2017 Symposium on VLSI Circuits
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Release | : 2017 |
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ISBN | : 9784863486065 |
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Release | : 2017 |
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ISBN | : 9784863486065 |
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ISBN | : 9784863486140 |
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Release | : 2017 |
Genre | : Computers |
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Author | : Brajesh Kumar Kaushik |
Publisher | : Springer |
Total Pages | : 820 |
Release | : 2017-12-21 |
Genre | : Computers |
ISBN | : 9811074704 |
This book constitutes the refereed proceedings of the 21st International Symposium on VLSI Design and Test, VDAT 2017, held in Roorkee, India, in June/July 2017. The 48 full papers presented together with 27 short papers were carefully reviewed and selected from 246 submissions. The papers were organized in topical sections named: digital design; analog/mixed signal; VLSI testing; devices and technology; VLSI architectures; emerging technologies and memory; system design; low power design and test; RF circuits; architecture and CAD; and design verification.
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Release | : 2013 |
Genre | : Integrated circuits |
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Author | : Symposium on VLSI Circuits |
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Release | : 1995 |
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Release | : 2016 |
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ISBN | : 9781509006359 |
Author | : IEEE Staff |
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Release | : 2017-04-24 |
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ISBN | : 9781509039708 |
RF, analog and mixed signal circuits Sensors and interface circuits Digital circuits and ASIC CPU, DSP and multicore architectures Memory circuits and systems Low power logic and architectures Multimedia processing circuits Communication circuits Embedded systems and software Designs using novel technologies System in package design Electronic System Level Design Modeling and simulation Hardware software co design Logic and architecture synthesis
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Release | : 2017 |
Genre | : Computers |
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Author | : Katsuyuki Sakuma |
Publisher | : CRC Press |
Total Pages | : 217 |
Release | : 2018-04-17 |
Genre | : Technology & Engineering |
ISBN | : 1351779834 |
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.