Advanced Materials and Processes for Microelectronics
Author | : John H. Givens |
Publisher | : |
Total Pages | : |
Release | : 1999 |
Genre | : |
ISBN | : |
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Author | : John H. Givens |
Publisher | : |
Total Pages | : |
Release | : 1999 |
Genre | : |
ISBN | : |
Author | : Roland Levy |
Publisher | : Springer Science & Business Media |
Total Pages | : 1006 |
Release | : 1989-01-31 |
Genre | : Technology & Engineering |
ISBN | : 9780792301547 |
The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Author | : |
Publisher | : |
Total Pages | : 2395 |
Release | : 1999 |
Genre | : |
ISBN | : |
Author | : National Research Council |
Publisher | : National Academies Press |
Total Pages | : 76 |
Release | : 1998-01-01 |
Genre | : Technology & Engineering |
ISBN | : 0309059801 |
Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rivalâ€"perhaps surpassâ€"the societal impact of integrated circuits.
Author | : Dragan P. Uskovic |
Publisher | : Trans Tech Publications |
Total Pages | : 392 |
Release | : 1998 |
Genre | : Technology & Engineering |
ISBN | : |
Modern Technology depends upon modern materials. Life as we know it would hardly be possible without the progress that has been made in cutting edge materials science. This is true of both the various theoretical aspects and of the practical engineering applications.
Author | : |
Publisher | : |
Total Pages | : 0 |
Release | : 2008 |
Genre | : Interconnects (Integrated circuit technology) |
ISBN | : 9781605608648 |
Author | : Ehrenfried Zschech |
Publisher | : Springer Science & Business Media |
Total Pages | : 498 |
Release | : 2006-07-02 |
Genre | : Technology & Engineering |
ISBN | : 1846282357 |
This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
Author | : Yan Li |
Publisher | : Springer |
Total Pages | : 465 |
Release | : 2017-01-20 |
Genre | : Technology & Engineering |
ISBN | : 3319445863 |
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Author | : |
Publisher | : |
Total Pages | : 223 |
Release | : 2008 |
Genre | : Interconnects (Integrated circuit technology) |
ISBN | : 9781605110493 |
Author | : Mikhail Baklanov |
Publisher | : John Wiley & Sons |
Total Pages | : 508 |
Release | : 2007-04-04 |
Genre | : Technology & Engineering |
ISBN | : 0470065419 |
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.