Circuits Systems 1980 Ieee Intsympon Houston Apr28 30 PDF Download

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The Summary of Engineering Research

The Summary of Engineering Research
Author: University of Illinois at Urbana-Champaign. Office of Engineering Publications
Publisher:
Total Pages: 350
Release: 1981
Genre: Engineering
ISBN:

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Wafer Bonding

Wafer Bonding
Author: Marin Alexe
Publisher: Springer Science & Business Media
Total Pages: 510
Release: 2013-03-09
Genre: Science
ISBN: 3662108275

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The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.


Nonlinear Networks

Nonlinear Networks
Author: Alan N. Willson
Publisher:
Total Pages: 416
Release: 1975
Genre: Mathematics
ISBN:

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