Avoiding Inelastic Strains In Solder Joint Interconnections Of Ic Devices PDF Download
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Author | : Ephraim Suhir |
Publisher | : CRC Press |
Total Pages | : 344 |
Release | : 2021-01-28 |
Genre | : Technology & Engineering |
ISBN | : 0429863829 |
Download Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices Book in PDF, ePub and Kindle
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Author | : Darrel R. Frear |
Publisher | : Springer Science & Business Media |
Total Pages | : 434 |
Release | : 1994-01-31 |
Genre | : Computers |
ISBN | : 9780442015053 |
Download Mechanics of Solder Alloy Interconnects Book in PDF, ePub and Kindle
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Author | : Ephraim Suhir |
Publisher | : |
Total Pages | : |
Release | : 2020 |
Genre | : Failure analysis (Engineering) |
ISBN | : 9780367635886 |
Download Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices Book in PDF, ePub and Kindle
"The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices"--
Author | : Rao K. Mahidhara |
Publisher | : Minerals, Metals, & Materials Society |
Total Pages | : 468 |
Release | : 1997 |
Genre | : Technology & Engineering |
ISBN | : |
Download Design and Reliability of Solders and Solder Interconnections Book in PDF, ePub and Kindle
The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.
Author | : John H. Lau |
Publisher | : Springer Science & Business Media |
Total Pages | : 649 |
Release | : 2013-11-27 |
Genre | : Technology & Engineering |
ISBN | : 1461539102 |
Download Solder Joint Reliability Book in PDF, ePub and Kindle
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Author | : |
Publisher | : |
Total Pages | : 1052 |
Release | : 1985 |
Genre | : Mechanics, Applied |
ISBN | : |
Download Applied Mechanics Reviews Book in PDF, ePub and Kindle
Author | : KV Subramanian |
Publisher | : Springer Science & Business Media |
Total Pages | : 370 |
Release | : 2007-06-28 |
Genre | : Technology & Engineering |
ISBN | : 0387484337 |
Download Lead-Free Electronic Solders Book in PDF, ePub and Kindle
Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Author | : X.J. Fan |
Publisher | : Springer Science & Business Media |
Total Pages | : 573 |
Release | : 2010-07-23 |
Genre | : Technology & Engineering |
ISBN | : 1441957197 |
Download Moisture Sensitivity of Plastic Packages of IC Devices Book in PDF, ePub and Kindle
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Author | : Daniel Lu |
Publisher | : Springer |
Total Pages | : 974 |
Release | : 2016-11-18 |
Genre | : Technology & Engineering |
ISBN | : 3319450980 |
Download Materials for Advanced Packaging Book in PDF, ePub and Kindle
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author | : Tae-Kyu Lee |
Publisher | : Springer |
Total Pages | : 266 |
Release | : 2014-11-05 |
Genre | : Technology & Engineering |
ISBN | : 1461492661 |
Download Fundamentals of Lead-Free Solder Interconnect Technology Book in PDF, ePub and Kindle
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.