Grain Boundaries And Interfacial Phenomena In Electronic Ceramics PDF Download

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Grain Boundaries and Interfacial Phenomena in Electronic Ceramics

Grain Boundaries and Interfacial Phenomena in Electronic Ceramics
Author: Lionel M. Levinson
Publisher:
Total Pages: 408
Release: 1994
Genre: Science
ISBN:

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The proceedings of the November 1990 symposium, held in conjunction with the PAC RIM Meeting, comprise papers organized under five headings: overview (5 papers); ferrites and titanates (13 papers); varistors and conductors (9 papers); high-temperature superconductors (4 papers); and processing and c


Ceramic Translations. Volume 41. Grain Boundaries and Interfacial Phenomena in Electronic Ceramics

Ceramic Translations. Volume 41. Grain Boundaries and Interfacial Phenomena in Electronic Ceramics
Author:
Publisher:
Total Pages: 385
Release: 1994
Genre:
ISBN:

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This symposium and therefore this proceedings was organized to bring together worldwide expertise in grain boundary and interfacial phenomena in electronic ceramics. These issues are key to understanding technological advances in fields as diverse as ferroelectrics, sensors, PTCRs, packaging ceramics, varistors, thick films, magnetic ceramics, titanates, capacitors, and multilayer and composite materials. Interfacial phenomena often determine the sintering and densification behavior of ceramics, as well as contact and joint functionality.


Surfaces and Interfaces in Ceramic and Ceramic — Metal Systems

Surfaces and Interfaces in Ceramic and Ceramic — Metal Systems
Author: Joseph Pask
Publisher: Springer Science & Business Media
Total Pages: 733
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1468439472

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The 17th University Conference on Ceramics, which also was the 7th LBL/MMRD International Materials Symposium, was held on the campus of the University of California at Berkeley from July 28 to August 1, 1980. It was devoted to the subject of surfaces and interfaces in ceramic and ceramic-metal systems. The program was timely and of great interest, as indicated by the large number of contributed papers, which included contributions from ten foreign countries. These proceedings are divided into the following categories dealing with the chemistry and physics of interfaces: calculations of interface/surface states, characterization of surfaces and inter faces, thermodynamics of interfaces, influence of surface and inter faces on selected ceramic processes, grain boundary structures, effects of grain boundaries on deformation and fracture, interfacial phenomena, formation of interfaces, development of adhesion, and reactions at interfaces. A number of papers deal specifically with the Si-Si02 interface, which probably has received more attention than any other because of its importance in the electronics industry. This coverage fulfills the principal objective of the symposium which was to explore and assess the current fundamental understand ing of interfaces and surfaces. A parallel objective of the symposium was fulfilled by a group of papers dealing with the correlation of interfacial characteris tics with mechanical behavior. This group includes papers dealing with the adherence of dissimilar materials at interfaces.


Surfaces and Interfaces in Ceramic and Ceramic — Metal Systems

Surfaces and Interfaces in Ceramic and Ceramic — Metal Systems
Author: Joseph Pask
Publisher: Springer
Total Pages: 768
Release: 2012-07-10
Genre: Technology & Engineering
ISBN: 9781468439489

Download Surfaces and Interfaces in Ceramic and Ceramic — Metal Systems Book in PDF, ePub and Kindle

The 17th University Conference on Ceramics, which also was the 7th LBL/MMRD International Materials Symposium, was held on the campus of the University of California at Berkeley from July 28 to August 1, 1980. It was devoted to the subject of surfaces and interfaces in ceramic and ceramic-metal systems. The program was timely and of great interest, as indicated by the large number of contributed papers, which included contributions from ten foreign countries. These proceedings are divided into the following categories dealing with the chemistry and physics of interfaces: calculations of interface/surface states, characterization of surfaces and inter faces, thermodynamics of interfaces, influence of surface and inter faces on selected ceramic processes, grain boundary structures, effects of grain boundaries on deformation and fracture, interfacial phenomena, formation of interfaces, development of adhesion, and reactions at interfaces. A number of papers deal specifically with the Si-Si02 interface, which probably has received more attention than any other because of its importance in the electronics industry. This coverage fulfills the principal objective of the symposium which was to explore and assess the current fundamental understand ing of interfaces and surfaces. A parallel objective of the symposium was fulfilled by a group of papers dealing with the correlation of interfacial characteris tics with mechanical behavior. This group includes papers dealing with the adherence of dissimilar materials at interfaces.


Ceramic Materials for Electronics, Third Edition

Ceramic Materials for Electronics, Third Edition
Author: Relva C. Buchanan
Publisher: CRC Press
Total Pages: 704
Release: 2004-06-25
Genre: Technology & Engineering
ISBN: 9780824740283

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The Third Edition of Ceramic Materials for Electronics studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. The author summarizes the latest trends and advancements in the field, and explores important topics such as ceramic thin film, functional device technology, and thick film technology. Edited by a leading expert on the subject, this new edition includes more than 150 pages of new information; restructured reference materials, figures, and tables; as well as additional device application-oriented segments.


Grain Boundary Engineering in Ceramics

Grain Boundary Engineering in Ceramics
Author: Taketo Sakuma
Publisher: Wiley-American Ceramic Society
Total Pages: 638
Release: 2000-06-28
Genre: Science
ISBN:

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One of the key technologies needed to understand and develop the mechanical and electrical properties of ceramics is the field of grain boundary engineering. This book covers new developments in this important field and addresses topics from grain boundary phenomena to grain boundary quantum structures, including the development of new techniques such as multifunctional electronmicroscopes, various kinds of spectroscopic analysis, and first principles calculations. Proceedings of the Japan Fine Ceramics Center Workshop, March 15-17, 2000, in Nagoya, Japan; Ceramic Transactions, Volume 118.


Surfaces and Interfaces in Ceramic and Ceramic — Metal Systems

Surfaces and Interfaces in Ceramic and Ceramic — Metal Systems
Author: Joseph Pask
Publisher: Springer
Total Pages: 768
Release: 1981-06-30
Genre: Technology & Engineering
ISBN: 9780306407260

Download Surfaces and Interfaces in Ceramic and Ceramic — Metal Systems Book in PDF, ePub and Kindle

The 17th University Conference on Ceramics, which also was the 7th LBL/MMRD International Materials Symposium, was held on the campus of the University of California at Berkeley from July 28 to August 1, 1980. It was devoted to the subject of surfaces and interfaces in ceramic and ceramic-metal systems. The program was timely and of great interest, as indicated by the large number of contributed papers, which included contributions from ten foreign countries. These proceedings are divided into the following categories dealing with the chemistry and physics of interfaces: calculations of interface/surface states, characterization of surfaces and inter faces, thermodynamics of interfaces, influence of surface and inter faces on selected ceramic processes, grain boundary structures, effects of grain boundaries on deformation and fracture, interfacial phenomena, formation of interfaces, development of adhesion, and reactions at interfaces. A number of papers deal specifically with the Si-Si02 interface, which probably has received more attention than any other because of its importance in the electronics industry. This coverage fulfills the principal objective of the symposium which was to explore and assess the current fundamental understand ing of interfaces and surfaces. A parallel objective of the symposium was fulfilled by a group of papers dealing with the correlation of interfacial characteris tics with mechanical behavior. This group includes papers dealing with the adherence of dissimilar materials at interfaces.