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High Density Plasma Sources

High Density Plasma Sources
Author: Oleg A. Popov
Publisher: Elsevier
Total Pages: 467
Release: 1996-12-31
Genre: Science
ISBN: 0815517890

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This book describes the design, physics, and performance of high density plasma sources which have been extensively explored in low pressure plasma processing, such as plasma etching and planarization, plasma enhanced chemical vapor deposition of thin films, sputtered deposition of metals and dielectrics, epitaxial growth of silicon and GaAs, and many other applications. This is a comprehensive survey and a detailed description of most advanced high density plasma sources used in plasma processing. The book is a balanced presentation in that it gives both a theoretical treatment and practical applications. It should be of considerable interest to scientists and engineers working on plasma source design, and process development.


High Density Plasma Sources

High Density Plasma Sources
Author: Oleg A. Popov
Publisher: William Andrew
Total Pages: 445
Release: 1995
Genre: Science
ISBN: 9780815513773

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This book presents a comprehensive description of the most promising high density plasma sources operated at low and intermediate pressures which are used, or could be used, in plasma processing such as etching and deposition. The authors are the leading experts in the field who are original inventors and designers of plasma sources they describe in this book. This book gives a balanced treatment of both the theoretical aspects and practical applications. It should be of considerable interest to scientists and engineers working on plasma source designs and process developments.


Plasma Sources for Thin Film Deposition and Etching

Plasma Sources for Thin Film Deposition and Etching
Author: Maurice H. Francombe
Publisher: Academic Press
Total Pages: 343
Release: 2013-10-22
Genre: Technology & Engineering
ISBN: 0080925138

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This latest volume of the well-known Physics of Thin Films Series includes four chapters that discuss high-density plasma sources for materials processing, electron cyclotron resonance and its uses, unbalancedmagnetron sputtering, and particle formation in thin film processing plasma. Chapter One develops a unified framework from which all "high-efficiency" sources may be viewed and compared; outlines key elements of source design affecting processing results; and highlights areas where additional research and development are needed Chapter Two reviews and analyzes the main types of electron cyclotron resonance (ECR) plasma sources suitable for ECR PACVD of thin films, mainly ECR sources using magnet coils Chapter Three examines the benefits and limitations of the new technique, unbalanced magnetron sputtering (UBM), along with the motivation for its development, the basic principles of its operation and commercial applications, and some speculations regarding the future of UBM technology Chapter Four describes general phenomena observed in connection with particle formation in thin film processing plasmas; discusses particles in PECVD plasmas, sputtering plasmas, and RIE plasmas; presents an overview of the theoretical modeling of various aspects of particles in processing plasmas; examines issues of equipment design affecting particle formation; and concludes with remarks about the implications of this work for the control of process-induced particle contamination


Plasma Processing of Materials

Plasma Processing of Materials
Author: National Research Council
Publisher: National Academies Press
Total Pages: 88
Release: 1991-02-01
Genre: Technology & Engineering
ISBN: 0309045975

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Plasma processing of materials is a critical technology to several of the largest manufacturing industries in the worldâ€"electronics, aerospace, automotive, steel, biomedical, and toxic waste management. This book describes the relationship between plasma processes and the many industrial applications, examines in detail plasma processing in the electronics industry, highlights the scientific foundation underlying this technology, and discusses education issues in this multidisciplinary field. The committee recommends a coordinated, focused, and well-funded research program in this area that involves the university, federal laboratory, and industrial sectors of the community. It also points out that because plasma processing is an integral part of the infrastructure of so many American industries, it is important for both the economy and the national security that America maintain a strong leadership role in this technology.


Lecture Notes on Principles of Plasma Processing

Lecture Notes on Principles of Plasma Processing
Author: Francis F. Chen
Publisher: Springer Science & Business Media
Total Pages: 213
Release: 2012-12-06
Genre: Science
ISBN: 1461501814

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Plasma processing of semiconductors is an interdisciplinary field requiring knowledge of both plasma physics and chemical engineering. The two authors are experts in each of these fields, and their collaboration results in the merging of these fields with a common terminology. Basic plasma concepts are introduced painlessly to those who have studied undergraduate electromagnetics but have had no previous exposure to plasmas. Unnecessarily detailed derivations are omitted; yet the reader is led to understand in some depth those concepts, such as the structure of sheaths, that are important in the design and operation of plasma processing reactors. Physicists not accustomed to low-temperature plasmas are introduced to chemical kinetics, surface science, and molecular spectroscopy. The material has been condensed to suit a nine-week graduate course, but it is sufficient to bring the reader up to date on current problems such as copper interconnects, low-k and high-k dielectrics, and oxide damage. Students will appreciate the web-style layout with ample color illustrations opposite the text, with ample room for notes. This short book is ideal for new workers in the semiconductor industry who want to be brought up to speed with minimum effort. It is also suitable for Chemical Engineering students studying plasma processing of materials; Engineers, physicists, and technicians entering the semiconductor industry who want a quick overview of the use of plasmas in the industry.


Physics of Thin Films

Physics of Thin Films
Author: Maurice H. Francombe
Publisher:
Total Pages: 352
Release: 1994
Genre: Metallic films
ISBN:

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Lieberman, Michael A.; Design of high-density plasma sources for materials processing.


Advanced Concepts and Architectures for Plasma-Enabled Material Processing

Advanced Concepts and Architectures for Plasma-Enabled Material Processing
Author: Oleg O. Baranov
Publisher: Morgan & Claypool Publishers
Total Pages: 92
Release: 2020-09-30
Genre: Technology & Engineering
ISBN: 1681739119

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Plasma-based techniques are widely and successfully used across the field of materials processing, advanced nanosynthesis, and nanofabrication. The diversity of currently available processing architectures based on or enhanced by the use of plasmas is vast, and one can easily get lost in the opportunities presented by each of these configurations. This mini-book provides a concise outline of the most important concepts and architectures in plasma-assisted processing of materials, helping the reader navigate through the fundamentals of plasma system selection and optimization. Architectures discussed in this book range from the relatively simple, user-friendly types of plasmas produced using direct current, radio-frequency, microwave, and arc systems, to more sophisticated advanced systems based on incorporating and external substrate architectures, and complex control mechanisms of configured magnetic fields and distributed plasma sources.


Handbook of Advanced Plasma Processing Techniques

Handbook of Advanced Plasma Processing Techniques
Author: R.J. Shul
Publisher: Springer Science & Business Media
Total Pages: 664
Release: 2011-06-28
Genre: Technology & Engineering
ISBN: 3642569897

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Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.