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'Advances in Microelectronics: Reviews', Vol_1

'Advances in Microelectronics: Reviews', Vol_1
Author: Sergey Yurish
Publisher: Lulu.com
Total Pages: 536
Release: 2018-01-12
Genre: Technology & Engineering
ISBN: 8469786334

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The 1st volume of 'Advances in Microelectronics: Reviews' Book Series contains 19 chapters written by 72 authors from academia and industry from 16 countries. With unique combination of information in each volume, the 'Advances in Microelectronics: Reviews' Book Series will be of value for scientists and engineers in industry and at universities. In order to offer a fast and easy reading of the state of the art of each topic, every chapter in this book is independent and self-contained. All chapters have the same structure: first an introduction to specific topic under study; second particular field description including sensing applications. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.


Advances in Microelectronics: Reviews, Vol. 2

Advances in Microelectronics: Reviews, Vol. 2
Author: Sergey Yurish
Publisher: Lulu.com
Total Pages: 516
Release: 2019-08-06
Genre: Technology & Engineering
ISBN: 8409081601

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The 2nd volume of 'Advances in Microelectronics: Reviews' Book Series is written by 57 contributors from academy and industry from 11 countries (Bulgaria, Hungary, Iran, Japan, Malaysia, Romania, Russia, Slovak Republic, Spain, Ukraine and USA). The book contains 13 chapters from different areas of microelectronics: MEMS, materials characterization, and various microelectronic devices. With unique combination of information in each volume, the Book Series will be of value for scientists and engineers in industry and at universities. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.


Advances in Sensors: Reviews, Vol.4 'Sensors and Applications in Measuring and Automation Control Systems'

Advances in Sensors: Reviews, Vol.4 'Sensors and Applications in Measuring and Automation Control Systems'
Author: Sergey Yurish
Publisher: Lulu.com
Total Pages: 506
Release: 2017-02-16
Genre: Technology & Engineering
ISBN: 8461775961

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The fourth volume titled 'Sensors and Applications in Measuring and Automation Control Systems' contains twenty four chapters with sensor related state-of-the-art reviews and descriptions of latest advances in sensor related area written by 81 authors from academia and industry from 5 continents and 20 countries: Australia, Austria, Brazil, Finland, France, Japan, India, Iraq, Italia, México, Morocco, Portugal, Senegal, Serbia, South Africa, South Korea, Spain, UK, Ukraine and USA. Coverage includes current developments in physical sensors and transducers, chemical sensors, biosensors, sensing materials, signal conditioning, energy harvesters and sensor networks.


Advances in Sensors: Reviews, Vol. 6

Advances in Sensors: Reviews, Vol. 6
Author: Sergey Yurish
Publisher: Lulu.com
Total Pages: 584
Release: 2018-07-30
Genre: Technology & Engineering
ISBN: 8409030306

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The Vol. 6 of this Book Series contains 21 chapters written by 94 contributors-experts from universities and research centres, from 21 countries: Argentina, Austria, Brazil, China, Czech Republic, Denmark, Finland, France, Germany, India, Italy, Japan, Mexico, Poland, Romania, Russia, Slovenia, Switzerland, Thailand, UK and USA. This volume is devoted to various chemical sensors (sensors for various gases, nucleic acids, organic compounds, nanosensors, etc.) and biosensors. This book ensures that our readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments. By this way, they will be able to save more time for productive research activity and eliminate routine work. With the unique combination of information in this volume, the 'Advances in Sensors: Reviews' Book Series will be of value for scientists and engineers in industry and at universities, to sensors developers, distributors, and end users.


Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research

Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research
Author: Madhusudan Iyengar
Publisher: World Scientific
Total Pages: 471
Release: 2014-08-25
Genre: Technology & Engineering
ISBN: 9814579807

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To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.


Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging
Author: Xingcun Colin Tong
Publisher: Springer Science & Business Media
Total Pages: 633
Release: 2011-01-05
Genre: Technology & Engineering
ISBN: 1441977597

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.


Semiconductor Advanced Packaging

Semiconductor Advanced Packaging
Author: John H. Lau
Publisher: Springer Nature
Total Pages: 513
Release: 2021-05-17
Genre: Technology & Engineering
ISBN: 9811613761

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The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.


Scientific and Technical Aerospace Reports

Scientific and Technical Aerospace Reports
Author:
Publisher:
Total Pages: 1460
Release: 1991
Genre: Aeronautics
ISBN:

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Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.


Advanced Ultra Low-Power Semiconductor Devices

Advanced Ultra Low-Power Semiconductor Devices
Author: Shubham Tayal
Publisher: John Wiley & Sons
Total Pages: 325
Release: 2023-11-30
Genre: Technology & Engineering
ISBN: 1394166419

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ADVANCED ULTRA LOW-POWER SEMICONDUCTOR DEVICES Written and edited by a team of experts in the field, this important new volume broadly covers the design and applications of metal oxide semiconductor field effect transistors. This outstanding new volume offers a comprehensive overview of cutting-edge semiconductor components tailored for ultra-low power applications. These components, pivotal to the foundation of electronic devices, play a central role in shaping the landscape of electronics. With a focus on emerging low-power electronic devices and their application across domains like wireless communication, biosensing, and circuits, this book presents an invaluable resource for understanding this dynamic field. Bringing together experts and researchers from various facets of the VLSI domain, the book addresses the challenges posed by advanced low-power devices. This collaborative effort aims to propel engineering innovations and refine the practical implementation of these technologies. Specific chapters delve into intricate topics such as Tunnel FET, negative capacitance FET device circuits, and advanced FETs tailored for diverse circuit applications. Beyond device-centric discussions, the book delves into the design intricacies of low-power memory systems, the fascinating realm of neuromorphic computing, and the pivotal issue of thermal reliability. Authors provide a robust foundation in device physics and circuitry while also exploring novel materials and architectures like transistors built on pioneering channel/dielectric materials. This exploration is driven by the need to achieve both minimal power consumption and ultra-fast switching speeds, meeting the relentless demands of the semiconductor industry. The book’s scope encompasses concepts like MOSFET, FinFET, GAA MOSFET, the 5-nm and 7-nm technology nodes, NCFET, ferroelectric materials, subthreshold swing, high-k materials, as well as advanced and emerging materials pivotal for the semiconductor industry’s future.