I, a new closed-form effective resistivity model, which is a function of line-edge roughness (LER), surface specularity and grain boundary reflectivity, is derived. In Task II, a critical path model is enhanced by including interconnect parasitics using the model in Task I. This enhancement also involves an extensive survey of foundry process data to shed light on the device resistance estimation used in the critical path model in Task II. Task III develops a Monte Carlo (MC) simulation framework called the Fast Interconnect Statistical Simulator (FISS). Using the latest International Technology Roadmap for Semiconductors (ITRS) projections, the FISS projects the impact of interconnect process variations and size effects onto high performance microprocessor units (HP-MPUs). Task IV fabricates metallic interconnect test structures with sub-100nm line-widths. The fifth task statistically calibrates the model from Task I using resistivity data measured from the test structures in Task IV.
