High Q Cmos Compatible Poly Sige Electrostatic Rf Mems Resonators PDF Download
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Author | : Brian Lee Bircumshaw |
Publisher | : |
Total Pages | : 386 |
Release | : 2005 |
Genre | : |
ISBN | : |
Download High-Q CMOS-compatible Poly-SiGe Electrostatic RF MEMS Resonators Book in PDF, ePub and Kindle
Author | : Kuan-Lin Chen |
Publisher | : |
Total Pages | : |
Release | : 2010 |
Genre | : |
ISBN | : |
Download Thin-film Encapsulation of High Frequency MEMS Resonator for RF Applications Book in PDF, ePub and Kindle
Wireless communication has greatly impacted our daily life since the first radio system was invented. Applications, such as cellular phone, satellite television, GPS navigation, and wireless Internet network, are driving the development of RF components to the direction of being smaller, cheaper and more power saving and therefore this topic has been one of the hottest research areas in MEMS field. MEMS resonators have a great potential for replacing conventional resonators used in portable wireless applications because of their merits of small size, high quality factor (Q), and low power consumption. There are also great interests in using coupled micro-resonators as band-pass filters and many research groups have already got exciting results. However, high motional impedance still remains a big obstacle for commercialization of MEMS resonators in RF applications. Despite the advance of device performance, packaging for MEMS resonators remains a critical challenge. Because of their extreme sensitivity to the environment, MEMS resonators need a vacuum packaging to achieve high quality factors (Q) and enable post-MEMS CMOS integration. The promising on-chip application also requires a CMOS compatible packaging process. Due to the stringent RF requirement, electrical properties and hermiticity of packaging are also very important. This work aims to provide a solution for a practical RF MEMS resonator that has low impedance as well as a reliable packaging. First, this work presents a thorough study of a wafer-level epitaxial silicon encapsulation process in making RF MEMS resonators. The epitaxial silicon encapsulation process developed at Stanford University has been proven to have high mechanical robustness and it provides a low-pressure environment to resonating structures. The transmission loss of silicon interconnect was measured at RF ranges in this work. The transmission loss was also modeled for device designers to simulate the interconnect properties at the design phase. Secondly, a 200 MHz width-extensional mode dielectrically-driven resonator is presented. High-k dielectric material was used to enhance the transduction and reduce the motional impedance. A modified encapsulation process was developed to package the resonator. The resonator was demonstrated to have high Q in the package. In addition, this work presents an integrated solution for wafer-level packaging and electrostatic actuation of out-of-plane RF MEMS resonators. By integrating the electrodes into the epitaxial-grown silicon layer, both the encapsulation and the out-of-plane actuation can be built in one process step, which results in an ultra-compact and robust packaging. First, designs and fabrication processes of the out-of-plane electrode are described. The mechanical and electrical properties of the electrode are discussed, modeled and characterized. A 200 kHz torsional mode beam resonator and a 12 MHz transverse-mode differential square plate resonator were fabricated using this packaging method and their performances are presented and discussed. This work also presents a 13 MHz mechanically coupled filter that is encapsulated using the same integration process.
Author | : |
Publisher | : |
Total Pages | : 942 |
Release | : 2006 |
Genre | : Dissertations, Academic |
ISBN | : |
Download Dissertation Abstracts International Book in PDF, ePub and Kindle
Author | : Philip Jason Stephanou |
Publisher | : |
Total Pages | : 404 |
Release | : 2006 |
Genre | : |
ISBN | : |
Download Piezoelectric Aluminum Nitride MEMS Resonators for RF Signal Processing Book in PDF, ePub and Kindle
Author | : Maryam Ziaei-Moayyed |
Publisher | : |
Total Pages | : |
Release | : 2009 |
Genre | : |
ISBN | : |
Download Internal Electrostatic Transduction of Micromechanical Resonators Book in PDF, ePub and Kindle
Micromechanical signal processors have a great potential to revolutionize the wireless system architectures by offering a pathway toward full system integration, miniaturization, and lower power consumption. Laterally driven electrostatic micromechanical resonators with high quality factors and frequencies beyond 1GHz have been previously demonstrated. One of the major challenges in the integration of electrostatic MEMS resonators with integrated circuits has been their high motional resistance. Internal electrostatic transduction is introduced as a solution to achieve micromechanical resonators in the radio and microwave frequencies, with low motional resistances, and high quality factors in air. A manufacturable double nanogap process introduced in this thesis allows for fabrication of many high aspect-ratio nano-scale dielectric "gaps" within a single resonator using a combination of lithography and dielectric deposition. Quartz is introduced as a desirable substrate for MEMS resonators, allowing for direct two-port measurements at RF and microwave frequencies. Higher-order mode internally transduced ring resonators are designed, fabricated, and tested in this work. A fifth order dielectrically transduced ring resonator at 1.95GHz is measured on a quartz substrate using direct two-port transmission measurement. The proper placement of dielectric within the resonating structure allowed for a Q of greater than 9000 in air. The concept of serpentine internal electrostatic transduction is introduced, which allows for many capacitances to be transduced in parallel, resulting in a lower motional resistance. The 41st radial bulk mode of a two-port serpentine ring resonator was demonstrated at 2.74 GHz, with a quality factor of 7000 in air. This resonator has a high f x Q product of 1.93x1013, with a low motional resistance of less than 500W. This is the highest f x Q product demonstrated for a polysilicon MEMS resonator in air. This resonator also exhibited the lowest motional resistance demonstrated for an electrostatic polysilicon MEMS resonator in the GHz frequency range. These results demonstrate that internal electrostatic transduction is suitable for the efficient, selective excitation of higher-order lateral bulk modes in resonators. The concept of parallel internal electrostatic transduction is introduced, where a Lamé-mode resonator with integrated electrodes was designed, fabricated, and tested successfully. The integrated electrodes were placed within the resonating plate to efficiently couple to the Lamé mode of resonance, which allows for a fully differential drive/sense scheme. This measurement method allows for lower ohmic losses and helps to suppress the feedthrough significantly. This resonator demonstrated a high quality factor of> 12000 in air at 128.15MHz. Such a high quality factor makes this resonator attractive for different applications. These results validate internal electrostatic transduction of bulk-mode resonators as a viable method for efficient transduction of MEMS resonators in RF and microwave regime. The resonators in this thesis demonstrate the capacity of internal electrostatic transduction to achieve high quality factor, high frequency microresonators with low motional resistance that can be integrated with CMOS technology to achieve fully integrated communication systems.
Author | : |
Publisher | : Institute of Electrical & Electronics Engineers(IEEE) |
Total Pages | : 926 |
Release | : 2004 |
Genre | : Science |
ISBN | : 9780780382657 |
Download 17th IEEE International Conference on Micro Electro Mechanical Systems Book in PDF, ePub and Kindle
Author | : Masayoshi Esashi |
Publisher | : John Wiley & Sons |
Total Pages | : 528 |
Release | : 2021-03-16 |
Genre | : Technology & Engineering |
ISBN | : 3527823255 |
Download 3D and Circuit Integration of MEMS Book in PDF, ePub and Kindle
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author | : Henry Baltes |
Publisher | : John Wiley & Sons |
Total Pages | : 612 |
Release | : 2008-07-11 |
Genre | : Technology & Engineering |
ISBN | : 3527616934 |
Download CMOS - MEMS Book in PDF, ePub and Kindle
Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Sensor systems, microreactors, nanostructures, nanomachines, functional surfaces, integrated optics, displays, communications technology, biochips, human/machine interfaces, prosthetics, miniaturized medical and surgery equipment and many more opportunities are being explored. This new series, Advanced Micro and Nano Systems, provides cutting-edge reviews from top authors on technologies, devices and advanced systems from the micro and nano worlds.
Author | : Reza Ghodssi |
Publisher | : Springer Science & Business Media |
Total Pages | : 1211 |
Release | : 2011-03-18 |
Genre | : Technology & Engineering |
ISBN | : 0387473181 |
Download MEMS Materials and Processes Handbook Book in PDF, ePub and Kindle
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
Author | : Institute of Electrical and Electronics Engineers |
Publisher | : |
Total Pages | : 1462 |
Release | : 1997 |
Genre | : Electric engineering |
ISBN | : |
Download Index to IEEE Publications Book in PDF, ePub and Kindle
Issues for 1973- cover the entire IEEE technical literature.