Assembly And Reliability Of Lead Free Solder Joints PDF Download
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| Author | : John H. Lau |
| Publisher | : Springer Nature |
| Total Pages | : 545 |
| Release | : 2020-05-29 |
| Genre | : Technology & Engineering |
| ISBN | : 9811539200 |
Download Assembly and Reliability of Lead-Free Solder Joints Book in PDF, ePub and Kindle
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
| Author | : John H. Lau |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 649 |
| Release | : 2013-11-27 |
| Genre | : Technology & Engineering |
| ISBN | : 1461539102 |
Download Solder Joint Reliability Book in PDF, ePub and Kindle
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
| Author | : John Hock Lye Pang |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 184 |
| Release | : 2011-10-15 |
| Genre | : Technology & Engineering |
| ISBN | : 1461404630 |
Download Lead Free Solder Book in PDF, ePub and Kindle
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
| Author | : John W. Evans |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 212 |
| Release | : 2007-01-05 |
| Genre | : Technology & Engineering |
| ISBN | : 1846283108 |
Download A Guide to Lead-free Solders Book in PDF, ePub and Kindle
The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.
| Author | : Jasbir Bath |
| Publisher | : John Wiley & Sons |
| Total Pages | : 512 |
| Release | : 2020-06-12 |
| Genre | : Technology & Engineering |
| ISBN | : 1119482046 |
Download Lead-free Soldering Process Development and Reliability Book in PDF, ePub and Kindle
Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
| Author | : Dongkai Shangguan |
| Publisher | : ASM International |
| Total Pages | : 292 |
| Release | : 2005 |
| Genre | : Technology & Engineering |
| ISBN | : 161503093X |
Download Lead-Free Solder Interconnect Reliability Book in PDF, ePub and Kindle
| Author | : KV Subramanian |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 370 |
| Release | : 2007-06-28 |
| Genre | : Technology & Engineering |
| ISBN | : 0387484337 |
Download Lead-Free Electronic Solders Book in PDF, ePub and Kindle
Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
| Author | : King-Ning Tu |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 376 |
| Release | : 2007-07-27 |
| Genre | : Technology & Engineering |
| ISBN | : 0387388923 |
Download Solder Joint Technology Book in PDF, ePub and Kindle
The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
| Author | : John H. Lau |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 504 |
| Release | : 1991-05-31 |
| Genre | : Computers |
| ISBN | : 9780442002602 |
Download Solder Joint Reliability Book in PDF, ePub and Kindle
Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR
| Author | : Andrew E. Perkins |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 202 |
| Release | : 2008-12-16 |
| Genre | : Technology & Engineering |
| ISBN | : 0387793941 |
Download Solder Joint Reliability Prediction for Multiple Environments Book in PDF, ePub and Kindle
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
