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EMC Compo 2011 Proceedings

EMC Compo 2011 Proceedings
Author:
Publisher:
Total Pages:
Release: 2011
Genre: Electromagnetic compatibility
ISBN:

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EMC Compo 09

EMC Compo 09
Author:
Publisher:
Total Pages: 85
Release:
Genre:
ISBN:

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Proceedings of Fourth International Conference on Communication, Computing and Electronics Systems

Proceedings of Fourth International Conference on Communication, Computing and Electronics Systems
Author: V. Bindhu
Publisher: Springer Nature
Total Pages: 1048
Release: 2023-03-14
Genre: Technology & Engineering
ISBN: 9811977534

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This book includes high-quality research papers presented at the Fourth International Conference on Communication, Computing and Electronics Systems (ICCCES 2022), held at the PPG Institute of Technology, Coimbatore, India, on September 15–16, 2022. The book focuses mainly on the research trends in cloud computing, mobile computing, artificial intelligence and advanced electronics systems. The topics covered are automation, VLSI, embedded systems, optical communication, RF communication, microwave engineering, artificial intelligence, deep learning, pattern recognition, communication networks, Internet of things, cyber-physical systems and healthcare informatics.


VLSI Design and Test for Systems Dependability

VLSI Design and Test for Systems Dependability
Author: Shojiro Asai
Publisher: Springer
Total Pages: 792
Release: 2018-07-20
Genre: Technology & Engineering
ISBN: 4431565949

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This book discusses the new roles that the VLSI (very-large-scale integration of semiconductor circuits) is taking for the safe, secure, and dependable design and operation of electronic systems. The book consists of three parts. Part I, as a general introduction to this vital topic, describes how electronic systems are designed and tested with particular emphasis on dependability engineering, where the simultaneous assessment of the detrimental outcome of failures and cost of their containment is made. This section also describes the related research project “Dependable VLSI Systems,” in which the editor and authors of the book were involved for 8 years. Part II addresses various threats to the dependability of VLSIs as key systems components, including time-dependent degradations, variations in device characteristics, ionizing radiation, electromagnetic interference, design errors, and tampering, with discussion of technologies to counter those threats. Part III elaborates on the design and test technologies for dependability in such applications as control of robots and vehicles, data processing, and storage in a cloud environment and heterogeneous wireless telecommunications. This book is intended to be used as a reference for engineers who work on the design and testing of VLSI systems with particular attention to dependability. It can be used as a textbook in graduate courses as well. Readers interested in dependable systems from social and industrial–economic perspectives will also benefit from the discussions in this book.


Fourier Transform

Fourier Transform
Author: Salih Salih
Publisher: BoD – Books on Demand
Total Pages: 316
Release: 2012-04-25
Genre: Computers
ISBN: 9535105183

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The book focuses on Fourier transform applications in electromagnetic field and microwave, medical applications, error control coding, methods for option pricing, and Helbert transform application. It is hoped that this book will provide the background, reference and incentive to encourage further research and results in these fields as well as provide tools for practical applications. It provides an applications-oriented analysis written primarily for electrical engineers, control engineers, signal processing engineers, medical researchers, and the academic researchers. In addition the graduate students will also find it useful as a reference for their research activities.


Proceedings of the International Conference on Human-centric Computing 2011 and Embedded and Multimedia Computing 2011

Proceedings of the International Conference on Human-centric Computing 2011 and Embedded and Multimedia Computing 2011
Author: James J. Park
Publisher: Springer Science & Business Media
Total Pages: 615
Release: 2011-07-21
Genre: Computers
ISBN: 9400721056

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Proceedings of the International Conference on Human-centric Computing and Embedded and Multimedia Computing (HumanCom & EMC 2011) will cover topics of HumanCom and EMC, the current hot topics satisfying the world-wide ever-changing needs. Human-centric computing is to create novel solutions so that the humans are always connected, portable, and available. As with pervasive-computing, human-centric computing requires a variety of devices; however, such devices exist simply to obtain inputs from the human and are embedded in objects that humans interact with on a daily basis. Moreover, during the past couple of decades, Information Science technologies influenced and changed every aspect of our lives and our cultures. Without various Information Science technology-based applications, it would be difficult to keep information stored securely, to process information efficiently, and to communicate conveniently. Embedded computing ranges from portable devices such as digital watches and MP3 players, to large stationary installations like traffic lights, factory controllers, or the systems controlling nuclear power plants. Complexity varies from low, with a single microcontroller chip, to very high with multiple units, peripherals and networks mounted inside a large chassis or enclosure. Multimedia computing covers multimedia I/O devices, OS, storage systems, streaming media middleware, continuous media representations, media coding, media processing, etc., and also includes multimedia communications; real-time protocols, end-to-end streaming media, resource allocation, multicast protocols, and multimedia applications; databases, distributed collaboration, video conferencing, 3D virtual environments.


Handbook of 3D Integration, Volume 4

Handbook of 3D Integration, Volume 4
Author: Paul D. Franzon
Publisher: John Wiley & Sons
Total Pages: 265
Release: 2019-01-25
Genre: Technology & Engineering
ISBN: 3527697047

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This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.


System Level ESD Co-Design

System Level ESD Co-Design
Author: Charvaka Duvvury
Publisher: John Wiley & Sons
Total Pages: 436
Release: 2017-05-05
Genre: Technology & Engineering
ISBN: 1118861884

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An effective and cost efficient protection of electronic system against ESD stress pulses specified by IEC 61000-4-2 is paramount for any system design. This pioneering book presents the collective knowledge of system designers and system testing experts and state-of-the-art techniques for achieving efficient system-level ESD protection, with minimum impact on the system performance. All categories of system failures ranging from 'hard' to 'soft' types are considered to review simulation and tool applications that can be used. The principal focus of System Level ESD Co-Design is defining and establishing the importance of co-design efforts from both IC supplier and system builder perspectives. ESD designers often face challenges in meeting customers' system-level ESD requirements and, therefore, a clear understanding of the techniques presented here will facilitate effective simulation approaches leading to better solutions without compromising system performance. With contributions from Robert Ashton, Jeffrey Dunnihoo, Micheal Hopkins, Pratik Maheshwari, David Pomerenke, Wolfgang Reinprecht, and Matti Usumaki, readers benefit from hands-on experience and in-depth knowledge in topics ranging from ESD design and the physics of system ESD phenomena to tools and techniques to address soft failures and strategies to design ESD-robust systems that include mobile and automotive applications. The first dedicated resource to system-level ESD co-design, this is an essential reference for industry ESD designers, system builders, IC suppliers and customers and also Original Equipment Manufacturers (OEMs). Key features: Clarifies the concept of system level ESD protection. Introduces a co-design approach for ESD robust systems. Details soft and hard ESD fail mechanisms. Detailed protection strategies for both mobile and automotive applications. Explains simulation tools and methodology for system level ESD co-design and overviews available test methods and standards. Highlights economic benefits of system ESD co-design.


Scientific Computing in Electrical Engineering

Scientific Computing in Electrical Engineering
Author: Ulrich Langer
Publisher: Springer
Total Pages: 271
Release: 2018-04-23
Genre: Mathematics
ISBN: 3319755382

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This collection of selected papers presented at the 11th International Conference on Scientific Computing in Electrical Engineering (SCEE), held in St. Wolfgang, Austria, in 2016, showcases the state of the art in SCEE. The aim of the SCEE 2016 conference was to bring together scientists from academia and industry, mathematicians, electrical engineers, computer scientists, and physicists, and to promote intensive discussions on industrially relevant mathematical problems, with an emphasis on the modeling and numerical simulation of electronic circuits and devices, electromagnetic fields, and coupled problems. The focus in methodology was on model order reduction and uncertainty quantification. This extensive reference work is divided into six parts: Computational Electromagnetics, Circuit and Device Modeling and Simulation, Coupled Problems and Multi‐Scale Approaches in Space and Time, Mathematical and Computational Methods Including Uncertainty Quantification, Model Order Reduction, and Industrial Applications. Each part starts with a general introduction, followed by the respective contributions. This book will appeal to mathematicians and electrical engineers. Further, it introduces algorithm and program developers to recent advances in the other fields, while industry experts will be introduced to new programming tools and mathematical methods.


Constructive Side-Channel Analysis and Secure Design

Constructive Side-Channel Analysis and Secure Design
Author: Werner Schindler
Publisher: Springer
Total Pages: 274
Release: 2012-04-23
Genre: Computers
ISBN: 3642299121

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This book constitutes the refereed proceedings of the Third International Workshop on Constructive Side-Channel Analysis and Secure Design, COSADE 2012, held in Darmstadt, Germany, May 2012. The 16 revised full papers presented together with two invited talks were carefully reviewed and selected from 49 submissions. The papers are organized in topical sections on practical side-channel analysis; secure design; side-channel attacks on RSA; fault attacks; side-channel attacks on ECC; different methods in side-channel analysis.