Advanced Deposition Techniques, 2015
Author | : Susan F. DiCicco |
Publisher | : |
Total Pages | : 140 |
Release | : 2015 |
Genre | : Depositions |
ISBN | : 9781402423611 |
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Author | : Susan F. DiCicco |
Publisher | : |
Total Pages | : 140 |
Release | : 2015 |
Genre | : Depositions |
ISBN | : 9781402423611 |
Author | : Asim Jilani |
Publisher | : |
Total Pages | : |
Release | : 2017 |
Genre | : Science |
ISBN | : |
Thin films have a great impact on the modern era of technology. Thin films are considered as backbone for advanced applications in the various fields such as optical devices, environmental applications, telecommunications devices, energy storage devices, and so on . The crucial issue for all applications of thin films depends on their morphology and the stability. The morphology of the thin films strongly hinges on deposition techniques. Thin films can be deposited by the physical and chemical routes. In this chapter, we discuss some advance techniques and principles of thin-film depositions. The vacuum thermal evaporation technique, electron beam evaporation, pulsed-layer deposition, direct current/radio frequency magnetron sputtering, and chemical route deposition systems will be discussed in detail.
Author | : Amanda Alexandra Volk |
Publisher | : |
Total Pages | : 0 |
Release | : 2023 |
Genre | : |
ISBN | : |
Author | : Xiu-Tian Yan |
Publisher | : Springer Science & Business Media |
Total Pages | : 352 |
Release | : 2010-03-23 |
Genre | : Technology & Engineering |
ISBN | : 1848828942 |
"Chemical Vapour Deposition: An Integrated Engineering Design for Advanced Materials" focuses on the application of this technology to engineering coatings and, in particular, to the manufacture of high performance materials, such as fibre reinforced ceramic composite materials, for structural applications at high temperatures. This book aims to provide a thorough exploration of the design and applications of advanced materials, and their manufacture in engineering. From physical fundamentals and principles, to optimization of processing parameters and other current practices, this book is designed to guide readers through the development of both high performance materials and the design of CVD systems to manufacture such materials. "Chemical Vapour Deposition: An Integrated Engineering Design for Advanced Materials" introduces integrated design and manufacture of advanced materials to researchers, industrial practitioners, postgraduates and senior undergraduate students.
Author | : Yuan Lin |
Publisher | : John Wiley & Sons |
Total Pages | : 328 |
Release | : 2016-08-29 |
Genre | : Technology & Engineering |
ISBN | : 3527696458 |
This concise reference summarizes the latest results in nano-structured thin films, the first to discuss both deposition methods and electronic applications in detail. Following an introduction to this rapidly developing field, the authors present a variety of organic and inorganic materials along with new deposition techniques, and conclude with an overview of applications and considerations for their technology deployment.
Author | : Peter M. Martin |
Publisher | : William Andrew |
Total Pages | : 932 |
Release | : 2009-12-01 |
Genre | : Technology & Engineering |
ISBN | : 0815520328 |
This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications.
Author | : Krishna Seshan |
Publisher | : CRC Press |
Total Pages | : 72 |
Release | : 2002-02-01 |
Genre | : Science |
ISBN | : 1482269686 |
The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition tec
Author | : Rointan Framroze Bunshah |
Publisher | : William Andrew |
Total Pages | : 888 |
Release | : 1994 |
Genre | : Science |
ISBN | : 0815513372 |
This second edition, edited by the world-renowned Dr. Rointain Bunshah, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. Considerably more material was added in Plasma Assisted Vapor Deposition processes, as well as Metallurgical Coating Applications.
Author | : Ciro Bustillo-Lecompte |
Publisher | : BoD – Books on Demand |
Total Pages | : 184 |
Release | : 2020-06-10 |
Genre | : Technology & Engineering |
ISBN | : 1789848903 |
Advanced Oxidation Processes – Applications, Trends, and Prospects constitutes a comprehensive resource for civil, chemical, and environmental engineers researching in the field of water and wastewater treatment. The book covers the fundamentals, applications, and future work in Advanced Oxidation Processes (AOPs) as an attractive alternative and a complementary treatment option to conventional methods. This book also presents state-of-the-art research on AOPs and heterogeneous catalysis while covering recent progress and trends, including the application of AOPs at the laboratory, pilot, or industrial scale, the combination of AOPs with other technologies, hybrid processes, process intensification, reactor design, scale-up, and optimization. The book is divided into four sections: Introduction to Advanced Oxidation Processes, General Concepts of Heterogeneous Catalysis, Fenton and Ferrate in Wastewater Treatment, and Industrial Applications, Trends, and Prospects.
Author | : Krishna Seshan |
Publisher | : William Andrew |
Total Pages | : 430 |
Release | : 2001-02-01 |
Genre | : Technology & Engineering |
ISBN | : 0815517785 |
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques. Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.