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| Release | : 2013 |
| Genre | : Electronic packaging |
| ISBN | : 9781479907052 |
| Author | : Topical Meeting on Electrical Performance of Electronic Packaging |
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| Total Pages | : 70 |
| Release | : 2000 |
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| Total Pages | : 367 |
| Release | : 2007 |
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| Total Pages | : 313 |
| Release | : 2018 |
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| ISBN | : 9781538651667 |
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| Total Pages | : 226 |
| Release | : 2016 |
| Genre | : Electronic packaging |
| ISBN | : 9781509022724 |
| Author | : IEEE Staff |
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| Release | : 2017-10-15 |
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| ISBN | : 9781538636329 |
PEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs
| Author | : IEEE Staff |
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| Release | : 2020-10-05 |
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| ISBN | : 9781728161624 |
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs EPEPS is jointly sponsored by the IEEE Electronics Packaging Society and IEEE Microwave Theory and Techniques Society
| Author | : IEEE Staff |
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| Release | : 2008 |
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| ISBN | : 9781509075706 |
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| Release | : 2016 |
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| ISBN | : 9781509061105 |
| Author | : Institute of Electrical and Electronics Engineers (New York, NY) |
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| Total Pages | : 269 |
| Release | : 2013-10-27 |
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| ISBN | : 9781479907083 |
