Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download 2013 20th Ieee International Symposium On The Physical And Failure Analysis Of Integrated Circuits Ipfa PDF full book. Access full book title 2013 20th Ieee International Symposium On The Physical And Failure Analysis Of Integrated Circuits Ipfa.
| Author | : Institute of Electrical and Electronics Engineers (New York, NY). Nanjing Section |
| Publisher | : |
| Total Pages | : 773 |
| Release | : 2013-07-15 |
| Genre | : |
| ISBN | : 9781479904792 |
| Author | : |
| Publisher | : |
| Total Pages | : |
| Release | : 2013 |
| Genre | : Integrated circuits |
| ISBN | : 9781479912414 |
| Author | : |
| Publisher | : ASM International |
| Total Pages | : 540 |
| Release | : 2019-12-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1627082735 |
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
| Author | : |
| Publisher | : ASM International |
| Total Pages | : |
| Release | : 2017-12-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1627081518 |
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
| Author | : A. S. M. International |
| Publisher | : ASM International |
| Total Pages | : 561 |
| Release | : 2014-11-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1627080740 |
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
| Author | : Souvik Mahapatra |
| Publisher | : IEEE Computer Society Press |
| Total Pages | : 309 |
| Release | : 2007-01-01 |
| Genre | : Technology & Engineering |
| ISBN | : 9781424410149 |
| Author | : |
| Publisher | : |
| Total Pages | : |
| Release | : 2011 |
| Genre | : Integrated circuits |
| ISBN | : |
| Author | : |
| Publisher | : |
| Total Pages | : 363 |
| Release | : 2006 |
| Genre | : Electronic books |
| ISBN | : 9781509095957 |
| Author | : |
| Publisher | : |
| Total Pages | : |
| Release | : 2012 |
| Genre | : Integrated circuits |
| ISBN | : |
| Author | : |
| Publisher | : ASM International |
| Total Pages | : |
| Release | : 2018-12-01 |
| Genre | : |
| ISBN | : 1627080996 |
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
