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| Author | : Haihua Su |
| Publisher | : |
| Total Pages | : 270 |
| Release | : 2002 |
| Genre | : |
| ISBN | : |
| Author | : Konstantin Moiseev |
| Publisher | : Springer |
| Total Pages | : 245 |
| Release | : 2014-11-07 |
| Genre | : Technology & Engineering |
| ISBN | : 1461408210 |
This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.
| Author | : Ashok K. Goel |
| Publisher | : John Wiley & Sons |
| Total Pages | : 433 |
| Release | : 2007-10-19 |
| Genre | : Technology & Engineering |
| ISBN | : 0470165960 |
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
| Author | : Hartmut Grabinski |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 234 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1461543495 |
This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
| Author | : Xuejue Huang |
| Publisher | : |
| Total Pages | : 268 |
| Release | : 2002 |
| Genre | : |
| ISBN | : |
| Author | : Jeffrey A. Davis |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 417 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1461504619 |
This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
| Author | : Mohamed Elgamel |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 145 |
| Release | : 2006-03-20 |
| Genre | : Technology & Engineering |
| ISBN | : 0387293663 |
Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits
| Author | : Wenceslau J. Goedert |
| Publisher | : |
| Total Pages | : 14 |
| Release | : 1967 |
| Genre | : |
| ISBN | : |
| Author | : Kyung Hoae Koo |
| Publisher | : Stanford University |
| Total Pages | : 135 |
| Release | : 2011 |
| Genre | : |
| ISBN | : |
Moore's law has driven the scaling of digital electronic devices' dimensions and performances over the last 40 years. As a result, logic components in a microprocessor have shown dramatic performance improvement. On the other hand, an on-chip interconnect which was considered only as a parasitic load before 1990s became the real performance bottleneck due to its extremely reduced cross section dimension. Now, on-chip global interconnect with conventional Cu/low-k and delay optimized repeater scheme faces great challenges in the nanometer regime, imposing problems of slower delay, higher power dissipation and limited bandwidth. Carbon based materials such as carbon nanotubes and graphene nanoribbons, and optical interconnect have been proposed for the alternate solution for the future nodes due to their special physical characteristics. This dissertation investigates the basic physical properties of novel materials for future interconnect, and describes the analytical and numerical models of local and global wire system based on new materials and novel signaling paradigms. This work also compares their basic performance metrics and circuit architectures to cope with the interconnect performance bottlenecks. We quantify the performance of these novel interconnects and compare them with Cu/low-k wires for future high-performance ICs.
| Author | : Rohit Dhiman |
| Publisher | : Springer |
| Total Pages | : 122 |
| Release | : 2014-11-07 |
| Genre | : Technology & Engineering |
| ISBN | : 813222132X |
The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling.
