High Frequency Capacitive Single Crystal Silicon Resonators And Coupled Resonator Systems PDF Download

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High Frequency Capacitive Single Crystal Silicon Resonators and Coupled Resonator Systems

High Frequency Capacitive Single Crystal Silicon Resonators and Coupled Resonator Systems
Author: Siavash Pourkamali
Publisher:
Total Pages:
Release: 2006
Genre: Electric resonators
ISBN:

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The objective of the work presented in this thesis is to implement high-Q silicon capacitive micromechanical resonators operating in the HF, VHF and UHF frequency bands. Several variations of a fully silicon-based bulk micromachining fabrication process referred to as HARPSS have been developed, characterized and optimized to overcome most of the challenges facing application of such devices as manufacturable electronic components. Several micromechanical structures for implementation of high performance capacitive silicon resonators covering various frequency ranges have been developed under this work. Design criteria and electromechanical modeling of such devices is presented. Under this work, HF and VHF resonators with quality factors in the tens of thousands and RF-compatible equivalent electrical impedances have been implemented successfully. Resonance frequencies in the GHz range with quality factors of a few thousands and lowest motional impedances reported for capacitive resonators to date have been achieved. Several resonator coupling techniques for implementation of higher order resonant systems with possibility of extension to highly selective bandpass filters have been investigated and practically demonstrated. Finally, a wafer-level vacuum sealing technique applicable to such resonators has been developed and its reliability and hermeticity is characterized.


Capacitive Silicon Resonators

Capacitive Silicon Resonators
Author: Nguyen Van Toan
Publisher: CRC Press
Total Pages: 170
Release: 2019-07-10
Genre: Technology & Engineering
ISBN: 0429560990

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Microfabricated resonators play an essential role in a variety of applications, including mass sensing, timing reference applications, and filtering applications. Many transduction mechanisms including piezoelectric, piezoresistive, and capacitive mechanisms, have been studied to induce and detect the motion of resonators. This book is meant to introduce and suggest several technological approaches together with design considerations for performance enhancement of capacitive silicon resonators, and will be useful for those working in field of micro and nanotechnology. Features Introduces and suggests several technological approaches together with design considerations for performance enhancement of capacitive silicon resonators Provides information on the various fabrication technologies and design considerations that can be employed to improve the performance capacitive silicon resonator which is one of the promising options to replace the quartz crystal resonator. Discusses several technological approaches including hermetic packaging based on the LTCC substrate, deep reactive ion etching, neutral beam etching technology, and metal-assisted chemical etching, as well as design considerations for mechanically coupled, selective vibration of high-order mode, movable electrode structures, and piezoresistive heat engines were investigated to achieve small motional resistance, low insertion loss, and high quality factor. Focusses on a capacitive sensing method based on the measurement of the change in capacitance between a sensing electrode and the resonant body. Reviews recent progress in performance enhancement methods for capacitive silicon resonator, which are mainly based on the works of the authors.


Capacitive Silicon Resonators

Capacitive Silicon Resonators
Author: Nguyen Van Toan
Publisher: CRC Press
Total Pages: 177
Release: 2019-07-10
Genre: Technology & Engineering
ISBN: 0429556527

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Microfabricated resonators play an essential role in a variety of applications, including mass sensing, timing reference applications, and filtering applications. Many transduction mechanisms including piezoelectric, piezoresistive, and capacitive mechanisms, have been studied to induce and detect the motion of resonators. This book is meant to introduce and suggest several technological approaches together with design considerations for performance enhancement of capacitive silicon resonators, and will be useful for those working in field of micro and nanotechnology. Features Introduces and suggests several technological approaches together with design considerations for performance enhancement of capacitive silicon resonators Provides information on the various fabrication technologies and design considerations that can be employed to improve the performance capacitive silicon resonator which is one of the promising options to replace the quartz crystal resonator. Discusses several technological approaches including hermetic packaging based on the LTCC substrate, deep reactive ion etching, neutral beam etching technology, and metal-assisted chemical etching, as well as design considerations for mechanically coupled, selective vibration of high-order mode, movable electrode structures, and piezoresistive heat engines were investigated to achieve small motional resistance, low insertion loss, and high quality factor. Focusses on a capacitive sensing method based on the measurement of the change in capacitance between a sensing electrode and the resonant body. Reviews recent progress in performance enhancement methods for capacitive silicon resonator, which are mainly based on the works of the authors.


Fabrication and Design of Resonant Microdevices

Fabrication and Design of Resonant Microdevices
Author: Behraad Bahreyni
Publisher: William Andrew
Total Pages: 234
Release: 2008-10-20
Genre: Technology & Engineering
ISBN: 0815519710

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This book discusses the main issues of fabrication and design, and applications of micromachined resonant devices, including techniques commonly used for processing the output signal of resonant micro-electro-mechanical systems (MEMS). Concepts of resonance are introduced, with an overview of fabrication techniques for micromachined devices – important to understand as design options will depend on how the device will be fabricated. Also explained: excitation and signal detection methods; an analytic model of device behavior (a valuable design tool); numerical simulation techniques; issues of damping and noise for resonant MEMS; electronic interfacing; packaging issues; and numerous examples of resonant MEMS from academia and industry. Offers numerous academic and industrial examples of resonant MEMS Provides an analytic model of device behaviour Explains two-port systems in detail Devotes ample space to excitation and signal detection methods Covers issues of damping and noise for resonant MEMS, two topics of particular importance for high-Q devices


High-Q MEMS Capacitive-Gap Resonators for RF Channel Selection

High-Q MEMS Capacitive-Gap Resonators for RF Channel Selection
Author: Lingqi Wu
Publisher:
Total Pages: 124
Release: 2015
Genre:
ISBN:

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On chip capacitive-gap transduced micromechanical resonators constructed via MEMS technology have achieved very high Q’s at both VHF and UHF range, making them very attractive as on-chip frequency selecting elements for filters in wireless communication applications. Still, there are applications, such as software-defined cognitive radio, that demand even higher Q’s at RF to enable low-loss selection of single channels (rather than bands of them) to reduce the power consumption of succeeding electronic stages down to levels more appropriate for battery-powered handhelds. This dissertation focuses on improving the performance of MEMS capacitive-gap resonators to the degree which can be used to build the aforementioned RF channel-select filters. It first aims to enhance quality factor of MEMS capacitive-gap resonators by suppressing vibration energy loss via device substrate, which will lead to low insertion loss in RF channel selection. Then, in order to reduce an RF front-end filter’s bandwidth and termination resistance, it explores the method of building micromechanical resonator array composites that include large number of mechanically coupled resonators. Finally, the dissertation presents an experimentally demonstrated RF narrowband filter built upon mechanically coupled high-Q resonator array composites. Pursuant to further increasing Q at UHF for low insertion loss RF channel select application, the thesis develops an equivalent circuit model of a radial contour mode disk resonator that can analytically predict anchor loss dominated Q. Indicated by this improved equivalent circuit model, this work “hollows” the stems supporting all-polysilicon micromechanical disk resonators to effectively squeeze the energy conduit between the disk structure and the substrate, thereby suppressing energy loss and maximizing Q. By using the same fabrication process flow from the conventional all-polysilicon devices, the use of hollow stem support enhances Q with minimal increase in fabrication complexity. Measurements confirm Q enhancements of 2.6× for contour modes at 154 MHz and 2.9× for wine glass modes around 112 MHz over values previously achieved by full stem all-polysilicon disk resonators with identical dimensions. Measured Q’s as high as 56,061 at 329 MHz and 93,231 at 178 MHz for whispering gallery modes further attest to the efficacy of this approach. This dissertation also employs mechanically coupled disk array composites to increase resonator stiffness and lower motional resistance, which are both highly desired for RF front-end channel-select filters. By using half-wavelength coupling beams and proper electrode phasing design, measurements confirm that a 215-MHz 50-resonator disk array achieves 46.5× Q-normalized Rx reduction, with no observation of other undesired vibration modes. Notably, as indicated by the newly developed negative-capacitance equivalent circuit model, such array composite also shows enhanced frequency stability against dc-bias voltage fluctuations because of its large electrode-to-resonator overlap capacitance. Finally, the thesis demonstrates a 75MHz 3rd order 210 kHz bandwidth (0.3%) filter with a sharp roll-off of 20dB shape factor of 1.46. This filter employs three high-Q disk array composites connected by quarter-wavelength rotational coupling beams to achieve a weak coupling for narrowband selection. Each array composite itself includes seven flexural disk resonators coupled by strong quasi-zero length beams to enforce desired response. By using electromechanical analogies, the equivalent electrical circuit model of this filter can accurately capture the device’s response and provide insights for filter designers. Most importantly, the accuracy of the described equivalent circuit model in predicting quality factor, frequency stability, and filter response encourages the design of even more complex micromechanical circuits to come, for example, as would be needed in an all-mechanical RF front-end.


Micro-Resonators: The Quest for Superior Performance

Micro-Resonators: The Quest for Superior Performance
Author: Reza Abdolvand
Publisher: MDPI
Total Pages: 147
Release: 2019-02-15
Genre:
ISBN: 3038976261

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This book is a printed edition of the Special Issue "Micro-Resonators: The Quest for Superior Performance" that was published in Micromachines


Handbook of Silicon Based MEMS Materials and Technologies

Handbook of Silicon Based MEMS Materials and Technologies
Author: Markku Tilli
Publisher: William Andrew
Total Pages: 827
Release: 2015-09-02
Genre: Technology & Engineering
ISBN: 0323312233

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The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures Geared towards practical applications rather than theory