Characterization Of Integrated Circuit Packaging Materials PDF Download
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Author | : Thomas Moore |
Publisher | : Elsevier |
Total Pages | : 293 |
Release | : 2013-10-22 |
Genre | : Technology & Engineering |
ISBN | : 1483292347 |
Download Characterization of Integrated Circuit Packaging Materials Book in PDF, ePub and Kindle
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Author | : William Greig |
Publisher | : Springer Science & Business Media |
Total Pages | : 312 |
Release | : 2007-04-24 |
Genre | : Technology & Engineering |
ISBN | : 0387339132 |
Download Integrated Circuit Packaging, Assembly and Interconnections Book in PDF, ePub and Kindle
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Author | : Lawrence C. Wagner |
Publisher | : Springer Science & Business Media |
Total Pages | : 256 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 1461549191 |
Download Failure Analysis of Integrated Circuits Book in PDF, ePub and Kindle
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Author | : William Greig |
Publisher | : Springer |
Total Pages | : 0 |
Release | : 2008-11-01 |
Genre | : Technology & Engineering |
ISBN | : 9780387508795 |
Download Integrated Circuit Packaging, Assembly and Interconnections Book in PDF, ePub and Kindle
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Author | : Daniel Lu |
Publisher | : Springer |
Total Pages | : 974 |
Release | : 2016-11-18 |
Genre | : Technology & Engineering |
ISBN | : 3319450980 |
Download Materials for Advanced Packaging Book in PDF, ePub and Kindle
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author | : Andrea Chen |
Publisher | : CRC Press |
Total Pages | : 218 |
Release | : 2016-04-19 |
Genre | : Technology & Engineering |
ISBN | : 1000218619 |
Download Semiconductor Packaging Book in PDF, ePub and Kindle
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Author | : Shichun Qu |
Publisher | : Springer |
Total Pages | : 336 |
Release | : 2014-09-10 |
Genre | : Technology & Engineering |
ISBN | : 1493915568 |
Download Wafer-Level Chip-Scale Packaging Book in PDF, ePub and Kindle
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Author | : Mary Beth Lange |
Publisher | : |
Total Pages | : 202 |
Release | : 1992 |
Genre | : Ceramic materials |
ISBN | : |
Download Characterizing Ceramic Integrated Circuit Packaging Materials Book in PDF, ePub and Kindle
Author | : Yong Liu |
Publisher | : Springer Science & Business Media |
Total Pages | : 606 |
Release | : 2012-02-15 |
Genre | : Technology & Engineering |
ISBN | : 1461410533 |
Download Power Electronic Packaging Book in PDF, ePub and Kindle
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Author | : EDFAS Desk Reference Committee |
Publisher | : ASM International |
Total Pages | : 673 |
Release | : 2011 |
Genre | : Technology & Engineering |
ISBN | : 1615037268 |
Download Microelectronics Failure Analysis Book in PDF, ePub and Kindle
Includes bibliographical references and index.