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| Author | : Changzhong Chen |
| Publisher | : |
| Total Pages | : 422 |
| Release | : 2007 |
| Genre | : Computer algorithms |
| ISBN | : |
| Author | : Barbibrata Biswas |
| Publisher | : |
| Total Pages | : 176 |
| Release | : 1998 |
| Genre | : Integrated circuits |
| ISBN | : |
| Author | : Rohit Sharma |
| Publisher | : Springer |
| Total Pages | : 69 |
| Release | : 2012-02-17 |
| Genre | : Technology & Engineering |
| ISBN | : 9781461410720 |
Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.
| Author | : Heow-pueh Lee |
| Publisher | : World Scientific |
| Total Pages | : 395 |
| Release | : 2005-10-26 |
| Genre | : Mathematics |
| ISBN | : 9814480207 |
This volume documents the research carried out by visiting scientists attached to the Institute for Mathematical Sciences (IMS) at the National University of Singapore and the Institute of High Performance Computing (IHPC) under the program “Advances and Mathematical Issues in Large Scale Simulation.” From 2002 to 2003, researchers from various countries gathered to initiate interesting and innovative work on various themes related to multiscale simulation and fast algorithms.Today, modeling and simulation are used extensively to solve complex problems and to reduce the use of experimentation during the design and analysis stage. It is important to know the various issues that have to be considered in the successful development of computational methodologies for such work.This volume is a compilation of the research by various visiting scientists in the area of modeling and multiscale simulation. Each article covers a major project and documents how computational methodology, mathematical modeling, high performance computing and simulation are combined in a multiscale scheme to solve a variety of complex problems. Some of these include the design, synthesis, processing, characterization and manufacture of nanomaterials and nanostructures, new algorithms for computational work, and grid computing.Through the included examples, readers can realize the vast potential of computational modeling and large scale simulation for the solution of problems in a variety of disciplines and applications.
| Author | : Mustafa Celik |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 316 |
| Release | : 2007-05-08 |
| Genre | : Technology & Engineering |
| ISBN | : 0306479710 |
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of their relevance to the overall circuit behavior, the interconnect can now have a dominant impact on the IC area and performance. Beginning in the late 1980's there was significant research toward better modeling and characterization of the resistance, capacitance and ultimately the inductance of on-chip interconnect. IC Interconnect Analysis covers the state-of-the-art methods for modeling and analyzing IC interconnect based on the past fifteen years of research. This is done at a level suitable for most practitioners who work in the semiconductor and electronic design automation fields, but also includes significant depth for the research professionals who will ultimately extend this work into other areas and applications. IC Interconnect Analysis begins with an in-depth coverage of delay metrics, including the ubiquitous Elmore delay and its many variations. This is followed by an outline of moment matching methods, calculating moments efficiently, and Krylov subspace methods for model order reduction. The final two chapters describe how to interface these reduced-order models to circuit simulators and gate-level timing analyzers respectively. IC Interconnect Analysis is written for CAD tool developers, IC designers and graduate students.
| Author | : |
| Publisher | : |
| Total Pages | : 91 |
| Release | : 1992 |
| Genre | : |
| ISBN | : |
| Author | : |
| Publisher | : |
| Total Pages | : 428 |
| Release | : 2001 |
| Genre | : |
| ISBN | : |
| Author | : United States. Department of the Army |
| Publisher | : |
| Total Pages | : 428 |
| Release | : 2001 |
| Genre | : Military research |
| ISBN | : |
| Author | : Spartaco Caniggia |
| Publisher | : John Wiley & Sons |
| Total Pages | : 552 |
| Release | : 2008-11-20 |
| Genre | : Science |
| ISBN | : 0470772883 |
Before putting digital systems for information technology or telecommunication applications on the market, an essential requirement is to perform tests in order to comply with the limits of radiated emission imposed by the standards. This book provides an investigation into signal integrity (SI) and electromagnetic interference (EMI) problems. Topics such as reflections, crosstalk, switching noise and radiated emission (RE) in high-speed digital systems are covered, which are essential for IT and telecoms applications. The highly important topic of modelling is covered which can reduce costs by enabling simulation data to demonstrate that a product meets design specifications and regulatory limits. According to the new European EMC directive, this can help to avoid the expensive use of large semi-anechoic chambers or open area test sites for radiated emission assessments. Following a short introduction to signalling and radiated interference in digital systems, the book provides a detailed characterization of logic families in terms of static and dynamic characteristic useful for modelling techniques. Crosstalk in multi-coupled line structures are investigated by analytical, graphical and circuit-based methods, and techniques to mitigate these phenomena are provided. Grounding, filtering and shielding with multilayer PCBs are also examined and design rules given. Written by authors with extensive experience in industry and academia. Explains basic conceptual problems from a theoretical and practical point of view by using numerous measurements and simulations. Presents models for mathematical and SPICE-like circuit simulators. Provides examples of using full-wave codes for SI and RE investigations. Companion website containing lists of codes and sample material. Signal Integrity and Radiated Emission of High-Speed Digital Systems is a valuable resource to industrial designers of information technology, telecommunication equipment and automation equipment as well as to development engineers. It will also be of interest to managers and designers of consumer electronics, and researchers in electronics.
| Author | : |
| Publisher | : |
| Total Pages | : 902 |
| Release | : 2008 |
| Genre | : Dissertations, Academic |
| ISBN | : |
