Hybrid Circuit Design And Manufacture PDF Download
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Author | : Roydn D. Jones |
Publisher | : CRC Press |
Total Pages | : 238 |
Release | : 2020-08-13 |
Genre | : Technology & Engineering |
ISBN | : 1000148947 |
Download Hybrid Circuit Design and Manufacture Book in PDF, ePub and Kindle
This book provides a basic understanding of the design guidelines for a wide range of hybrid circuits, both thick and thin film, covering a wide range of frequencies. It is intended for electronic engineering designers and design managers who seek a background in hybrid technology.
Author | : Jones |
Publisher | : CRC Press |
Total Pages | : 225 |
Release | : 2020-08-13 |
Genre | : Technology & Engineering |
ISBN | : 1000105733 |
Download Hybrid Circuit Design and Manufacture Book in PDF, ePub and Kindle
This book provides a basic understanding of the design guidelines for a wide range of hybrid circuits, both thick and thin film, covering a wide range of frequencies. It is intended for electronic engineering designers and design managers who seek a background in hybrid technology.
Author | : Taraseiskey |
Publisher | : CRC Press |
Total Pages | : 336 |
Release | : 2018-10-08 |
Genre | : Technology & Engineering |
ISBN | : 1482292165 |
Download Power Hybrid Circuit Design & Manufacture Book in PDF, ePub and Kindle
"Discusses the fundamental design principles, capabilities, and applications of power hybrid microcircuits and modules--detailing the operation of power semiconductor and passive components, the properties of materials, design guidelines, thermal management, and manufacturing technologies."
Author | : James J. Licari |
Publisher | : Elsevier |
Total Pages | : 603 |
Release | : 1998-12-31 |
Genre | : Technology & Engineering |
ISBN | : 081551798X |
Download Hybrid Microcircuit Technology Handbook Book in PDF, ePub and Kindle
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
Author | : Fred W. Kear |
Publisher | : CRC Press |
Total Pages | : 296 |
Release | : 2020-07-25 |
Genre | : Technology & Engineering |
ISBN | : 1000104591 |
Download Hybrid Assemblies and Multichip Modules Book in PDF, ePub and Kindle
Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.
Author | : Fred W. Kear |
Publisher | : CRC Press |
Total Pages | : 298 |
Release | : 2020-07-24 |
Genre | : Technology & Engineering |
ISBN | : 1000147800 |
Download Hybrid Assemblies and Multichip Modules Book in PDF, ePub and Kindle
Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.
Author | : Bradford L. Smith |
Publisher | : Taylor & Francis |
Total Pages | : 466 |
Release | : 1993 |
Genre | : Technology & Engineering |
ISBN | : 9780442316280 |
Download Microwave Engineering Handbook: Microwave circuits, antennas, and propagation Book in PDF, ePub and Kindle
This second volume of the three-volume complete reference on microwave engineering covers all of the major circuit types used in microwave systems, and also covers antennas and propagation, an area vital to microwave systems. The emphasis is on fundamental principles and practical hardware, providing a wealth of information for engineers and system designers. Annotation copyright by Book News, Inc., Portland, OR
Author | : Lucian Stoica |
Publisher | : CRC Press |
Total Pages | : 161 |
Release | : 2022-09-01 |
Genre | : Technology & Engineering |
ISBN | : 1000795454 |
Download High Temperature Electronics Design for Aero Engine Controls and Health Monitoring Book in PDF, ePub and Kindle
There is a growing desire to install electronic power and control systems in high temperature harsh environments to improve the accuracy of critical measurements, reduce the amount of cabling and to eliminate cooling systems. Typical target applications include electronics for energy exploration, power generation and control systems. Technical topics presented in this book include:• High temperature electronics market• High temperature devices, materials and assembly processes• Design, manufacture and testing of multi-sensor data acquisition system for aero-engine control• Future applications for high temperature electronicsHigh Temperature Electronics Design for Aero Engine Controls and Health Monitoring contains details of state of the art design and manufacture of electronics targeted towards a high temperature aero-engine application. High Temperature Electronics Design for Aero Engine Controls and Health Monitoring is ideal for design, manufacturing and test personnel in the aerospace and other harsh environment industries as well as academic staff and master/research students in electronics engineering, materials science and aerospace engineering.
Author | : |
Publisher | : ASM International |
Total Pages | : 1234 |
Release | : 1989-11-01 |
Genre | : Technology & Engineering |
ISBN | : 9780871702852 |
Download Electronic Materials Handbook Book in PDF, ePub and Kindle
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author | : Peter Ernst Rudolf Oberbeck |
Publisher | : |
Total Pages | : 47 |
Release | : 1967 |
Genre | : Electronic digital computers |
ISBN | : |
Download Hybrid Circuit Design for the Artrix Graphical Processor Book in PDF, ePub and Kindle