Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Electrical Performance Of Electronic Packaging And Systems 2009 Epeps 09 Ieee 18th Conference On PDF full book. Access full book title Electrical Performance Of Electronic Packaging And Systems 2009 Epeps 09 Ieee 18th Conference On.
| Author | : |
| Publisher | : |
| Total Pages | : 258 |
| Release | : 2009 |
| Genre | : Electronic packaging |
| ISBN | : 9781424444472 |
| Author | : |
| Publisher | : |
| Total Pages | : 258 |
| Release | : 2009 |
| Genre | : Electronic packaging |
| ISBN | : |
| Author | : Components, Packaging, and Manufacturing Technology Society |
| Publisher | : |
| Total Pages | : 256 |
| Release | : 2009 |
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| ISBN | : 9781424444489 |
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| Release | : 2009 |
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| ISBN | : 9781424456468 |
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| Release | : 2013 |
| Genre | : Electronic packaging |
| ISBN | : 9781479907052 |
| Author | : Institute of Electrical and Electronics Engineers |
| Publisher | : |
| Total Pages | : 698 |
| Release | : 2017 |
| Genre | : Electronic books |
| ISBN | : |
| Author | : Institute of Electrical and Electronics Engineers (New York, NY) |
| Publisher | : |
| Total Pages | : 269 |
| Release | : 2013-10-27 |
| Genre | : |
| ISBN | : 9781479907083 |
| Author | : |
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| Total Pages | : |
| Release | : 1979 |
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| Release | : 2010 |
| Genre | : Electronic packaging |
| ISBN | : 9781424468669 |
| Author | : Manho Lee |
| Publisher | : Springer |
| Total Pages | : 286 |
| Release | : 2014-05-11 |
| Genre | : Technology & Engineering |
| ISBN | : 9401790388 |
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
