EPEPS 2010
Author | : |
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Total Pages | : |
Release | : 2010 |
Genre | : Electronic packaging |
ISBN | : 9781424468669 |
Download EPEPS 2010 Book in PDF, ePub and Kindle
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download 2010 Ieee 19th Conference On Electrical Performance Of Electronic Packaging And Systems PDF full book. Access full book title 2010 Ieee 19th Conference On Electrical Performance Of Electronic Packaging And Systems.
Author | : |
Publisher | : |
Total Pages | : |
Release | : 2010 |
Genre | : Electronic packaging |
ISBN | : 9781424468669 |
Author | : IEEE Staff |
Publisher | : |
Total Pages | : 300 |
Release | : 2010 |
Genre | : Bioengineering |
ISBN | : 9781424468652 |
Author | : |
Publisher | : |
Total Pages | : 226 |
Release | : 2016 |
Genre | : Electronic packaging |
ISBN | : 9781509022724 |
Author | : |
Publisher | : |
Total Pages | : 314 |
Release | : 2011 |
Genre | : Electronic packaging |
ISBN | : 9781424494002 |
Author | : Aida Todri-Sanial |
Publisher | : CRC Press |
Total Pages | : 409 |
Release | : 2017-12-19 |
Genre | : Technology & Engineering |
ISBN | : 1351830198 |
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author | : Institute of Electrical and Electronics Engineers (New York, NY) |
Publisher | : |
Total Pages | : 269 |
Release | : 2013-10-27 |
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ISBN | : 9781479907083 |
Author | : |
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Total Pages | : |
Release | : 2013 |
Genre | : Electronic packaging |
ISBN | : 9781479907052 |
Author | : Institute of Electrical and Electronics Engineers (New York, NY) |
Publisher | : |
Total Pages | : 313 |
Release | : 2011 |
Genre | : |
ISBN | : 9781424493982 |
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Total Pages | : |
Release | : 1979 |
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Author | : Components, Packaging, and Manufacturing Technology Society |
Publisher | : |
Total Pages | : 313 |
Release | : 2011 |
Genre | : |
ISBN | : 9781424493999 |