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Integrated Circuit Reliability and Manufacturing Science Program

Integrated Circuit Reliability and Manufacturing Science Program
Author: Joseph H. Scott
Publisher:
Total Pages: 97
Release: 1973
Genre:
ISBN:

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The report describes results of a study aimed at lowering the cost of high-reliability integrated circuits. The circuit family chosen for the study was RCA's CMOS product line, and recommendations are developed specifying changes in the existing process line, aimed at improving the reliability of the finished products. The intention has been to provide reliability inspection and quality control procedures which can be distributed throughout the manufacturing process, replacing the present approach of performing all high-reliability screening at the end of the manufacturing process. The cost and trade-offs of implementing these changes have been analyzed where possible. Where such analysis was not possible, a research schedule was prepared to provide the data necessary for evaluation of the proposed change. The most important of the proposed changes form an integrated concept in which wafers move through an automated production line under computer control.


Integrated Circuit Reliability and Manufacturing Science (ICRMS) - A Technical Overview

Integrated Circuit Reliability and Manufacturing Science (ICRMS) - A Technical Overview
Author: C. E Holland (Jr)
Publisher:
Total Pages: 136
Release: 1974
Genre:
ISBN:

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The present state-of-the-art in IC manufacturing is described in terms of electrical and physical limitations. The critical limitations of present IC manufacturing techniques and promising advanced fabrication techniques for overcoming these limitations are described for basic IC process areas. These process areas include wafer cleaning and handling, patterning, dielectric film formation, doping, metalization, bonding, assembly, packaging, diagnostics, prognostics, automation and control. In each of these areas, the potential benefits which could be realized by the Navy through the development of advanced manufacturing techniques are forecast in terms of future IC reliability, cost, complexity, and performance.


Integrated Circuit Quality and Reliability

Integrated Circuit Quality and Reliability
Author: Eugene R. Hnatek
Publisher:
Total Pages: 736
Release: 1987
Genre: Technology & Engineering
ISBN:

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Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.


NBS Special Publication

NBS Special Publication
Author:
Publisher:
Total Pages: 956
Release: 1974
Genre: Weights and measures
ISBN:

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Reliability, Yield, and Stress Burn-In

Reliability, Yield, and Stress Burn-In
Author: Way Kuo
Publisher: Springer Science & Business Media
Total Pages: 407
Release: 2013-11-27
Genre: Technology & Engineering
ISBN: 1461556716

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The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.


Mantech Project Book, 1992

Mantech Project Book, 1992
Author:
Publisher: DIANE Publishing
Total Pages: 234
Release: 1993-06
Genre:
ISBN: 9781568066059

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Provides a summary of the projects the Air Force MANTECH Directorate has in progress or has completed within the last 10 years. Its purpose is to promote the transfer of technology which was developed through these investments into the defense industrial base.


ULSI Science and Technology/1987

ULSI Science and Technology/1987
Author: S. Broydo
Publisher:
Total Pages: 874
Release: 1987
Genre: Integrated circuits
ISBN:

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