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Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications
Author: James J. Licari
Publisher: William Andrew
Total Pages: 415
Release: 2011-06-24
Genre: Technology & Engineering
ISBN: 1437778909

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Approx.512 pages Approx.512 pages


Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
Author: M O Alam
Publisher: Elsevier
Total Pages: 279
Release: 2011-05-25
Genre: Technology & Engineering
ISBN: 0857092898

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Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques


Coating Materials for Electronic Applications

Coating Materials for Electronic Applications
Author: James J. Licari
Publisher: William Andrew
Total Pages: 553
Release: 2003-06-11
Genre: Science
ISBN: 0815516479

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This first book in the Materials and Processes for Electronics Applications series answers questions vital to the successful design and manufacturing of electronic components, modules, and systems such as: - How can one protect electronic assemblies from prolonged high humidity, high temperatures, salt spray or other terrestrial and space environments? - What coating types can be used to protect microelectronics in military, space, automotive, or medical environments? - How can the chemistry of polymers be correlated to desirable physical and electrical properties? - How can a design engineer avoid subsequent potential failures due to corrosion, metal migration, electrical degradation, outgassing? - What are the best processes that manufacturing can use to mask, clean, prepare the surface, dispense the coating, and cure the coating? - What quality assurance and in-process tests can be used to assure reliability? - What government or industry specifications are available? - How can organic coatings be selected to meet OSHA, EPA, and other regulations? Besides a discussion of the traditional roles of coatings for moisture and environmental protection of printed circuit assemblies, this book covers dielectric coatings that provide electrical functions such as the low-dielectric-constant dielectrics used to fabricate multilayer interconnect substrates and high-frequency, high-speed circuits. Materials engineers and chemists will benefit greatly from a chapter on the chemistry and properties of the main types of polymer coatings including: Epoxies, Polyimides, Silicones, Polyurethanes, Parylene, Benzocyclobenzene and many others. For manufacturing personnel, there is an entire chapter of over a dozen processes for masking, cleaning, and surface preparation and a comprehensive review of over 20 processes for the application and curing of coatings including recent extrusion, meniscus, and curtain coating methods used in processing large panels. The pros and cons of each method are given to aid the engineer in selecting the optimum method for his/her application. As a bonus, from his own experience, the author discusses some caveats that will help reduce costs and avoid failures. Finally, the author discusses regulations of OSHA, EPA, and other government agencies which have resulted in formulation changes to meet VOC and toxicity requirements. Tables of numerous military, commercial, industry, and NASA specifications are given to help the engineer select the proper callout.


Adhesives Technology Handbook

Adhesives Technology Handbook
Author: Sina Ebnesajjad
Publisher: William Andrew
Total Pages: 337
Release: 2008-09-16
Genre: Technology & Engineering
ISBN: 0815516010

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Following the successful first, the second edition is a complete guide to all that is required to successfully bond materials. It is both a reference and a source for learning the basics for those involved in the entire product value chains. Basic principles of adhesion such as surface characterization, types of adhesive bonds, and adhesion failure topics are covered in addition to a description of common adhesive materials and application techniques. Provides the end user practitioners of adhesion technology with a complete guide to bonding materials successfully Covers most substrates, including plastics, metals, elastomers and ceramics, explaining basic principles and describing common materials and application techniques Arranges information so that each chapter can be studied selectively or in conjunction with others


Adhesive Bonding

Adhesive Bonding
Author: Walter Brockmann
Publisher: John Wiley & Sons
Total Pages: 433
Release: 2009-01-07
Genre: Technology & Engineering
ISBN: 3527318984

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Both solid knowledge of the basics as well as expert knowledge is needed to create rigid, long-lasting and material-specific adhesions in the industrial or trade sectors. Information that is extremely difficult and time-consuming to find in the current literature. Written by specialists in various disciplines from both academia and industry, this handbook is the very first to provide such comprehensive knowledge in a compact and well-structured form. Alongside such traditional fields as the properties, chemistry and characteristic behavior of adhesives and adhesive joints, it also treats in detail current practical questions and the manifold applications for adhesives.


Adhesives Technology Handbook

Adhesives Technology Handbook
Author: Sina Ebnesajjad
Publisher: William Andrew
Total Pages: 437
Release: 2014-11-26
Genre: Technology & Engineering
ISBN: 0323356028

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Covering a wide range of industrial applications across sectors including medical applications, automotive/aerospace, packaging, electronics, and consumer goods, this book provides a complete guide to the selection of adhesives, methods of use, industrial applications, and the fundamentals of adhesion. Dr Ebnesajjad examines the selection of adhesives and adhesion methods and challenges for all major groups of substrate including plastics (thermosets and thermoplastics), elastomers, metals, ceramics and composite materials. His practical guidance covers joint design and durability, application methods, test methods and troubleshooting techniques. The science and technology of adhesion, and the principles of adhesive bonding are explained in a way that enhances the reader's understanding of the fundamentals that underpin the successful use and design of adhesives. The third edition has been updated throughout to include recent developments in the industry, with new sections covering technological advances such as nanotechnology, micro adhesion systems, and the replacement of toxic chromate technology. Provides practitioners of adhesion technology with a complete guide to bonding materials successfully Covers the whole range of commonly used substrates including plastics, metals, elastomers and ceramics, explaining basic principles and describing common materials and application techniques Introduces the range of commercially available adhesives and the selection process alongside the science and technology of adhesion


Handbook of Adhesive Technology, Revised and Expanded

Handbook of Adhesive Technology, Revised and Expanded
Author: Antonio Pizzi
Publisher: CRC Press
Total Pages: 1060
Release: 2003-08-06
Genre: Science
ISBN: 9780203912225

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The Handbook of Adhesive Technology, Second Edition exceeds the ambition of its bestselling forerunner by reexamining the mechanisms driving adhesion, categories of adhesives, techniques for bond formation and evaluation, and major industrial applications. Integrating modern technological innovations into adhesive preparation and application, this greatly expanded and updated edition comprises a total of 26 different adhesive groupings, including three new classes. The second edition features ten new chapters, a 40-page list of resources on adhesives, and abundant figures, tables, equations.


Electrical Conductive Adhesives with Nanotechnologies

Electrical Conductive Adhesives with Nanotechnologies
Author: Yi (Grace) Li
Publisher: Springer Science & Business Media
Total Pages: 445
Release: 2009-10-08
Genre: Technology & Engineering
ISBN: 0387887830

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“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.


Adhesion Science and Engineering

Adhesion Science and Engineering
Author:
Publisher: Elsevier
Total Pages: 2020
Release: 2002-11-14
Genre: Science
ISBN: 0080525989

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The Mechanics of Adhesion shows that adhesion science and technology is inherently an interdisciplinary field, requiring fundamental understanding of mechanics, surfaces, and materials. This volume comprises 19 chapters. Starting with a background and introduction to stress transfer principles; fracture mechanics and singularities; and an energy approach to debonding, the volume continues with analysis of structural lap and butt joint configurations. It then continues with discussions of test methods for strength and constitutive properties; fracture; peel; coatings, the case of adhesion to a single substrate; elastomeric adhesives such as sealants. The role of mechanics in determining the locus of failure in bonded joints is discussed, followed by a chapter on rheology relevant to adhesives and sealants. Pressure sensitive adhesive performance; the principles of tack and tack measurements; and contact mechanics relevant to wetting and surface energy measurements are then covered. The volume concludes with sections on fibermatrix bonding and reinforcement; durability considerations for adhesive bonds; ultrasonic non-destructive evaluation of adhesive bonds; and design of adhesive bonds from a strength perspective. This book will be of interest to practitioners in the fields of engineering and to those with an interest in adhesion science.


Adhesive Materials for Electronic Applications

Adhesive Materials for Electronic Applications
Author: Dale W. Swanson
Publisher: Noyes Publications
Total Pages: 485
Release: 2003-01-01
Genre: Technology & Engineering
ISBN: 9780815514930

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The second title in the new interdisciplinary series for electronics engineers who work with polymers and materials engineers and polymer chemists who develop materials for electronics applications. Providing both theoretical foundations and practical data, coverage includes functions and requirements, chemistry and properties, bonding processes, reliability, and application specifications of adhesives and discusses epoxies, polyimides, silicones, polyurethanes, fillers, MCM, CSP, BGA, COB processes and more.