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Failure Analysis of Integrated Circuits

Failure Analysis of Integrated Circuits
Author: Lawrence C. Wagner
Publisher: Springer Science & Business Media
Total Pages: 256
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1461549191

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This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.


Integrated Circuit Failure Analysis

Integrated Circuit Failure Analysis
Author: Friedrich Beck
Publisher: John Wiley & Sons
Total Pages: 198
Release: 1998-02-04
Genre: Technology & Engineering
ISBN: 9780471974017

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Funktionstests an integrierten Schaltungen sind für deren Zuverlässigkeit von herausragender Bedeutung. Erstmals werden in diesem Werk die speziellen Präparationstechniken für die Fehleranalyse beschrieben. Ausgehend von den theoretischen Grundlagen erläutert der Autor in praxisnahem Stil die verschiedenen Techniken, die das Zurückverfolgen von Ausfällen ermöglichen.


Failure-Free Integrated Circuit Packages

Failure-Free Integrated Circuit Packages
Author: Charles Cohn
Publisher: McGraw-Hill Professional Engin
Total Pages: 392
Release: 2005
Genre: Technology & Engineering
ISBN:

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The shrinking of integrated circuits (ICs) puts tremendous stress on overall device reliability. This unique treatment uses graphic illustration to clearly identify all major failure mode types, so engineers can spot failures before they occur.


Microelectronics Fialure Analysis Desk Reference, Seventh Edition

Microelectronics Fialure Analysis Desk Reference, Seventh Edition
Author: Tejinder Gandhi
Publisher: ASM International
Total Pages: 750
Release: 2019-11-01
Genre: Technology & Engineering
ISBN: 1627082468

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The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.


Electronic Failure Analysis Handbook

Electronic Failure Analysis Handbook
Author: Perry L. Martin
Publisher: McGraw Hill Professional
Total Pages: 770
Release: 1999
Genre: Technology & Engineering
ISBN: 9780070410442

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Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.


Microelectronics Failure Analysis

Microelectronics Failure Analysis
Author: EDFAS Desk Reference Committee
Publisher: ASM International
Total Pages: 673
Release: 2011
Genre: Technology & Engineering
ISBN: 1615037268

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Includes bibliographical references and index.


Microelectronics Failure Analysis

Microelectronics Failure Analysis
Author:
Publisher: ASM International
Total Pages: 813
Release: 2004-01-01
Genre: Technology & Engineering
ISBN: 0871708043

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For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron


2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Author: IEEE Staff
Publisher:
Total Pages:
Release: 2016-07-18
Genre:
ISBN: 9781467382601

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IPFA is devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability, yield and performance, especially those related to advanced process technologies