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Handbook of Package Engineering, Third Edition

Handbook of Package Engineering, Third Edition
Author: Joseph F. Hanlon
Publisher: CRC Press
Total Pages: 730
Release: 1998-04-23
Genre: Technology & Engineering
ISBN: 9781566763066

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Now in its third edition, the Handbook of Package Engineering is still considered the standard industry reference on packaging materials and engineering. This text is a useful source of information for anyone involved in packaging. Designed as a refresher on packaging fundamentals, this complete guide also provides information on recent changes in the materials and structures of packaging. It reviews the essentials of production - packaging operations, line layout, and the machines that are required in order to perform basic packaging functions. It introduces the increasing web of laws and regulations controlling virtually all packaged products.


Handbook of Package Engineering

Handbook of Package Engineering
Author: Joseph F. Hanlon
Publisher: McGraw-Hill Companies
Total Pages: 568
Release: 1984
Genre: Technology & Engineering
ISBN:

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Handbook of Electronic Package Design

Handbook of Electronic Package Design
Author: Michael Pecht
Publisher: CRC Press
Total Pages: 904
Release: 2018-10-24
Genre: Technology & Engineering
ISBN: 1351838415

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Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development


Food and Package Engineering

Food and Package Engineering
Author: Scott A. Morris
Publisher: John Wiley & Sons
Total Pages: 477
Release: 2011-08-23
Genre: Science
ISBN: 0813814790

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For the first time, engineering for the packaging industry – and for the biggest packaging user, food processing – is presented in a way that clearly demonstrates its interconnected, globally integrated nature. Food and Package Engineering is a groundbreaking work that serves as a comprehensive guide to the complexities and the potential of the industry. Packaging draws on nearly every aspect of science, technology, business, social science, and engineering. Rather than present a traditionally linear view of these topics, the author takes a "Packaging Cycle" approach by guiding readers through the life of the package from raw materials and conversion, operations, distribution, retail, all the way to recycling or disposal by the consumer. Food and Package Engineering includes many essential topics usually not addressed in other food engineering or packaging texts, including: Raw materials production and conversion Inventory management and production scheduling Regulations, security and food safety Recycling and landfill issues Transportation systems and distribution packaging Evaluation of developing technologies The comprehensive approach of this volume provides a framework to discuss critical interrelated topics such as economics, politics, and natural resources. Intended for readers with varying levels of experience, Food and Package Engineering provides multi-level accessibility to each topic, allowing both students and professionals to find useful information and develop technical expertise. Rather than being a simple exposition of technical knowledge, the book provides both real-world examples and challenging problems that require consideration at several different levels. Extensively illustrated and meticulously researched, Food and Package Engineering offers both a technical and a real-world perspective of the field. The text serves the student or industry professional at any level or background as an outstanding learning and reference work for their professional preparation and practice.


Handbook of Paper and Paperboard Packaging Technology

Handbook of Paper and Paperboard Packaging Technology
Author: Mark J. Kirwan
Publisher: John Wiley & Sons
Total Pages: 449
Release: 2012-11-07
Genre: Technology & Engineering
ISBN: 1118470923

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The definitive industry reference on the paper and paperboard packaging sector. Now in a fully revised and updated second edition, this book discusses all the main types of packaging based on paper and paperboard. It considers the raw materials, the manufacture of paper and paperboard, and the basic properties and features on which packaging made from these materials depends for its appearance and performance. The manufacture of twelve types of paper- and paperboard-based packaging is described, together with their end-use applications and the packaging machinery involved. The importance of pack design is stressed, as well as how these materials offer packaging designers opportunities for imaginative and innovative design solutions. Environmental factors, including resource sustainability, societal and waste management issues are addressed in a dedicated chapter. The book is directed at readers based in companies which manufacture packaging grades of paper and paperboard, companies involved in the design, printing and production of packaging, and companies which manufacture inks, coatings, adhesives and packaging machinery. It will be essential reading for students of packaging technology and technologists working in food manufacturing who are users of paper and paperboard packaging products. Praise for the First Edition ‘This book is a valuable addition to the library of any forward-looking company by providing in-depth coverage of all aspects of packaging which involve the most ecologically acceptable material, namely paper and paperboard.’—International Journal of Dairy Technology ‘...a welcome contribution to a field where coverage was previously limited to subject-specific books... or to single chapters in textbooks on broader aspects of packaging technology.’—Packaging Technology and Science


Microelectronics Packaging Handbook

Microelectronics Packaging Handbook
Author: R.R. Tummala
Publisher: Springer Science & Business Media
Total Pages: 1060
Release: 2013-11-27
Genre: Computers
ISBN: 1461560373

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Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.


Hand Book of Printing, Packaging and Lamination

Hand Book of Printing, Packaging and Lamination
Author: Shrikant P. Athavale
Publisher: Notion Press
Total Pages: 388
Release: 2018-09-20
Genre: Technology & Engineering
ISBN: 1644292513

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Handbook of Printing, Packaging and Lamination is dedicated to the Printing and Packaging Industry, especially the Flexible Packing and Printing Industry. In this book, the author has made an attempt to look into the details of Printing Methods, Lamination methods and Applications. The book throws light on the raw materials required for the same and the various processes involved. This might work as a reference book for those associated with The Packaging Industry. SPA technical Advisor’s proprietor is the author of this book. The core content of this book is derived from the experience of the author of being a ‘visiting faculty member’ for the SIES School of Printing and Packaging at Navi Mumbai, India for over 4 years.


Handbook of Package Engineering, Second Edition

Handbook of Package Engineering, Second Edition
Author: Joseph F. Hanlon
Publisher: CRC Press
Total Pages: 560
Release: 1996-05-01
Genre: Technology & Engineering
ISBN: 9780877629245

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The standard industry reference on packaging materials and engineering, presenting all basic engineering aspects of packaging: materials, package designs, function and performance, production and graphics, machinery and equipment, and standards and regulation. Supplementing the text, 194 photographs and schematics illustrate package structures, materials processes, manufacturing and printing methods, machinery and equipment. Tables provide data on specifications and performance. Annotation copyright by Book News, Inc., Portland, OR


Concise Metals Engineering Data Book

Concise Metals Engineering Data Book
Author: Joseph R. Davis
Publisher: ASM International
Total Pages: 257
Release: 1997-01-01
Genre: Technology & Engineering
ISBN: 161503983X

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